Tim Yeh holds a Ph.D. in Electrical Engineering from National Central University in Taiwan and serves as a member of the Executive Advisory Committee of the International Semiconductor Executive Summit (ISES China). He has long been engaged in the research and industrialization of compound semiconductor materials and devices, with 25 years of industrial R&D experience, particularly in the field of third-generation semiconductor materials and devices. He is well-versed in the design and industrial manufacturing of compound semiconductor devices.

Dr. Ye has previously worked as a researcher at the Telecommunication Laboratories of Chunghwa Telecom in Taiwan and served as a technical director for a publicly listed company in Taiwan. His research achievements have led to the granting of more than 30 patents across the United States, Japan, Mainland China, and Taiwan, and he has published over 70 papers in international journals. He has led or participated in several major projects under China’s Ministry of Science and Technology and key national R&D programs.

He currently serves as the Technical Director at Hunan Sanan Semiconductor, where he is responsible for the R&D and mass production integration of compound semiconductor power electronic devices. He has successfully established a full industrial chain production line for third-generation semiconductor power electronic devices, covering the entire process from epitaxy to device fabrication.

叶念慈，台湾中央大学电机工程博士，国际半导体高管峰会 (ISES China）执行顾问委员会成员，长期从事化合物半导体材料和器件研究及产业化，特别是在 第三代半导体材料和器件 领域拥有 25 年的产业研发经验，精通化合物半导体器件设计和产业化制造。曾先后任台湾中华电信公司电信研究所研究员及台湾上市公司技术负责人。研究成果获美国、日本、中国大陆和台湾地区专利授权30 余件，发表国际期刊论文 70 余篇，曾作为项目或课题负责人参与数项国家科技部重大专项和国家重点研发计划项目。现担任湖南三安半导体技术总监，负责 化合物半导体功率电子器件研发与量产导入，成功打造从外延到器件全产业链 第三代半导体功率电子器件产线。