• 07:00 – 08:00

Registration

  • 07:00 – 08:15

Registration

  • 07:45 – 08:30

Registration

  • 07:50 – 08:30

Registration

DRIVING MANUFACTURING LEADERSHIP

  • 07:55 – 08:25

Registration

  • 07:55 – 08:25

Registration

  • 08:00 – 08:25

Welcome Speech

Salah Nasri photo

Salah Nasri

Senior Advisor to President

ISES

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Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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  • 08:00 –

Registration

  • 08:00 –

Registration

  • 08:00 –

Registration

  • 08:00 – 08:35

Registration

  • 08:00 – 08:15

Opening Address

Jubed Miah

Director

ISES

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Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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What are the Next High Volume Applications?

  • 08:15 – 08:45

Registration

  • 08:15 – 08:30

Welcome Speech

Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

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Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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  • 08:15 – 08:25

Welcome Speech

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Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

View Full Profile

Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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  • 08:15 – 08:35

Keynote

Market Penetration of SiC & GaN

Innovations in Epitaxy & Materials

Enhancing Europe’s Leadership in MEMS & Sensors

  • 08:30 – 08:55

Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

Two years have passed since the formulation of the Semiconductor and Digital Industry Strategy in June 2021, the Ministry of Economy, Trade and Industry revised its Semiconductor and Digital Industry Strategy in June 2023.

In this strategy, in the semiconductor sector, Japan aims to achieve total sales of 15 trillion yen or more for domestic semiconductor manufacturing companies by 2030, and while step 1 is developing semiconductor manufacturing capability, step 2 will bethe establishment of manufacturing technology for 2nm and beyond logic semiconductors. Finally, it will work on the development of future, game-changing technologies, such as photonics-electronics convergence in step 3.

In this presentation, specific initiatives such as research and development, human resource development, and international collaboration based on the Semiconductor and Digital Industry Strategy will be explained, along with the latest policy trends.

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Hisashi Kanazashi photo

Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

Director, IT Industry Division, Commerce and Information Policy Bureau, METI(Ministry of Economy, Trade and Industry)

1998 Joined the Ministry of International Trade and Industry (MITI)

2007 Visiting Scholar, Stanford University

2008 MBA from EDHEC Business School, France

2009 Industrial Revitalization Division

2011 Policy Planning and Coordination Division, Minister’s Secretariat

2014 Japan Economic Revitalization Bureau, Cabinet Secretariat

2016 Deputy Director, JETRO Los Angeles Office,

Director, Industry Creation Policy Division, Principal Director, IT Industry and Digital Economic Security, etc

2021 Counselor for Information Industry and Digital Economy and Security, Minister’s Secretariat

July 1, 2022 Current Position

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  • 08:30 – 08:50

The Essential Evolution of Packaging in the Systems Foundry Era

The transition to the AI era and the next era of computing requires a fundamental shift in the semiconductor industry to heterogenous systems of chips. A systems foundry approach combines world-class foundry offerings, sustainable and resilient supply, and co-optimized, composable packaging solutions to enable systems of chips with enhanced capabilities and efficiencies for the AI era.

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Stuart Pann photo

Stuart Pann

SVP & GM

Intel IFS

Stuart Pann is senior vice president and general manager of Intel Foundry Services (IFS). In this role, Pann drives continued growth for IFS and its differentiated systems foundry offering, which goes beyond traditional wafer fabrication to include packaging, chiplet standards and software, as well as U.S.- and Europe-based capacity.

Pann previously served as chief business transformation officer and general manager of Intel’s Corporate Planning Group. As part of this role, he established the company’s IDM 2.0 Acceleration Office (IAO) to guide the implementation of an internal foundry model. IAO closely collaborates with all Intel business units and functional teams to support the company’s internal foundry model.

In June 2021, Pann returned to Intel, where he had started his career in 1981. Prior to his return, he was chief supply chain officer and chief information officer at HP for six years. At HP, Pann was responsible for the company’s supply chain, which delivers nearly 100 million products to customers each year.

Before joining HP in July 2014, Pann served as corporate vice president and general manager of Intel’s Business Management Group, where he was responsible for pricing, revenue and forecasting functions for the company’s microprocessor and chipset operations. He also co-managed the geographic operations teams for the Intel sales force and was responsible for order management and external-facing supply chain programs. Pann held several management positions within the company’s sales organization before moving into an operations role in 1999 as the director of Microprocessor Marketing and Business Planning.

