• 08:15 – 08:45

Registration

  • 08:50 – 09:00

Welcome Address

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Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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ISES
  • 09:05 – 09:25

Innovation in Power & Energy Management is Key to Support a Sustainable Future

In this presentation, Francesco Muggeri will talk about the global challenges on energy consumption and the importance of more efficient and energy savings in power & energy management in Automotive and Industrial to achieve a sustainable future. Electrification and Digitalization leads to the acceleration of silicon content pervasion in automotive and industrial market, Mr Muggeri will further discuss how new technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN) contribute to better power efficiency and more intelligent solutions for energy usage.

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Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, APeC/China

STMicroelectronics

Francesco Muggeri is Vice President for Power Discrete and Analog Products, Asia Pacific at STMicroelectronics. In his role, Francesco leads ST’s Industrial Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and coordinates ST’s global Mass Market Industrial Task Force, with regards to consumer segment.

Muggeri joined ST in 1995, as a designer for automotive sensors in Italy. In 2000, he moved to product marketing for power transistors before relocating to Shanghai as marketing manager for transistors in 2002. In 2008, Muggeri moved to Commercial Marketing for STMicroelectronics’ Asia Pacific operations in Hong Kong. He became director for Discrete and Analog Products in 2015 and added Marketing Communications to his mandate in 2016.

Francesco Muggeri was born in Zambrone, Italy, in 1969, and graduated with a Master’s degree in Electronic Engineering from the University of Pisa, Italy. In 2014, he was awarded an EMBA degree from the Global Asia Program organized by the London Business School of London, the Colombia University of New York, and the University of Hong Kong.

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At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. We are committed to achieving our goal of becoming carbon neutral by 2027. Further information can be found at www.st.com.

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STMicroelectronics
  • 09:30 – 09:50

Fu Lu Shou – The Three Lucky Stars of Power

In a world challenged by global warming decarbonization became the most pressing task for our generation. In the light of this power electronics and the underlying semiconductor technologies are an essential tool for survival. In this sense GaN, SiC and Si are the three lucky stars of power. While all three technologies are inevitable for our future, each has its distinct character and use case. Starting with a recap of properties and manufacturing aspects, global trends for use cases and markets will be covered. A special focus will be on technology fusion (e.g. Si’C) to tackle conflicting requirements in power electronics.

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Mark Nils Münzer

Distinguished Engineer Innovation & Emerging Technologies Automotive High Power

Infineon Technologies AG

Mark Muenzer received the Dipl.-lng. degree in electrical engineering from the RWTH Aachen, Germany, in 1997. As a development engineer for industrial power modules at Eupec GmbH he established industry leading power modules. In 2005 Mark transferred to Infineon Headquarter in Munich where he build up Infineon’s ElectricDriveTrain business. He initiated new product families for automotive power modules and related driver ICs. As a senior director Mark Muenzer was from 2012 until 2018 responsible for the newly found business segment EDT-Electric Drive Train. 2018 Mark Muenzer took over a position as Vice President for Innovation & Emerging Technologies in the Automotive High Power business line of Infineon. In September 2022 Mark was promoted to Distinguished Engineer.

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Infineon Technologies AG
  • 09:55 – 10:15

How does SiC Accelerate NEVs

Nowadays, more and more electric vehicles hit the road, and this is helping the world to reduce its carbon footprint and fight against ever increasing greenhouse effect. The EVs can reuse multiple types of power sources in the shape of electric power. Nowadays, new EVs require higher charging speed, higher output power, higher efficiency, longer milage, and as well as more comfortable riding experience, which come along with new technical solutions and new demands for semiconductor power devices. New generation SiC devices have adopted more and more innovative structures and cooler packages, which enable the EVs to go farther, charge faster and work more economy. We believe with accelerated adoption of SiC-based solutions, we will make power efficiency for a cooler planet.

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Markus Mosen photo

Markus Mosen

CEO

WeEn Semiconductors

Markus has 20 years professional experience in managing globally Business and Product Lines in the Semiconductor Industry, developing, and setting up Sales & Marketing offices in China and Asia-Pacific, improving Market Share in different market segments including Mobile Solutions, Bipolar Power and Security. As well in his career he has been addressing different applications for Mobile Chipsets, Security and Chip Cards ICs, and more recently Power Discrete in Renewable Energy, Industrial and Consumer markets. Markus has 15 years living and working experience in Asia-Pacific (Singapore) and China (Beijing and Shanghai).

