• 14:25 – 14:45

Test Challenges in the AI & Chiplet era

This presentation will highlight challenges and current thought process for all facets such as DFT, Test, Qual and HVM during the product definition phase for successful silicon bring up and release to high volume production of High performance, Hyper scalar AI enhanced chips.

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Srinivas Chinamilli photo

Srini Chinamalli

Co Founder & CEO

Tessolve

Srinivas Chinamilli is the CEO and Co-founder of Tessolve. He has more than 25 years of experience in semiconductor Test and Product engineering and held management and technical positions at Cirrus Logic. He worked as the Director of Worldwide Test engineering at Centillium Communications prior to joining Tessolve. He has extensive experience in the area of Mixed Signal and System on Chip test development, high volume production test and offshore test subcontractor management.

He has received his B.E. (Electrical and Electronics) from Birla Institute of Technology and M.S. in Electrical engineering from the University of Southern California.

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Tessolve is a leading semiconductor & systems engineering services company founded in 2004. With a global presence and over 3,000 employees, they support major technology companies. Tessolve offers a wide range of services including chip design, test engineering, complex PCB design, and embedded systems design. Their focus on emerging areas like AI, hyperscalars, semiconductor design and testing, avionics and automotive solutions helps clients bring high-quality products to market faster and more cost-effectively.

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