27-28 August 2025
Suwon
09:40 – 10:00
Welcome Speech
Salah Nasri
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
International Semiconductor Industry Group (I.S.I.G.)
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Joshua Yoo
Core Insight, Inc.
Yong Hoon (Joshua) Yoo has been involved in the static control industry since 1994 for ionization, ESD measurement and high voltage power business operation in semiconductor, flat panel displays and automotive industry. He has been a member of EOS/ESD Association since 2000 and served as an Elected Board of Director in 2016 – 2018. He is the founder and president of Korea EOS/ESD Association since 2011. He is a member of Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He is serving industry as Korea President of International Semiconductor Executive Summits (ISES) since 2024.
He started his volunteering activities on EOS/ESD Association since 2013 as an active working group members and technical program committee members of annual symposium for multiple events of ESD Association. With his leadership, Korea EOS/ESD Association very strongly presents and annual events over 10 years. He is pioneer for flat panel display (FPD) static issue analysis and resolved problems. In recently, he found a root cause of ESD yield losses in AI chip manufacturing environment and improved yield over double digits.
He is an iNARTE certified ESD Engineer in 2007 and the EOS/ESD Association certified Professional ESD Program Manager in 2011. He has 14 patents for ionization system and ESD testing technologies.
Core Insight, Inc.
Company Profile
Core Insight is a leading company for EOS/ESD control with technical expertise and key insights for Advanced Package Device application. Heterogeneous Integration technology revolutionary achieved new device era. This new technology also brought new challenges that much less ESD sensitivity before it finished package device. Core Insight has prepared to meet new level of ESD control with world best ionization solution which no one else have. Core Insight has understanding device technology, manufacturing process and ESD control know-how for Advanced Package Device handling.