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WeEn Semiconductors Co., Ltd was registered as a company on Aug 5, 2015. WeEn’s global footprint has an operational headquarter in Shanghai and wholly owned subsidiaries and centers in Jilin (North East China, Front-End Fabrication) , Hong Kong, Manchester (Research and Development) , Dongguan (Warehouse and Distribution), and cities throughout the world (Sales Offices and Customer Service Access). In September 2018, WeEn added its new, in-house, reliability and failure analysis laboratory in Nanchang, Jiangxi Province, China. With a heritage of over 50 years in semiconductor development and manufacturing, WeEn as a key player has focused on developing a wide and deep portfolio of industry-leading power products including Silicon Carbide Power Devices, Silicon Controlled Rectifiers and Triacs, standard and fast recovery Power Diodes, TVS and ESD Diodes and IGBT and Modules. All these products are widely used in the markets for telecommunications, computing, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. WeEn seeks to help our customers achieve improved cost and production efficiency and contribute to the development of global intelligent manufacturing.

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WeEn Semiconductors
  • 10:20 – 11:00

Networking Break, Business Meeting

  • 11:05 – 11:25

Virtual

Vehicle Electrification Catalyzing Power SiC Mass Commercialization

SiC brings compelling advantages to vehicle electrification including higher efficiency, fast charging, weight/volume reductions, and ultimately cost savings. Indeed, electric vehicle system insertion has emerged as the mass commercialization opportunity for SiC power semiconductors catalyzing their explosive growth. In this presentation, the fab models of the vibrant SiC manufacturing infrastructure will be introduced. In particular, the modest capital investments to manufacture SiC in mature fully depreciated fabs, alongside Si, leverage existing infrastructure and allow for SiC fabrication at Si economies of scale. Key barriers to SiC volume adoption will be identified and discussed. Finally, the impact of the US$150M PowerAmerica member-driven consortium in accelerating SiC and GaN power technologies will be summarized.

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Dr. Victor Veliadis photo

Dr. Victor Veliadis

Executive Director and CTO

PowerAmerica

Dr. Victor Veliadis is Executive Director & CTO of PowerAmerica, a member-driven consortium of industry, universities, and national labs accelerating the commercialization of energy efficient SiC and GaN power semiconductor technologies. At PowerAmerica, he has managed a budget of $152 million that he strategically allocated to over 210 industrial and University projects to catalyze SiC/GaN semiconductor and power electronics manufacturing, workforce development, and job creation. His PowerAmerica educational activities have trained 420 full-time students in collaborative industry/University WBG projects, and engaged over 4600 attendees in tutorials, short courses, and webinars. Dr. Veliadis is an ECE Professor at NCSU, and an IEEE Fellow and EDS Distinguished Lecturer. He has 27 issued U.S. patents, 6 book chapters, and over 150 peer-reviewed publications to his credit.

Prior to entering academia and taking an executive position at Power America in 2016, Dr. Veliadis spent 21 years in the semiconductor industry where his work included design, fabrication, and testing of SiC devices, GaN devices for military radar amplifiers, and financial and operations management of a commercial semiconductor fab. He has a Ph.D. degree in Electrical Engineering from John Hopkins University (1995).

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PowerAmerica is a consortium of industry, universities, and national labs accelerating the commercialization of energy efficient silicon carbide and gallium nitride power semiconductor technologies. Our membership network spans the wide-bandgap technology ecosystem, from materials to device developers and fabs to module manufacturers to end users, as well as universities that educate and supply the future workforce. As we continue to grow, so does the diversity of our membership.

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PowerAmerica
  • 11:30 – 11:50

SiC – A Yin and Yang Perspective

Worldwide ramp-up of electromobility is resulting in a huge demand of wide bandgap semiconductor materials like silicon carbide. The hype for SiC is ongoing, the material allows higher efficiency in power conversion, but is currently at higher cost than conventional silicon-based technology. This presentation will focus on latest SiC innovations in material development, device structures and drivetrain concepts, and shows how, all put together, enables not only efficient, but most importantly affordable electrification. Efficient and affordable aspects need to get in balance like in Yin and Yang philosophy.

