• 07:30 – 08:30

Registration

  • 07:30 – 08:30

Registration

  • 07:45 – 08:35

Registration

  • 08:00 – 08:50

Registration

  • 08:00 – 08:10

Welcome Speech

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Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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  • 08:00 – 08:30

Keynote

Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications

With the passage and signing of the CHIPS and Science Act of 2022, companies in and adjacent to the semiconductor industry are working on plans to help revitalize domestic manufacturing, develop the workforce, strengthen American supply chains, and accelerate the technologies of the future. During this keynote talk, SkyWater President and CEO Thomas Sonderman will talk about how a company like SkyWater can address the challenges of bringing chip manufacturing back to the U.S., invest in opportunities for supply chain certainty and security and enable nimble new innovations that can be accelerated with CHIPS funding to lead the next wave of computing.

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Thomas Sonderman photo

Thomas Sonderman

President & CEO

SkyWater Technology

Thomas Sonderman is the president and CEO of SkyWater Technology, a U.S.-owned and operated pure-play semiconductor manufacturer and a DOD-accredited Trusted supplier. He joined SkyWater in 2017 as the lead executive, driving the company’s successful business transformation from an IDM to a pure play foundry. He has effectively diversified SkyWater’s customer base by defining new product markets and target customers while simultaneously improving operational efficiencies. Mr. Sonderman has leveraged SkyWater’s U.S-based manufacturing operations to expand the company’s government business and to focus on reinstating a strong domestic commercial manufacturing presence. He has built a world class leadership team that inspires over 500 employees to deliver process R&D innovation and operational excellence.

Mr. Sonderman’s extensive industry experience in all aspects of fab operations has delivered market leadership and increased shareholder value to high-technology industry leaders Rudolph Technologies, Globalfoundries and AMD. Notably, he played a critical role serving as part of an executive team at AMD that spun-off manufacturing operations to form Globalfoundries.

A widely recognized subject matter expert, Mr. Sonderman is the author of 50 patents and a highly sought-after industry speaker. He received a Bachelor of Science degree in chemical engineering from Missouri University of Science Technology and a Master of Science degree in electrical engineering from National Technological University.

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SkyWater (NASDAQ: SKYT) is a U.S.-owned semiconductor manufacturer and a DOD-accredited Trusted supplier. SkyWater’s Technology as a Servicesm model streamlines the path to production for customers with development services, volume production and advanced packaging solutions in its world-class U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology with diverse categories including mixed-signal CMOS, read-out ICs, rad-hard, power discretes, MEMS, superconducting ICs, photonics, carbon nanotubes and interposers. SkyWater serves growing markets including aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial and loT. For more information, visit: www.skywatertechnology.com.

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  • 08:00 – 08:40

Registration

  • 08:00 – 08:50

Registration

  • 08:00 – 09:00

Registration

  • 08:10 – 08:30

Greater Phoenix: A Global Destination for Industrial Innovation

Greater Phoenix is home to an ever-expanding ecosystem of semiconductor manufacturing and its supply chain. Long-term strategic planning of resources at the state and regional level have supported this growth, ensuring that adequate water and nation-leading grid reliability meet the needs of industry. Paired with a robust workforce and an educational system anchored by Arizona State University and the Maricopa County Community College District, the region has the requisite labor force to meet the needs of key industry sectors. Greater Phoenix is a top global destination for businesses and uniquely positioned to seize the momentum of technological innovation and advanced industry to support future development.

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Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

Chris Camacho serves as president & CEO of the Greater Phoenix Economic Council (GPEC), one of the longest-standing public-private partnerships for economic development across the country. As chief executive, Chris leads the development and execution of the region’s strategic economic strategy, oversees domestic and international business development, and ensures the market position remains competitive through coordination with partner organizations, private sector leaders, and municipal and state leadership. GPEC has attracted more than 540 companies during his tenure, creating more than 100,000 jobs and $56.8 billion in capital investment. Some notable projects include TSMC, Apple, LG Energy Solutions, Microsoft, GoDaddy, Amazon, Garmin, General Motors, HelloFresh, KORE Power, Williams-Sonoma and headquarters including Benchmark Electronics, Carlisle Companies, Rogers Corporation and EMD Electronics. In October 2021, Chris led GPEC to being recognized as the top economicdevelopment organization globally by the International Economic Development Council a year after being named the top EDO in the U.S. in 2020.

