09:00 – 09:30
Keynote
Chiplet Ecosystem Acceleration
The speaker will share the work of TSMC in Chiplet Ecosystem acceleration by following outlines.
Outlines:
- Forces Driving Chiplet and Integration
- Advanced CMOS Technologies
- Advanced Packaging Technologies
- Design Enablement and Ecosystem
K.C. Hsu
TSMC
Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. He possesses more than 30 years’ experience in the semiconductor industry.
Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University and his M.S. in Technology Management from National Chiao Tung University.
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