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Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch Sensortec

Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.

Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.

Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.

Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.

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Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems, acoustic microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and has, to date, sold more than 15 billion MEMS sensors.

The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). According to preliminary figures, the company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.

As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. Bosch employs some 76,100 associates in research and development, as well as roughly 38,000 software engineers.

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Bosch Sensortec
  • 11:55 – 12:15

Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective

The opportunities for WBG Power Semiconductors in automotive applications are recently widely discussed due to the immense growth potential of the new electric vehicle market. With the speed of market adoption, also the full supply chain needs to be developed.

This is not only the case within the semiconductor products supply from material – i.e. SiC epi substrates – to the chip and then to the module. It needs to be setup in the full industry value chain, from power generation via power transmission to the grid and charging infrastructure, then finally to the electric vehicle EV itself. This full industry value chain needs to be then differentiated depending on the final EV applications which have a wide variety of conditions to reflect: The volume driver is EV passenger cars, here already in a spread of technology requirements from high performance cars to standard models with less power needs. It becomes further differentiated, if we go up the EV types, e.g. in its intrinsic mass, from buses and trucks to electric locomotives.

The presentation will give an overview, how from a power electronics system provider view, the new power semiconductor technologies, i.e. SiC, drives the development of the new system concepts along the industry value chain applications due to the technological specific advantages of the new power semiconductor developments.

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Dr. Rainer Kaesmaier photo

Dr. Rainer Kaesmaier

Managing Director, Global Product Group Semiconductors

Hitachi Energy Ltd.

Since 2018 Dr. Rainer Kaesmaier is Managing Director for the Global Product Group Semiconductors of Hitachi Energy, leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes for market segments such as energy transmission & distribution, transportation & rail, renewable, industry and e-mobility. He is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he assumed the responsibility for the global semiconductor business of Hitachi Energy. In addition to that, Rainer is since 2019 also member of the management board for Hitachi Energy Switzerland Ltd.

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We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.

Hitachi Energy Switzerland Ltd.
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland

Phone: +41 58 586 14 19
Fax: +41 58 586 13 06
Email: salesdesksem@hitachienergy.com
www.hitachienergy.com/semiconductors

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Hitachi Energy Ltd.
  • 12:20 – 13:25

Networking Lunch

  • 13:30 – 13:50

Semiconductors and Sustainability – Why Going Green is Chip Driven

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Julian Fieres photo

Julian Fieres

Vice President Transformation, Strategy, Sustainability & Digitalization

ZF Friedrichshafen AG

Julian Fieres studied management but always loved technology equally as much and is now working towards a vision for zero emissions to leave a better planet for the next generation. He is the Vice President of Transformation, Strategy, Sustainability & Digitalization at the Division Electrified Powertrain at the ZF Group. This includes the areas of strategy, M&A, product planning, digitalization and sustainability. With a revenue of €10 billion and around 30,000 employees at Division E, his team and he strive to make an impact for a more affordable and more sustainable mobility of tomorrow every day.

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ZF is a global technology company supplying systems for passenger cars, commercial vehicles and industrial technology, enabling the next generation of mobility. ZF allows vehicles to see, think and act. In the four technology domains of Vehicle Motion Control, Integrated Safety, Automated Driving, and Electric Mobility, ZF offers comprehensive product and software solutions for established vehicle manufacturers and newly emerging transport and mobility service providers. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate and enhancing safe mobility.

With some 157,500 employees worldwide, ZF reported sales of €38.3 billion in fiscal 2021. The company operates 188 production locations in 31 countries.