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Established in 1989, the Greater Phoenix Economic Council (GPEC) actively works to attract and grow quality businesses and advocate for the competitiveness of Greater Phoenix. As the regional economic development organization, GPEC works with 22 member communities, Maricopa County and almost 200 private investors to accomplish its mission, and serve as a strategic partner to companies across the world as they expand or relocate. Consistently ranked as a top national economic development organization, GPEC’s approach to connectivity extends beyond the fabric of the community. Known as The Connected Place, Greater Phoenix is in a relentless pursuit of innovative and entrepreneurial technology-focused companies that are committed to changing the game. As a result, over the past 32 years GPEC has fueled the regional economy by helping more than 895 companies, creating more than 163,000 jobs and $33.4 billion in capital investment.

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Zachary Holman, Ph.D.

Associate Professor and Director of Faculty Entrepreneurship

Arizona State University

Zachary Holman is an Associate Professor in the School of Electrical, Computer, and Energy Engineering at Arizona State University, as well as the Director of Faculty Entrepreneurship within the Fulton Schools of Engineering. He received his Ph.D. in Mechanical Engineering from the University of Minnesota for his work on plasma-synthesized silicon and germanium nanocrystals, after which he spent two years as a postdoctoral researcher developing high-efficiency silicon solar cells at Ecole Polytechnique Fédérale de Lausanne in Switzerland. His research group at ASU focuses on new materials, processes, and device designs for high-efficiency silicon solar cells and silicon-based tandem solar cells. He has been named a Moore Inventor Fellow, Trustees of ASU Professor, Fulton Entrepreneurial Professor, and Joseph C. Palais Distinguished Faculty Scholar. He is the co-founder of two solar start-up companies (Sunflex Solar and Beyond Silicon) and an advanced materials start-up company (Swift Coat).

Education
  • Ph.D. Mechanical Engineering, University of Minnesota 2010
  • B.A. Physics, Reed College 2005
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With 110,000+ undergraduate students, 30,000+ graduate and professional students, and 5,000+ faculty, Arizona State University (ASU) exemplifies a new prototype for the American public research university. At ASU, our culture of innovation and inclusion draws pioneering researchers to our faculty and attracts highly qualified students from all 50 states and more than 130 nations. ASU is expanding academic and entrepreneurial opportunities for every type of learner at all stages of life. Creating a resilient microelectronics innovation ecosystem is critical to America’s security and economic competitiveness. Arizona State University is responding to this need by working with industry and government partners to reestablish America’s capacity for domestic microelectronics and semiconductor manufacturing and innovation. ASU offers traditional degree programs and rapid, low-cost options for upskilling and re-skilling of the existing semiconductor workforce, as well as workers from outside the industry.

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Darcy Renfro

VP External Relations, Community, Government & Economic Development

Maricopa County Community College District

Darcy Renfro is Vice Chancellor of Community, Government Relations, & Economic Development for the Maricopa County Community College District (MCCCD). She oversees workforce and economic development strategies for MCCCD and advises the Chancellor on government and community affairs. MCCCD is one of the largest community college systems in the nation serving approximately 200,000 students and nearly 10,000 faculty and staff members across 10 colleges in the metropolitan Phoenix area. As part of the Chancellor’s executive team, Ms. Renfro is helping to lead the Maricopa Transformation to fundamentally transform the student experience to meet the education and employment needs of the community.

