• 14:00 – 14:20

The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

Gayn Erickson, CEO of Aehr Test Systems, to discuss the need to identify early “infant mortality” failures and the importance of Stabilization Stress and Burn-In during the production of Wide Bandgap (WBG) Semiconductors. Areas of focus will include what types of stress and burn-in conditions are used to accelerate extrinsic / early life failures and to stabilize threshold voltages of high power silicon carbide MOSFETs and why this is needed. Mr. Erickson will also discuss the impact of the transition from single die Packages to multi-die modules on the test and burn in production flows and equipment.

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Gayn Erickson photo

Gayn Erickson

President & CEO

Aehr Test Systems

Gayn Erickson is Chief Executive Officer & President of Aehr Test Systems (Nasdaq: AEHR) in Fremont, California, a world leader in Semiconductor Test and Burn-in solutions. Prior to this, Gayn was Executive Vice President of Verigy, Inc. and Agilent Technologies, with responsibility for their Memory Test Business Units. He has over 35 years of experience in the Semiconductor Capital Equipment market. With very high market and technology domain knowledge in defining, developing, manufacturing, and marketing semiconductor capital equipment solutions, Gayn has led the definition and development of over a dozen semiconductor test and burn-in systems and solutions at Hewlett-Packard, Agilent Technologies, Verigy, and Aehr Test Systems. Gayn received a BSEE degree from Arizona State University

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Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader.

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