For further press information and photos, please visit: www.zf.com

ZF Friedrichshafen AG
Corporate Headquarters / ZF Forum
Löwentaler Straße 20
88046 Friedrichshafen
Germany

Phone: +49 7541 77 – 0
Email: postoffice@zf.com

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ZF Friedrichshafen AG
  • 13:55 – 14:15

High Accuracy SPICE Model Faciliate Optimized Design of Power Electronics with SiC MOSFETS

An accurate SPICE model is important for power electronics RD designers to pick up the right topologies according to applications and to optimize the layouts and choose the right components. Characteristics of SiC MOSFET are difficult to modeling using conventional Si-based physics models, and current commercially available models are mostly not accurate here or there, which reduced the usefulness of simulation and increased the complexity for achieving optimized designs. We’ve developed a SPICE model which can be applied to both planar and trench SiC MOSFET with very high accuracy, which will enable engineers to reach their target in an more efficient way.

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Cheng-Tyng Yen photo

Cheng-Tyng Yen

CEO

Fast SiC Semiconductor Inc.

Founder & CEO of Fast SiC Semiconductor. fastSiC is a fabless company dedicated on SiC power devices. Fast SiC Semiconductor has mass produced 650V~1700V SiC MOSFETs with its own proprietary designs, which have been adopted by leading customers in the field of server power supplies, charging piles and PV inverters. He has more than 10 years experiences on the design, process, qualification and application of SiC power devices. He currently serves as the TPC member of ISPSD and has published and filed more than 150 papers and patents.

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Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.

General Telephone: +886-3-6590579
General Email: info@fastsic.com
Website: https://fastsic.com

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Fast SiC Semiconductor Inc.
  • 14:20 – 14:40

How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges

SiC materials and devices are rapidly gaining acceptance and being the game-changer in EV market future. The expected performance enhanced by SiC devices perfectly matches the need for the next generation of electrical vehicles, especially for the 800V EV platforms with high efficiency and high power density requirements.

However, a number of challenges must be addressed before SIC can be widely adopted and pursue its promises. Three major challenges, i.e., Manufacture Cost, Device and Packaging, and System Integration need to take care of, not alone by semiconductor manufacturers but together with up and down streams to collaborate.

Today, by gathering worldwide experts and players here, the presentation will focus on the market overview of SiC in automotive, promises and challenges, and how can we accelerate the adoption and breakthroughs.

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Dr. Tong Wu photo

Dr. Tong Wu

Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications

onsemi

Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.

Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.

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onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

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onsemi
  • 14:45 – 14:50

Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

In today’s world with its increasing demand in power semiconductor devices for electrification, e-mobility and enabling the flexible use of green energy it has become more and more imminent that it is not only necessary to involve new semiconductor materials (e.g. SiC, GaN) but also apply alternative manufacturing technologies to maintain the flexibility and reliability on the next generation of power semiconductor devices.

Electroless metallization processes from MKS are part of these alternative technologies for power semiconductor device manufacturing and have been established in the industry over past 10 years with their benefit of providing maskless metallization with higher throughput capability at a reduced Cost of Ownership compared to physical metallization techniques. We present these advantages on an example of an ENEPIG final finish that can be used as the basis for connecting the power semiconductor via wirebonding, soldering or sintering to the outside. The ENEPIG final finish can be obtained by using the Portfolio of MKS Electroless Metallization processes.

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Dr. Stefan Pieper photo

Dr. Stefan Pieper

Global Application Manager

mks Atotech

Stefan Pieper has studied chemistry in Berlin, Germany where he also completed his PH.D. in analytical chemistry. In 2009 he joined Atotech as Application Scientist in the department of Semiconductor Advanced Packaging processes where he used the opportunity to gain deep insight in multiple electrochemical metallization processes and their characterization for semiconductor application. During his work as Application Scientist, he also spent over 3 years in the US where he optimized Cu dual damascene electrodeposition and Through Silicon Via plating. In 2020 he took over the position of Global Application Manager for Electroless deposition processes in semiconductor application at Atotech. In his current position he is leading a team that provides wet-chemical solutions for semiconductor metallization with the focus on power semiconductor.

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Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com

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mks Atotech
  • 14:55 – 15:35

Networking Break and Business Meeting

  • 15:40 – 16:00

Power Electronics Integration and Modulization

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Dr. KK Kuo photo

Dr. KK Kuo

VP R&D

ATX Semiconductor (Suzhou) Co., Ltd.

