27-28 August 2025
Suwon
08:15 – 08:45
Registration
Salah Nasri
I.S.E.S.
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
09:05 – 09:25
Innovation in Power & Energy Management is Key to Support a Sustainable Future
In this presentation, Francesco Muggeri will talk about the global challenges on energy consumption and the importance of more efficient and energy savings in power & energy management in Automotive and Industrial to achieve a sustainable future. Electrification and Digitalization leads to the acceleration of silicon content pervasion in automotive and industrial market, Mr Muggeri will further discuss how new technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN) contribute to better power efficiency and more intelligent solutions for energy usage.
Francesco Muggeri
STMicroelectronics
Francesco Muggeri is Vice President for Power Discrete and Analog Products, China at STMicroelectronics. In his role, Muggeri leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and is appointed as the Global Leader of ST Industrial Power and Energy Segment in July 2024.
Muggeri joined ST in 1995, as a designer for automotive sensors in Italy. In 2000, he moved to product marketing for power transistors before relocating to Shanghai as marketing manager for transistors in 2002. In 2008, Muggeri moved to Commercial Marketing for STMicroelectronics’ Asia Pacific operations in Hong Kong. He became director for Discrete and Analog Products in 2017 and added Marketing Communications to his mandate in 2018.
Francesco Muggeri was born in Zambrone, Italy in 1969 and graduated with a Master’s degree in Electronic Engineering from the University of Pisa, Italy. In 2014, he received an EMBA degree from the Global Asia Program, organized by the London Business School of London, Columbia University of New York, and the University of Hong Kong. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
09:30 – 09:50
Fu Lu Shou – The Three Lucky Stars of Power
In a world challenged by global warming decarbonization became the most pressing task for our generation. In the light of this power electronics and the underlying semiconductor technologies are an essential tool for survival. In this sense GaN, SiC and Si are the three lucky stars of power. While all three technologies are inevitable for our future, each has its distinct character and use case. Starting with a recap of properties and manufacturing aspects, global trends for use cases and markets will be covered. A special focus will be on technology fusion (e.g. Si’C) to tackle conflicting requirements in power electronics.
Mark Nils Münzer
Infineon Technologies AG
Mark Muenzer received the Dipl.-lng. degree in electrical engineering from the RWTH Aachen, Germany, in 1997. As a development engineer for industrial power modules at Eupec GmbH he established industry leading power modules. In 2005 Mark transferred to Infineon Headquarter in Munich where he build up Infineon’s ElectricDriveTrain business. He initiated new product families for automotive power modules and related driver ICs. As a senior director Mark Muenzer was from 2012 until 2018 responsible for the newly found business segment EDT-Electric Drive Train. 2018 Mark Muenzer took over a position as Vice President for Innovation & Emerging Technologies in the Automotive High Power business line of Infineon. In September 2022 Mark was promoted to Distinguished Engineer.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
09:55 – 10:15
How does SiC Accelerate NEVs
Nowadays, more and more electric vehicles hit the road, and this is helping the world to reduce its carbon footprint and fight against ever increasing greenhouse effect. The EVs can reuse multiple types of power sources in the shape of electric power. Nowadays, new EVs require higher charging speed, higher output power, higher efficiency, longer milage, and as well as more comfortable riding experience, which come along with new technical solutions and new demands for semiconductor power devices. New generation SiC devices have adopted more and more innovative structures and cooler packages, which enable the EVs to go farther, charge faster and work more economy. We believe with accelerated adoption of SiC-based solutions, we will make power efficiency for a cooler planet.
Markus Mosen
WeEn Semiconductors
Markus has 20 years professional experience in managing globally Business and Product Lines in the Semiconductor Industry, developing, and setting up Sales & Marketing offices in China and Asia-Pacific, improving Market Share in different market segments including Mobile Solutions, Bipolar Power and Security. As well in his career he has been addressing different applications for Mobile Chipsets, Security and Chip Cards ICs, and more recently Power Discrete in Renewable Energy, Industrial and Consumer markets. Markus has 15 years living and working experience in Asia-Pacific (Singapore) and China (Beijing and Shanghai).
Company Profile
WeEn Semiconductors Co., Ltd was registered as a company on Aug 5, 2015. WeEn’s global footprint has an operational headquarter in Shanghai and wholly owned subsidiaries and centers in Jilin (North East China, Front-End Fabrication) , Hong Kong, Manchester (Research and Development) , Dongguan (Warehouse and Distribution), and cities throughout the world (Sales Offices and Customer Service Access). In September 2018, WeEn added its new, in-house, reliability and failure analysis laboratory in Nanchang, Jiangxi Province, China. With a heritage of over 50 years in semiconductor development and manufacturing, WeEn as a key player has focused on developing a wide and deep portfolio of industry-leading power products including Silicon Carbide Power Devices, Silicon Controlled Rectifiers and Triacs, standard and fast recovery Power Diodes, TVS and ESD Diodes and IGBT and Modules. All these products are widely used in the markets for telecommunications, computing, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. WeEn seeks to help our customers achieve improved cost and production efficiency and contribute to the development of global intelligent manufacturing.
