17:00 – 17:10

TOPPAN’s Challenge in Advanced Semiconductor Packaging

(Language: Japanese, English interpretation provided) 

TOPPAN has been active in the FC-BGA business for over 20 years, and particularly in the communication infrastructure sector,such as base stations, where the high-speed transmission characteristics—our core strength—are utilized, and we have accumulated solid experience through continuous use by many customers. Now, driven by the explosive demand of the AI market, semiconductors are strongly required to achieve further enhanced performance and higher integration.With the foresight to recognize this market requirement and change, TOPPAN meets the challenge with our proprietary technology.Specifically, by maximizing the advantages of glass materials and offering next-generation package items based on this as a core technology, we realize solutions that resolve the performance challenges of the rapidly developing AI market.

Akihiko Furuya

Executive Officer, Head of Semiconductor Subdivision, Electronics Division

TOPPAN