Dr. KK Kuo is Vice President of ATX Group R&D Center, responsible for development of new technology, introduction of high technology. Dr. Kuo has over 22 years’ experience in semiconductor industry, good at new product development of RF modules, sensors, high reliability and intelligent automotive electronics, IoT IC and smart mobile communications. He holds more than 50 Chinese patents, dozens of U.S. and Taiwanese patents, and published many academic papers. Dr. Kuo is a member of IEEE Electronic Packaging Society, selected as “Science and Technology Entrepreneur of Jiangsu Province” in 2018. He graduated from Taiwan Sun Yat-Sen University with PhD in electrical engineering.

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ATX Group, a worldwide well-known company to provide service of IC assembly and test, offering a full range of turnkey services that include package design, front-end engineering test, wafer test, package assembly and final test. Besides, ATX Group maintains a highly experienced and skilled engineering team dedicated to the research and development of the latest assembly technologies. ATX also invests the latest equipments and state-of-art facilities, making us a true extension of our customers’ manufacturing operations. Has a professional laboratory, with most advanced equipments and rich experience in semiconductor assembly and test, to provide customers with comprehensive solutions.

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ATX Semiconductor (Suzhou) Co., Ltd.
  • 16:05 – 16:25

The Challenges in Getting a Reliable SiC Device

SiC power device is becoming crucial in new energy industry, especially in driving the BEV car to penetrate the market. However, comparing with Si devices, SiC devices are prevailing their applications, since making SiC devices reliable is still challenging. The reliability issues might arise from substrates, epi, processing, assembly, even the final test and application. In this presentation, the defects from different processing stages are sampled, and their impacts on device reliability are outlined. It can be seen that effective tools and more reliable data are needed for screening those flawed devices. In YASC, we are introducing new tools, accumulating data, and know-how to make the SiC device reliable and robust.

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Dr. Hongchao Liu photo

Dr. Hongchao Liu

SVP/Chief Scientist

Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.

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YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.

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Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)
  • 16:30 – 16:50

GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges

The mobility industry is living through the most dramatic changes since the invention of the internal combustion engine and the standardization of the manufacturing process. Society and governments are looking for zero-emission transport, while car makers are seeking the most efficient way to manufacture low-cost and long-distance electric cars. In this context, inverter efficiency became the critical performance parameter, and semiconductors with low loss switching energy, such as SiC and GaN are getting into the spotlight. In this keynote the successful development of a three- phase GaN-based inverter reference design with 400V bus voltage and 400ARMS current is discussed and the results are presented. The major steps on the way from semiconductor chip design, through module development and to full current inverter operation are discussed, chosen solutions explained and results are presented. The main challenges include robust high current > 100A GaN die, with low parametric shift because of repetitive unclamped switching tests up to 1600V; driving 4 dies in parallel to obtain equal current sharing, smooth waveform at needed current and obtaining low voltage overshoots on the gate and on the drain.

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Jim Jian photo

Jim Jian

VP Sales APAC and NA

VisIC Technologies

Jim Jian is Vice President of Sales for Asia Pacific and North America at VisIC Technologies, responsible for all aspects of Sales and Business Development of VisIC’s GaN semiconductors to Automotive OEMs and Tier-1s. Jim has over 25 years of experiences in semiconductor industry, spanning across Sales, Business Development, Product Management, Applications Engineering, and Design Engineering at various semiconductor companies including Broadcom, Provigent, Lucent Technologies. Jim graduated from California State University at San Jose with a BSEE degree.

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VisIC Technologies has a decade of experience in creating, developing, and advancing concepts based on cutting-edge Gallium Nitride-on-silicon technology. We develop solutions that help reduce energy waste in power conversion systems, with a focus on battery electric vehicles (BEV). Our patented D3GaN technology – Direct Drive D-mode GaN – addresses the automotive industry’s cost, supply, sustainability, reliability, quality, and performance needs.

With our D3GaN technology, BEV can save up to 50% on power losses over the driving cycle of the electric car, thus reducing battery cost and increasing driving range and performance. This solution also reduces the cooling system requirements and the size of the BEV inverter.

VisIC Technologies has produced the first GaN-based transistors used in automotive inverters. By utilizing the GaN on Silicon technology, we address the supply chain concern as we are using existing semiconductor high-volume production lines.

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VisIC Technologies

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