Prior to her current role, Ms. Renfro served as the policy advisor to Governor Janet Napolitano for workforce, economic development, and higher education, and was founding Director of The Arizona We Want Institute at the Center for the Future of Arizona where she was responsible for strategic direction and development of a series of “Progress Meters” to establish clear metrics for Arizona in achieving its citizens’ goals. She previously worked as the founding Director of the Arizona STEM Education Network at Science Foundation Arizona.

Ms. Renfro is a licensed attorney in Arizona and has practiced at the Phoenix offices of Fennemore Craig, P.C. Prior to law school, she worked on Capitol Hill for U.S. Senators Dennis DeConcini (AZ) and Howard Metzenbaum (OH).

Ms. Renfro is a native of Tucson and received both her undergraduate and Juris Doctor Degrees from the University of Arizona.

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  • 08:15 – 08:45

Registration

HETEROGENEOUS INTEGRATION THROUGH ADVANCED PACKAGING

  • 08:30 – 09:00

Keynote

Advanced Packaging Ecosystem

Advanced packaging architectures are today widely acknowledged as being increasingly important to drive performance and cost improvements of microelectronics systems. This trend is set to continue as on-package heterogeneous integration of diverse IP from multiple process nodes and multiple foundries will enable new product concepts, decrease time to market and deliver cost/yield benefits. Additionally, novel 3D architectures and continued die-to-die interconnect scaling are opening previously un-achievable concepts for die partitioning and on-package capability integration. These technical challenges are requiring solutions across the ecosystem (Die/Package/Board/System) which provide opportunities for groundbreaking innovation. This presentation will highlight some of the key challenges the industry will have to jointly address to enable the 3D heterogeneous integration future, such as drivers in interconnect scaling, advanced substrate developments, and technologies to enable power and performance gains. A specific example of this is optical on-package integration, where Intel is taking an aggressive approach to enable highly scalable and manufacturable solutions with applicability beyond niche designs.

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Dr. Babak Sabi

SVP & GM Assembly and Test Technology Development

Intel

Dr. Babak Sabi is a Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development.

Babak joined Intel in 1984. Prior to leading ATTD, he oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.

Babak received his Ph.D. in solid state electronics from Ohio State University in 1984. He has authored ten papers on reliability physics and has received five Intel Achievement Awards. He currently holds two patents.

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Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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  • 08:30 – 08:55

Registration

  • 08:30 – 09:30

Registration

  • 08:30 – 09:00

Keynote

Advancing The Memory Solutions Roadmap To Enrich Our Multi-Dimensional World For Generations To Come

A memory and storage hierarchy evolution is unfolding before us. Homogenous data centers that met our needs in the past, will not meet our future needs.

We must look to heterogenous solutions that require an expansion of the current memory hierarchy, and ultimately, a convergence of memory and storage.

Conventional scaling must continue, while disruptive 3D, and other advanced solutions will emerge to move us into the next few decades of memory advancement.

Advanced Packaging solutions will play a critical role in this expanded hierarchy, but to achieve this monumental shift, the collaboration, knowledge-sharing, and

innovation our industry has relied on to extend Moore’s Law over the past decade must now push the boundaries, to move the packaging supply chain to a front-end like model.

At the same time, we must keep focus on more sustainable and cost-effective solutions while building a strong talent-based workforce to support long-term growth.

We face many near-term challenges to enable this new ecosystem, but if successful, our industry will emerge with a longer-term roadmap that impacts and enriches lives for generations to come.

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Naga Chandrasekaran

SVP Technology Development

Micron Technology, Inc.

Naga Chandrasekaran is senior vice president of technology development at Micron Technology. Dr. Chandrasekaran leads Micron’s global technology development and engineering efforts related to the scaling of current memory technologies, advanced packaging technology, as well as investigating emerging memory technology solutions to support Micron’s future requirements. He also manages mask technology development, corporate characterization labs, advanced modeling and data analytics, and R&D fabrication operations at Micron’s headquarters in Boise, Idaho. He was appointed to his current position in 2019.

