The development of semiconductor IC follows Moore’s law. Today, it has encountered great challenges, whether it’s the physical size limit or the advanced manufacturing process with huge investment costs ,and so on have formed huge pressure on the industry. Packaging is considered to be the focus of continuing semiconductor chip integration in the next decade development direction, especially in the 2.5D, 3D packaging technology brought by the chiplet concept; We see that wafer factories have made faster progress in 2.5D and 3D packaging, What are their opportunities for OSAT? What challenges will it face?