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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

Recently, there has been a big demand for power semiconductors due to latest macroeconomic technology trends like electrification (EVs) and carbon footprint reduction (clean source of energy). Among the available power semiconductors materials, there is a strong interest towards wide bandgap semiconductors (WBG) like silicon carbide (SiC) and gallium nitride (GaN) in various applications due to their inherent material properties. There are several benefits for wide bandgap materials over traditional Si devices in terms of better electrical & thermal performance, and compactness. Device makers have come up with novel device structures to maximize the benefit out of these materials and reduce the fabrication costs, thereby demanding more rigorous processing capabilities. Thin film deposition is a key element in the value chain of WBG power device fabrication.

As a leading thin film powerhouse, Evatec offers several thin film solutions for this purpose like a.) Ohmic contact (backside & frontside) and Schottky contact formation, b.) frontside protection, c.) thin wafer handling, and d). trench filling. We offer solution using amorphous carbon layers for protection on the frontside surface to withstand high thermal budget during implant activation in silicon carbide devices. Our systems include necessary hardware solutions to handle thin wafers (robot handlers, chuck etc.,) used by several WBG power device makers. In addition, we also offer enhanced solutions to cover the frontside with thin barrier and thick aluminum layers, generally required in devices with high topography to achieve planar surface on power devices.

Dr. Vinoth Sundaramoorthy photo

Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

Dr. Vinoth Sundaramoorthy has completed his PhD in Semiconductors devices from the University of Nottingham, UK and Executive MBA in General Management from Executive Business School, University of St Gallen.

He has extensive experience in the semiconductor field for over 18 years that includes hand on experience in power semiconductors and related applications development. In his previous job at ABB Switzerland, he was involved in the product development of various power semiconductor devices and managed several semiconductor related global projects for different business units. He is a senior member of IEEE and recipient of awards in semiconductor field.

Currently, he is working as Product Marketing Manager at Evatec AG in Switzerland. He is responsible for the managing and leading the product portfolio of Evatec for ‘power devices’ market segment.

Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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