Pann earned a bachelor’s degree in electrical engineering from Michigan Technological University and an MBA from the University of Michigan.

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  • 08:30 – 08:50

SiC and GaN in future Volkswagen Group applications

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Alexander Krick photo

Alexander Krick

EVP Technical Development

Volkswagen Group Components

  • For more than 20 years employed at Volkswagen Group
  • Since 2020 – Head of Development E-Drive, Power Electronics & Transmission
  • 2019-2020 – Head of Planning- & Development Steering of the Business Unit Transmission & E-Drive
  • Until 2019 – several national and international managing positions in the development environment (e.g. China)
  • Dipl. Ing. Electrical Engineering (University Kassel and University of Massachusetts Dartmouth)
  • Member of the Board with the FVA and VDE GMM
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As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.

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  • 08:30 – 08:50

Epitaxy: The lithography of GaN

The world’s need for more efficient power solutions together with Net Zero initiatives are driving development for GaN on silicon as a solution for voltage nodes up to 650 V. Building on market insertion for lower voltage applications (e.g., efficient USB-C chargers), fabless and specialty foundries are rapidly developing the technology for higher voltage commercial and automotive applications.

The successful development of viable GaN on silicon technology for these applications requires a paradigm shift for technology innovation. For over 50 years, most semiconductor innovation has focused on CMOS silicon where device design and fabrication have been the key enablers. In these instances, the starting materials, silicon wafers, have been a commodity and not an area of innovation and development. For GaN on silicon, this is no longer the case; the key enabler and differentiator is at the materials/epiwafer level. Advancing GaN on silicon requires fundamental materials engineering to address inherent strain and thermal challenges. Specifically, the enabling innovation is in the epitaxial engineering of the growth process, thus overcoming technological challenges at the materials level.

To demonstrate the shift in the innovation landscape, data for 650 e/d mode GaN on silicon HEMTs will be presented along with a roadmap to higher voltage nodes.

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Dr. Rodney Pelzel photo

Dr. Rodney Pelzel

CTO

IQE

Dr. Rodney Pelzel is the Chief Technology Officer at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry

Rodney has over 20 years of experience in the semiconductor industry, with deep expertise in semiconductor materials engineering and the epitaxial growth of compound semiconductors. Rodney joined IQE as a Production Engineer in 2000 and during his first twelve years at IQE he held various engineering and operational management roles focusing on scaling leading edge epitaxial technology for high volume manufacturing for wireless applications.

In 2012, Rodney was appointed as head of R&D for the IQE Group and was tasked with creating unique materials solutions that enable IQE’s customers and provided them with a competitive edge. Throughout his career, Rodney has been involved in numerous new product introductions, including IQE’s highly successful launch of 6” VCSELs for consumer applications.

Rodney is a chemical engineer by training and graduated from the University of Colorado in 1995 with a bachelor’s degree (high distinction) in Chemical Engineering and a PhD in Chemical Engineering (surface chemistry of semiconductors, GaAs and Si) from the University of California in 2000. He is a Chartered Engineer, Chartered Scientist, and a Fellow of the Institution of Chemical Engineers, with his work widely published and a co-inventor of 30+ patents.

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IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.

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  • 08:30 – 08:45

Welcome Speech

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Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

View Full Profile

Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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  • 08:30 – 08:50

Keynote

Enhancing Europe’s Leadership in MEMS & Sensors: Seizing Opportunities with the EU Chips Act

(Virtual Presentation)

MEMS sensors and actuators bridge the natural and virtual worlds, unlocking the potential of digital technologies across key industries like automotive, manufacturing, and healthcare. This sector is thriving, showing consistent growth, with Europe leading the charge through its advanced companies and world-class research institutions. Strengthening Europe’s presence in this sector is crucial for maintaining its leadership in the digital revolution. The European Commission is dedicated to sustaining this growth and enhancing Europe’s position in the field, recognizing the strategic importance of the MEMS sector. The EU Chips Act is designed to support this by addressing challenges across the entire semiconductor value chain, benefiting the MEMS sector through enhanced collaboration, research, and funding. This legislation aims to create a more resilient and innovative ecosystem for European MEMS manufacturers and developers. In this keynote, we will provide an overview of the EU Chips Act, highlighting the vast opportunities it offers, including access to world-leading research and innovation platforms, as well as various funding opportunities tailored for the MEMS sector.

