14:25 – 14:45
Test Challenges in the AI & Chiplet era
This presentation will highlight challenges and current thought process for all facets such as DFT, Test, Qual and HVM during the product definition phase for successful silicon bring up and release to high volume production of High performance, Hyper scalar AI enhanced chips.
Srini Chinamilli
Tessolve
Srini Chinamilli is the Co-founder and CEO of Tessolve. He has more than 25 years of experience in semiconductor Test and Product engineering and held management and technical positions at Cirrus Logic and Centillium communications prior to co-founding Tessolve. Under his leadership, Tessolve has evolved to be the largest standalone semiconductor engineering solutions company, with over 3200 employees across 10 countries worldwide.
Tessolve
Company Profile
Tessolve is a leading semiconductor & systems engineering services company founded in 2004. With a global presence and over 3,200 employees, they support major technology companies. Tessolve offers a wide range of services including ASIC design, chip design, test engineering, complex PCB design, and embedded systems design. Their focus on emerging areas like AI, hyperscalars, semiconductor design and testing, avionics and automotive solutions helps clients bring high-quality products to market faster and more cost-effectively.
