• 14:40 – 15:00

The Sensorization of the Modern Vehicle

Vehicles have undergone remarkable changes over the last decades, with semiconductor sensor content increasing dramatically in recent years as more safety and comfort applications are implemented in today’s cars. These sensors need to fulfil their performance requirements whilst concurrently being able to meet stringent automotive reliability criteria – and achieve this in small form factors, adequate cost levels, and with fast time to market. This poses significant challenges to sensor packaging and testing facilities, especially when considering that sensor packages can differ significantly and the package itself is a major contributor to the sensor performance. In this presentation, we will look at how vehicles have evolved to become the collection of sensors they are today, discuss some of the key sensor applications and package structures used for said applications, and give some perspective of packaging trends observed for the next generation of automotive sensors.

Alastair Attard

Director of Technical Program Management & Business Development

UTAC

Alastair Attard is Director of Business Development at UTAC Group. He has a Bachelor’s degree in Mechanical Engineering and an Executive MBA from the University of Malta, and has over 18 years of experience in the assembly & test of semiconductor devices.

Prior to joining UTAC, Alastair worked at STMicroelectronics firstly as part of the process engineering team for flip chip and SiP, and later in process and package development for MEMS packages. He later joined Besi, where he was manager of the process development group, with focus on advanced die attach and pick & place technologies.

Alastair joined UTAC in 2018, focusing on technical program management and assembly business development in the European region. Today he is responsible for worldwide business development of assembly and test solutions for semiconductor devices at UTAC with particular focus on MEMS, Sensing, and Advanced Packaging.

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UTAC is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end-use applications including communication, consumer, computing, automotive, security, industrial and medical. Our customers include fabless companies, integrated device manufacturers and wafer foundries.

UTAC is headquartered in Singapore with more than 12 production facilities. Our global sales network is widely focused on five regions: the United States, Europe, China and Taiwan, Japan and the rest of Asia with sales offices located in each of these regions.

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