In 2001, Dr. Chandrasekaran joined Micron as a CMP development engineer and since then has held a series of positions of increasing responsibility in process and equipment development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED and display technology. From 2007 to 2008, he also served as fab engineering manager for IM Flash, Singapore Operations. He most recently served as senior vice president of process research and technology development.

Dr. Chandrasekaran has authored several keynote publications and patents, and he has served as an invited panel speaker at several conferences. He has also received several awards, including Jiri Tlusty Outstanding Young Manufacturing Engineer of the Year, awarded by the Society of Manufacturing Engineers in 2003, and Engineering Manager of the Year, awarded by the American Society of Engineering Management (ASEM) in 2018.

Dr. Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras. He earned both a master’s and a doctorate degree in mechanical engineering from Oklahoma State University and dual executive MBAs from the University of California, Los Angeles (UCLA-Anderson School of Management) and the National University of Singapore.

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Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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  • 08:40 – 09:00

Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

Recent advancements in Large Language Models (LLMs) and Generative Artificial Intelligence (Generative AI) have presented an exciting opportunity for developers, as exemplified by ChatGPT, which can mimic human dialogue and decision-making. However, the tremendous computing power and energy consumption required by the hardware implementing these models pose a considerable cost and challenge, due to a huge number of parameters and complex neural network architecture.

This talk will explore the potential of designing more efficient hardware for deployment and inference of large language models, from an integrated circuit (IC) hardware perspective. Possible methods of AI model compression, such as quantization, pruning or knowledge distillation will be covered as well as AI chip design based on Computing-in-Memory (CIM), Deep-Learning Accelerator (DLA) and Chiplets. This talk will also discuss the hardware and software co-design methodology and tools needed for improving the design quality and productivity.

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Dr. Ming-Der Shieh photo

Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

Ming-Der Shieh received the B.S. degree in electrical engineering from National Cheng Kung University, Taiwan, in 1984, the M.S. degree in electronic engineering from National Chiao Tung University, Taiwan, in 1986, and the Ph.D. degree in electrical engineering from Michigan State University, East Lansing, in 1993. From 1988 to 1989, he was an engineer at United Microelectronic Corporation, Taiwan. After receiving the Ph.D. degree, he joined the Department of Electronic Engineering, National Yunlin University of Science & Technology (NYUST). Since 2002, he has been with the Department of Electrical Engineering, National Cheng Kung University (NCKU), where he is currently a professor. His research interests include VLSI design and testing, VLSI for signal processing, and digital communication.

Dr. Shieh was the Chairman of EE Department at NYUST (1999-2002) and NCKU (2014-2017), and Dean of Miin Wu School of Computing at NCKU from 2021-2022. He also served as the Deputy General Director of Information and Communications Research Laboratories (ICL) at Industrial Technology Research Institute (ITRI) from 2010 to 2014, and was an Adjunct Research Fellow at the Office of Science and Technology, Executive Yuan, Taiwan from 2017 to 2019. In addition, he served as the Chairman of Taiwan IC Design Society (TICD) (2016-2018), Associated Editor of IEEE Transactions on Circuits and Systems – Part I (2010~2012), and General Chair/Program Chair/Technical Committee Member of several international conferences. Currently, as the Chief Technology Officer of Electronic and Optoelectronic System Research Laboratories (EOSL) at ITRI, he is responsible for strategic planning and cross-disciplinary collaboration. He is in charge of the IC research and development in EOSL, particularly in the area of AI chip design from different aspects, heterogeneous chiplet design and integration, and automotive IC designs.

