• 17:15 – 17:20

Thinfilm Technology for Heat Dissipation Layers in HPC Applications

HPC (High Performance Computing) is a powerful tool that can be applied to solve intricate problems and overcome obstacles in diverse areas such as life science , environmental sciences, industrial and finance. To achieve high computing power, cutting-edge system-on-chips (SOCs) or next generation advanced packaging technologies are utilized to integrate processors, memory, and storage either on a die or package level. However, a critical hurdle in this process is effectively managing heat to preserve computing performance and power efficiency. In this context, we will discuss the challenges and present latest progress in thin film deposition of a solderable layer stack deposition on the wafer backside (BSM) to allow a perfect, reliable connection to the thermal interface material (TIM) foil. This back side metal (BSM) layer stack has not only to meet excellent adhesion and solderability, but also minimum film stress requirements and compatibility to tight process temperature restrictions of molded substrates.

Ralph Zoberbier photo

Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging

Evatec

After completing his first degree in applied sciences, Ralph completed his MBA in 2006 and gained over 20 years experience in the semiconductor equipment business across roles in engineering, product management and global business and sales management before joining Evatec in 2019 as Head of BU Advanced Packaging. In addition to thin film technology, his technical expertise covers areas including lithography and ECD for both wafer and panel level applications.

Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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