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Pierre Chastanet

Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT

EU Commission

Pierre Chastanet is Head of the Unit for Microelectronics and Photonics Industry at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act.

Mr. Chastanet has been working for over 17 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.

Prior to that, Mr. Chastanet gained more than 10 years of ICT experience, mostly in various IT management positions in a large multinational company.

He graduated from Telecom ParisTech, the Free University of Brussels, and the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from Harvard Kennedy School of Government.

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The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.

Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.

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BUILDING ROBUST ADVANCED PACKAGING CAPABILITIES FOR HPC & AI IN THE U.S.

  • 08:35 – 08:55

Greater Phoenix: Semiconductor Excellence on the Global Stage

Camacho presents the industry’s recent boom and how Greater Phoenix is harnessing its strengths to become a magnet for innovation and investment, furthering its position as a globally leading semiconductor market.

Watch on ISES TV > PPTs in ISES Docs >
Chris Camacho photo

Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

Chris Camacho serves as president & CEO of the Greater Phoenix Economic Council (GPEC), one of the longest-standing public-private partnerships for economic development across the country. As chief executive, Chris leads the development and execution of the region’s strategic economic strategy, oversees domestic and international business development, and ensures the market position remains competitive through coordination with partner organizations, private sector leaders, and municipal and state leadership. GPEC has attracted more than 540 companies during his tenure, creating more than 100,000 jobs and $56.8 billion in capital investment. Some notable projects include TSMC, Apple, LG Energy Solutions, Microsoft, GoDaddy, Amazon, Garmin, General Motors, HelloFresh, KORE Power, Williams-Sonoma and headquarters including Benchmark Electronics, Carlisle Companies, Rogers Corporation and EMD Electronics. In October 2021, Chris led GPEC to being recognized as the top economicdevelopment organization globally by the International Economic Development Council a year after being named the top EDO in the U.S. in 2020.

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Established in 1989, the Greater Phoenix Economic Council (GPEC) actively works to attract and grow quality businesses and advocate for the competitiveness of Greater Phoenix. As the regional economic development organization, GPEC works with 22 member communities, Maricopa County and almost 200 private investors to accomplish its mission, and serve as a strategic partner to companies across the world as they expand or relocate. Consistently ranked as a top national economic development organization, GPEC’s approach to connectivity extends beyond the fabric of the community. Known as The Connected Place, Greater Phoenix is in a relentless pursuit of innovative and entrepreneurial technology-focused companies that are committed to changing the game. As a result, over the past 32 years GPEC has fueled the regional economy by helping more than 895 companies, creating more than 163,000 jobs and $33.4 billion in capital investment.

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  • 08:35 – 08:55

ISES Welcome Address

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Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

View Full Profile

Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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HPC and AI Session

  • 08:40 – 09:10

Keynote

Google AI and AI for Semiconductor Industry in Taiwan

Jason Ma photo

Jason Ma, Ph.D.

Engineering Director, ChromeOS, Google

Google

As the Engineering Director, Jason Ma oversees Google Taiwan’s site growth, business management and development, as well as leads multiple R&D projects across the board. Before taking this leadership role at Google Taiwan, Jason was a Platform Technology and Cloud Computing expert in the Platform & Ecosystem business group at Google Mountain View, CA. In his 12 years with Google, Jason has successfully led strategic partnerships with global hardware and software manufacturers and major chip providers to drive various innovations in cloud technology. These efforts have not only contributed to a substantial increase in Chromebook’s share in global education, consumer and enterprise markets, but have also attracted global talents to join Google and its partners in furthering the development of hardware and software technology solutions/services.

Prior to joining Google, Jason served on the Office group at Microsoft Redmond, WA. He represented the company in a project, involving Merck, Dell, Boeing, and the United States Department of Defense, to achieve solutions in unified communications and integrated voice technology. In 2007, Jason was appointed Director of the Microsoft Technology Center in Taiwan. During which time, Jason led the Microsoft Taiwan technology team and worked with Intel and HP to establish a Solution Center in Taiwan to promote Microsoft public cloud, data center, and private cloud technologies, connecting Taiwan’s cloud computing industry with the global market and supply chain.