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ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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  • 08:40 – 09:00

Welcome Speech

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Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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  • 08:45 – 09:00

Welcome Speech

Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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  • 08:50 – 09:00

Welcome Address

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Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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MARKET PULL AND TECHNOLOGY PUSH IN A VARIETY OF WBG APPLICATIONS

EV Opportunities and What it Means for the Semiconductor & Sensors Industry

Metaverse Session

  • 09:00 – 09:30

Keynote

Unleash Product Innovations with 3DFabric

With the development of 3DIC and associated packaging technologies, semiconductor industry has extended performance and density optimization to system level, complementary to traditional chip scaling. Amid broader adoption of TSMC’s advanced 2.5D/ 3D packaging solutions along with growing chiplet complexity and form factor, the interaction between Si, packaging and components become increasingly crucial and requires continue innovations on design, process development and manufacturing.

With 3DFabric Alliance, we are extending OIP collaboration to packaging/ testing and working with industry partners on substrate and memory technology development for integrated system-level design solution to customers, together with the ecosystem of OSATs, material and equipment suppliers. In parallel, we also establish the worldwide first fully automated factory to offer best flexibility for our customers to optimize their packaging solution with better cycle time and quality control.

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Dr. Jun He photo

Dr. Jun He

VP Quality & Reliability, Advanced Packaging Technology & Service

TSMC

Dr. Jun He is Vice President of Quality & Reliability as well as Advanced Packaging Technology & Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management. Within the Q&R scope, his function covers incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Besides overseeing all TSMC advanced packaging and testing manufacturing, his backend team is also accountable for key building blocks including bump/passivation/RDL process innovations and test technology development. Seamless collaboration and joint development with external partners across material, OSAT and substrate supply chain is one of his focus areas to enable customers’ product innovations at system level.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations.

Dr. He holds over 40 patents globally and published 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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  • 09:00 – 09:15

Welcome Speech

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Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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  • 09:00 – 09:25

Keynote

Zero Emission Becomes Real in Next-Generation Mobility

The European Union intends to cut greenhouse gas emissions by at least 55% by 2030 and has the goal be climate-neutral by 2050. Passenger cars and vans are collectively responsible for around 15% of total EU emissions of CO2. To meet the 2050 climate goal, road transport CO2 emissions would then have to decline more than three times as quickly (5.5% per year) from 2035 to 2050. Can such ambitious vehicle CO2 targets of the European Union and also those of other countries be achieved?

CS Chua will discuss the contribution of semiconductor companies to enable next-generation zero-emission mobility. Using electric vehicles, he explains how it is technically feasible to meet CO2 targets for vehicles while also meeting other crucial factors, such as extension of vehicle range, improvement of charging speed and the availability of a reliable charging infrastructure – with electricity from renewable energy sources. He discusses the market prospects for electric vehicles from 2023 to 2030 and the mix of semiconductor materials such as silicon, silicon carbide (SiC) and gallium nitride (GaN) used during this period.

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CS Chua photo

CS Chua

President & Managing Director

Infineon Technologies AG

CS Chua oversees regional sales, marketing and distribution, supply chain, R&D, and manufacturing. He is also responsible for strategy, quality management, human resources, and communications for the Asia Pacific region with local presence in Australia, India, Indonesia, Korea, Malaysia, Philippines, Thailand, and Vietnam. He has held the current role since 2017. CS joined Infineon in 2000 and has taken on roles in product marketing for industrial microcontrollers and regional marketing covering Asia Pacific’s automotive electronics segment. Previously as the Vice President of Automotive Regional Centre. CS has a Bachelor of Electrical and Electronics Engineering degree from the Nanyang Technological University in Singapore.

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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  • 09:00 – 09:30

Keynote

How The Semiconductor Industry Is Poised to Enable The Metaverse

The Metaverse is the next evolution in social technologies and the successor to the mobile internet. But what is the role of the semiconductor industry in facilitating the Metaverse? And why should semiconductor companies invest in this field? What new experiences and value will users get from such investments? In this talk, we will discuss these questions and a point of view on the answers. We will explore some key enabling technologies for Augmented Reality and Virtual Reality. These technologies will actualize the Metaverse vision and will usher in a new paradigm of human-computer interaction. We believe these technologies will also fuel the next two decades of semiconductor innovation.

