Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

Stuart Pann is senior vice president and general manager of Intel Foundry Services (IFS). In this role, Pann drives continued growth for IFS and its differentiated systems foundry offering, which goes beyond traditional wafer fabrication to include packaging, chiplet standards and software, as well as U.S.- and Europe-based capacity.

Pann previously served as chief business transformation officer and general manager of Intel’s Corporate Planning Group. As part of this role, he established the company’s IDM 2.0 Acceleration Office (IAO) to guide the implementation of an internal foundry model. IAO closely collaborates with all Intel business units and functional teams to support the company’s internal foundry model.

In June 2021, Pann returned to Intel, where he had started his career in 1981. Prior to his return, he was chief supply chain officer and chief information officer at HP for six years. At HP, Pann was responsible for the company’s supply chain, which delivers nearly 100 million products to customers each year.

Before joining HP in July 2014, Pann served as corporate vice president and general manager of Intel’s Business Management Group, where he was responsible for pricing, revenue and forecasting functions for the company’s microprocessor and chipset operations. He also co-managed the geographic operations teams for the Intel sales force and was responsible for order management and external-facing supply chain programs. Pann held several management positions within the company’s sales organization before moving into an operations role in 1999 as the director of Microprocessor Marketing and Business Planning.

Pann earned a bachelor’s degree in electrical engineering from Michigan Technological University and an MBA from the University of Michigan.

Chris Camacho serves as president & CEO of the Greater Phoenix Economic Council (GPEC), one of the longest-standing public-private partnerships for economic development across the country. As chief executive, Chris leads the development and execution of the region’s strategic economic strategy, oversees domestic and international business development, and ensures the market position remains competitive through coordination with partner organizations, private sector leaders, and municipal and state leadership. GPEC has attracted more than 540 companies during his tenure, creating more than 100,000 jobs and $56.8 billion in capital investment. Some notable projects include TSMC, Apple, LG Energy Solutions, Microsoft, GoDaddy, Amazon, Garmin, General Motors, HelloFresh, KORE Power, Williams-Sonoma and headquarters including Benchmark Electronics, Carlisle Companies, Rogers Corporation and EMD Electronics. In October 2021, Chris led GPEC to being recognized as the top economicdevelopment organization globally by the International Economic Development Council a year after being named the top EDO in the U.S. in 2020.

Bassam is a Global Technical Specialist at General Motors, where he is responsible for defining a strategic roadmap for advanced automotive semiconductor packaging—essential for achieving GM’s role in Autonomous Driving and Software Defined Vehicle compute. Bassam’s expertise lies in Advanced Packaging, Chip and Product Architecture, OSAT and Industry Engagement, and successful product ramps. He is actively involved with IMEC and the UCIe for commercialization of these ventures. Previously, as a Senior Technologist of Advanced Packaging at Intel for 12 years, Bassam pioneered key technologies and process steps for 2.5D and 3D products for data center and client applications such as EMiB and Foveros. He holds degrees in Mechatronics and Mechanical Engineering and has contributed extensively to the field through numerous publications, patents, and conference proceedings on advanced packaging and automotive compute.

Dr. Ann Kelleher is the executive vice president and general manager of Technology Development at Intel Corporation. Since 2020, she is responsible for the research, development and deployment of the next-generation silicon, advanced packaging, and test technologies that power Intel’s innovation. She joined Intel in 1996 as a process engineer and has worked in areas spanning from litho, thin films, yield, to managing all of Intel’s Global operations including Fab and Assembly Test factories, supply chain and construction. She did her Ph.D. in electrical engineering from University College Cork in Ireland and her post-doc at IMEC.

Hidenori Abe CTO for semiconductor materials, Resonac Holdings Corporation Executive director, Electronics Business Headquarters, Resonac Corporation. He is leading electronics materials R&D and strategy for semiconductor, substrate and display. Until 2023, he was the head of Electronics R&D Center and Packaging Solution Center, which is open innovation hub in advanced packaging development. I launched JOINT2, new advanced packaging consortium targeting 2.xD and 3D package in 2021.Prior to the above mission, he have been a General Manager of CMP Slurry Business Sector for three years. Before that he was a Manager of Marketing Promotion Group in Innovation Promotion Center at Hitachi Chemical (HC) for 2 years. When the career, he was promoted new R&D projects, especially targeting new business field using new technologies, and also to promote developing R&D products. As a side note, HC is one of the merged companies of Resonac. Hidenori Abe was Manager of Business Development Group in Packaging Solution Center at HC for 1 year with responsibility to promote open laboratory to partners such as customers and equipment makers, responsibility of marketing wearable related materials. Before that, he was epoxy molding compounds (EMC) engineer. During his 16 years carrier as engineer, he spent time doing responsibility of development of non-conductive carbon, green EMC, Cu wire compatible EMC, wafer level compression compounds, power module EMC and so on. His Cu wire compatible EMC development work contributed to the promotion to Cu wire conversion through several published papers. He received a master degree in chemical engineering field from Tokyo Institute of Technology, Japan and a master degree at the EMBA course from Oxford, UK.

Dan Berger has had his hand in Packaging Development for the last 36 years. After Dan graduated from Purdue in 1988 he joined IBM in East Fishkill New York where he worked until the Microelectronics division was sold to GlobalFoundries in 2015. He continued there until 2022. During that lengthy tenure Dan held numerous management and executive roles in advanced packaging including major transitions such as ceramic to organic substrates, leaded to lead free bumping, single chip modules to multichip modules, Multi-chip modules to 2.5D and 3D stacking solutions, and must recently silicon photonics co-packaged optics. Dan briefly founded a consulting company in advanced packaging in 2023 before receiving the call to join the Chips for America program in NIST as Associated Director of the NAPMP. Dan took on that roll in December of 2023.

Niranjan Khasgiwale is Vice President of Marketing and Business Development in the Digital Lithography Group.

Niranjan has more than 25 years of experience in the semiconductor equipment industry and joined Applied in 2011 following the acquisition of Varian Semiconductor, where he led strategy and marketing for the implant business unit.

He previously held roles with KLA-Tencor and Formfactor. He holds a master’s degree and Ph.D.in Materials Science from Dartmouth College and Lehigh University respectively and a B.Tech in Metallurgy from the Indian Institute of Technology.

Mr. Nicolet, a Swiss-born professional in the PCB business, has been involved since 1982. He served as production manager for Seprolec and later as technical director for Cicorel. In 2000, he joined Multek as technical director, acting in Germany, USA, and China for six years. In 2006, he joined SCHMID as technical director for PCB machines and took responsibility for the PCB business. In 2009, he moved to Hong Kong and managed the production site and worldwide sales. Since 2020, he is located in Taiwan and serves as the V.P. of BU Electronics for the SCHMID Group.