Before joining Microsoft, Jason was Vice President and Chief Technology Officer at Soma.com. At Soma.com, Jason led the team in designing and launching e-commerce services, and partnered with Merck and WebMD on health consultation services and over the counter/prescription drugs/services. Soma.com was in turn acquired by CVS, the second largest pharmacy chain in the United States, forming CVS.com, where Jason served as Vice President and Chief Technology Officer and provided solutions for digital integration.

Jason graduated from the Department of Electrical Engineering at National Cheng Kung University, subsequent which he moved to the United States to further his graduate studies. In 1993, Jason obtained a Ph.D. in Electrical Engineering from the University of Washington, with a focus in the integration and innovation of power systems and AI Expert Systems. In 1997, Jason joined the National Sun Yat-sen University as an Associate Professor of Electrical Engineering. To date, Jason has published 22 research papers and co-authored 2 books. Due to his outstanding performance, Jason was nominated and listed in Who’s Who in the World in 1998.

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Our mission is to organize the world’s information and make it universally accessible and useful.

Website: www.google.com
Headquarters: 1600 Amphitheatre Pkwy, Mountain View, CA 94043
Phone: +1 (650) 253-0000

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Front End Technology

MEMS Microphone & Speakers

  • 08:45 – 09:10

Keynote

The Challenge of Speed – The Rapidus Model for a New Manufacturing Era

As the miniaturization of advanced logic processes continues, the time from design to commercialization is lengthening.
This is due to the increasing difficulty of the manufacturing process, design, and verification associated with the growing complexity of device structures. However, LSIs, such as processors and accelerators for AI, are evolving at a rapid pace and must be commercialized in a short period of time to meet time- to-market requirements. We will introduce the Rapidus model, which solves this problem and achieves short TAT manufacturing.

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Kazunari Ishimaru photo

Kazunari Ishimaru

Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow

Rapidus

Joined Toshiba, Semiconductor Device Engineering Labs. in 1988 and engaged in development of advanced SRAM/Logic technologies. 2006-2010: engaged in development of 32nm~20nm CMOS platform technologies with IBM as Toshiba’s representative (VP of R&D). 2013 Senior Manager of Advanced Memory Technology Development Dept. 2022 Director of Memory Technology R&D Center. Joined Rapidus Corporation in April 2023.

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  • 08:45 – 09:05

Keynote

How will Generative AI shape the future of MEMS Microphones?

In the present era, the utilization of AI in diverse applications is steadily increasing, contributing to strength individuals’ efficiency. Tools like ChatGPT play a pivotal role in enhancing people productivity by engaging users through text or voice inputs. Notably, Infineon’s high-performance silicon microphones enable seamless speech interaction with Natural Language Processing assistants. Prior to being processed by Large Language Models, audio data undergoes Speech-to-Text (STT) conversion, a crucial task to ensure accurate input for AI systems. STT operates by breaking down speech into “phonemes” and utilizing spectral comparison to transcribe the audio. Infineon’s initial trials evaluate the significance of high Signal-to-Noise Ratio (SNR) in applications like laptops interpreting the Error Word Rate. Furthermore, in True Wireless Stereo (TWS) and Smart-VR glasses devices, the fusion of AI with Infineon’s Vibration sensor shows the potential to revolutionize current architectures, delivering clear phone calls even any environmental conditions and outperforming current solutions.

Watch on ISES TV > PPTs in ISES Docs >

Aldo Bruno

Technical Lead MEMS Sensor System Competence Team

Infineon Technologies AG

Aldo Bruno is the Technical Lead MEMS Sensor System Competence Team within the application engineering at Infineon Technologies, specializing in consumer sensors. Before Infineon, he held the role of Digital ASIC Designer at Cirrus Logic UK, where he honed his expertise in DSP, digital filters, audio codec systems, voice activity detection, and speech enhancement algorithms. In 2018, while completing his master’s thesis at Infineon Technologies, he concentrated on the development of ANC systems to explore the potential enhancements Infineon MEMS microphones could bring. Throughout his career and personal pursuits, Aldo’s passion for audio and acoustics has been a driving force since he´s also a musician and music producer.

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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