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Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

Dr. Shacham is Vice President, Head of Silicon, at Meta Reality Labs. He takes pride in building a vertically integrated Silicon organization from the ground up. Shacham works to constantly redefine what is possible with custom silicon, and in turn how humans and computers interact. To co-design hardware-software systems in order to give the world seamlessly blended virtual and real experiences.

Before Meta, Shacham worked for Google leading Silicon Design and Implementation for Consumer Hardware. Shacham initiated and led Google’s Pixel Visual Core & Pixel Neural Core, from idea to deployment on all Pixel Phones. Shacham also led some generations of Titan security chip, the early phases of the Pixel 6 Tensor Chip, and more.

Shacham joined Google as part of Google’s acquisition of Chip Genesis–a company he co-founded as a spin-out of the research he led at Stanford. Before Stanford Shacham worked for IBM R&D labs in Israel. Shacham also served in an elite Israeli Navy Unit.

Ofer Shacham holds a BSc degree from Tel Aviv University, and MSc and PhD degrees from Stanford University where he also served as academic staff. Dr. Shacham is a highly cited author for dozens of patents and scientific papers. Areas of interest are research, development and productization of outstanding research where hardware and software meet under strict power, form factor, and performance requirements.

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Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.

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  • 09:00 – 09:40

MEMS Panel Discussion

Moderator
Dimitrios Damianos Ph.D. photo

Dimitrios Damianos Ph.D.

Project Manager, Consulting Services Division

Yole Intelligence

Dimitrios Damianos, Ph.D., is a Project Manager in the Consulting Services Division at Yole Intelligence, part of Yole Group.

He manages transverse consulting projects, ensuring their quality and maintaining long term relationships with key accounts within the semiconductor industry.

Dimitrios has been with Yole since 2018, evolving through various analyst/consultant roles and is the author of numerous technical, business and market analyses covering imaging, sensing and photonics while actively played a key role in the expansion of Yole’s market & technical knowledge and the development of strategic projects.

Dimitrios holds a BSc in Physics and MSc in Photonics, as well as a PhD. in optics & microelectronics.

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Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.

With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.

Yole Group benefits from an international sales network. The company now employs more than 180+ people.

More information on www.yolegroup.com.

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Panelist
Anton Hofmeister photo

Anton Hofmeister

Group Vice President – General Manager R&D and Strategy

STMicroelectronics

Anton Hofmeister is Group Vice President and General Manager of R&D and Strategy for ST’s Analog and MEMS Sub-Groups and has held this position since December 2021. He has also served as Managing Director of ST’s German subsidiary since 2016.

Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) as a marketing engineer in 1986. He subsequently held management positions in product marketing, key account management, and corporate strategic marketing.

In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became Director of the Print Head Business Unit in 2000. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Microactuator Division in 2015, managing ST’s Fluidic MEMS products and MEMS components used in a variety of applications in Consumer Electronics, Industrial, Medical, and Printing markets.

Hofmeister has previously served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. In August 2021 he joined the Governing Council of the MEMS&Sensor Industry Group (MSIG) at SEMI.

Anton Hofmeister was born in Munich in 1961 and he graduated with a Master’s degree in Engineering from the University of Munich.

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At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. We are committed to achieving our goal of becoming carbon neutral by 2027. Further information can be found at www.st.com.

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Dr. Gunar Lorenz

Sr Director Technical Marketing and Application Engineering for Consumer Sensors

Infineon Technologies AG

Dr. Gunar Lorenz is currently heading the technical marketing and application engineering for consumer sensors at Infineon Technologies. Gunar joined Infineon in 2016 as system project manager responsible for Infineon’s first open market MEMS microphone. Prior joining to Infineon he worked as director of system-level simulation at Coventor, where he and his group invented and developed Coventor’s MEMS/IC co-simulation design environment MEMS+. The original ideas for MEMS+ are embodied in his PhD carried out at Robert Bosch R&D Center in 1999. Gunar graduated in mechanical engineering at the TU Braunschweig in Germany and received his PHD in electrical engineering from the TU Bremen in 1999.

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Dr. Stefan Majoni

Director Foundry MEMS

Bosch

Stefan Majoni studied chemistry in Hannover and completed his PhD in solid state physical chemistry in 1994

He developed semiconductor lithography processes for DRAMs with IBM and ASICs with Philips.

Since 2005, he joins the Bosch MEMS team in several management positions, primarily in development and partly in production.

Stefan currently drives MEMS foundry service as director for Bosch.

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The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). The company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in some 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. With its more than 400 locations worldwide, the Bosch Group has been carbon neutral since the first quarter of 2020. The basis for the company’s future growth is its innovative strength. At 128 locations across the globe, Bosch employs some 76,100 associates in research and development, of which more than 38,000 are software engineers.

The company was set up in Stuttgart in 1886 by Robert Bosch (1861–1942) as “Workshop for Precision Mechanics and Electrical Engineering.” The special ownership structure of Robert Bosch GmbH guarantees the entrepreneurial freedom of the Bosch Group, making it possible for the company to plan

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Adrian Arcedera

SVP MEMS and Sensor Products

Amkor Technology, Inc.

Adrian joined Amkor in 1997, and is currently Sr VP for Memory, MEMS and Sensor Business Unit, responsible for the business and platform development for Memory, MEMS & Sensor Products. He has served in various leadership positions in Amkor’s chip scale products, including leading the platform development for Amkor’s ChipArray® package. He has authored multiple technical papers and has been granted multiple US Patents. He holds a degree in chemical engineering from the University of the Philippines.

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As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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  • 09:00 –

New Package Solutions for Automotive Optical Sensors

Advanced Driver Assistance Systems (ADAS) are designed to help the driving process and enhance car/road safety. Automotive optical sensors enable ADAS and the autonomous driving transition from SAE J3016 Level 2 towards Level 4/5, according to SAE International (formerly the Society of Automotive Engineers).

Current optical sensor chip designs require custom package solutions which have assembly packaging and test challenges. In addition, stringent reliability requirements increase the development time to select materials, run process evaluation, optimize process parameters and complete reliability verification for automotive applications.

New automotive optical package innovations extend Amkor’s broad package portfolio capabilities and expertise to benefit automotive customers. The solution to current automotive image sensor application challenges involves creating a package platform that utilizes an assembly open toolbox, adopts a new generation of wafer fabrication requirement, achieves faster development cycle time and manages cost efficiency.

This presentation will discuss a standard package platform to design alternative package solutions, overcome technical challenges and satisfy the Automotive Electronics Council’s AEC Q100 reliability requirements for automotive optical sensors.

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Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

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As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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  • 09:00 – 09:30

Technologies To Break The Walls Slowing Compute Systems Scaling

Transistor density in chips continues to follow Moore’s law, but the node to node logic performance improvements have slowed down. Memory and power walls limit compute system performance. Future compute systems will increasingly rely on new materials, new device architectures and system technology co-optimization to realize benefits beyond pure density scaling of compute, connect and store technologies. This talk will highlight technology innovations in logic, memory and 3D integration that will enable continued compute systems scaling. With the anticipated semiconductor industry growth in the next decade, we also need collective action to address the carbon footprint of semiconductor manufacturing.

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Sri Samavedam

SVP, CMOS Technologies

imec

Sri Samavedam is SVP of CMOS Technologies at imec since Aug 2019. His responsibilities include programs in logic, memory, photonics and 3D integration. Prior to that, he was senior director of technology development at Globalfoundries in Malta, NY, where he led qualification of 14nm FinFET technology and derivatives into volume production and early development of 7nm CMOS.

He began his research career at Motorola in Austin, TX, working on strained silicon, metal gates, high k dielectrics and fully-depleted SOI devices. He holds a Ph.D. in Materials Science and Engineering from MIT and a masters from Purdue University.

 

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