10:20 – 11:00
Networking Break, Business Meeting
11:05 – 11:25
Virtual
Vehicle Electrification Catalyzing Power SiC Mass Commercialization
SiC brings compelling advantages to vehicle electrification including higher efficiency, fast charging, weight/volume reductions, and ultimately cost savings. Indeed, electric vehicle system insertion has emerged as the mass commercialization opportunity for SiC power semiconductors catalyzing their explosive growth. In this presentation, the fab models of the vibrant SiC manufacturing infrastructure will be introduced. In particular, the modest capital investments to manufacture SiC in mature fully depreciated fabs, alongside Si, leverage existing infrastructure and allow for SiC fabrication at Si economies of scale. Key barriers to SiC volume adoption will be identified and discussed. Finally, the impact of the US$150M PowerAmerica member-driven consortium in accelerating SiC and GaN power technologies will be summarized.
Victor Veliadis, Ph.D.
PowerAmerica
Victor Veliadis is Executive Director & CTO of PowerAmerica, a member-driven Manufacturing USA Institute of industry, universities, and national labs accelerating the commercialization of energy efficient silicon carbide and gallium nitride power semiconductor chips and electronics. At PowerAmerica he has managed a budget of US$156 million, and is now managing a US$64M renewal. Victor is also an ECE Professor at NC State University, an IEEE Fellow, a National Academy of Inventors Fellow, and an IEEE EDS Distinguished Lecturer. He has 27 issued U.S. patents, 12 book chapters, and 165 peer-reviewed publications to his credit.
Company Profile
PowerAmerica is a consortium of industry, universities, and national labs accelerating the commercialization of energy efficient silicon carbide and gallium nitride power semiconductor technologies. Our membership network spans the wide-bandgap technology ecosystem, from materials to device developers and fabs to module manufacturers to end users, as well as universities that educate and supply the future workforce. As we continue to grow, so does the diversity of our membership.
11:30 – 11:50
SiC – A Yin and Yang Perspective
Worldwide ramp-up of electromobility is resulting in a huge demand of wide bandgap semiconductor materials like silicon carbide. The hype for SiC is ongoing, the material allows higher efficiency in power conversion, but is currently at higher cost than conventional silicon-based technology. This presentation will focus on latest SiC innovations in material development, device structures and drivetrain concepts, and shows how, all put together, enables not only efficient, but most importantly affordable electrification. Efficient and affordable aspects need to get in balance like in Yin and Yang philosophy.
Ralf Bornefeld
Bosch
Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
11:55 – 12:15
Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective
The opportunities for WBG Power Semiconductors in automotive applications are recently widely discussed due to the immense growth potential of the new electric vehicle market. With the speed of market adoption, also the full supply chain needs to be developed.
This is not only the case within the semiconductor products supply from material – i.e. SiC epi substrates – to the chip and then to the module. It needs to be setup in the full industry value chain, from power generation via power transmission to the grid and charging infrastructure, then finally to the electric vehicle EV itself. This full industry value chain needs to be then differentiated depending on the final EV applications which have a wide variety of conditions to reflect: The volume driver is EV passenger cars, here already in a spread of technology requirements from high performance cars to standard models with less power needs. It becomes further differentiated, if we go up the EV types, e.g. in its intrinsic mass, from buses and trucks to electric locomotives.
The presentation will give an overview, how from a power electronics system provider view, the new power semiconductor technologies, i.e. SiC, drives the development of the new system concepts along the industry value chain applications due to the technological specific advantages of the new power semiconductor developments.
Rainer Kaesmaier, Ph.D.
Hitachi Energy Ltd.
Dr. Rainer Kaesmaier is a Managing Director for the Global Product Group Semiconductors of Hitachi Energy, leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes for market segments such as energy transmission & distribution, transportation & rail, renewable, industrial, and emobility. Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he resumed in 2018 the responsibility for ABB’s semiconductor business which is now Hitachi Energy. He is also a member of the board for Hitachi Energy Switzerland. Rainer was a member in various industries strategy committees in Europe and the US. Rainer holds a masters degree in physics from the Technical University Munich and a PhD in physics from the University Kassel in Germany. He is based in Lenzburg near Zürich, Switzerland.
Company Profile
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Hitachi Energy Switzerland Ltd.
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland
Phone: +41 58 586 14 19
Fax: +41 58 586 13 06
Email: salesdesksem@hitachienergy.com
www.hitachienergy.com/semiconductors
12:20 – 13:25
Networking Lunch
13:30 – 13:50
Semiconductors and Sustainability – Why Going Green is Chip Driven
Julian Fieres
ZF Friedrichshafen AG
Julian Fieres studied management but always loved technology equally as much and is now working towards a vision for zero emissions to leave a better planet for the next generation. He is the Vice President of Transformation, Strategy, Sustainability & Digitalization at the Division Electrified Powertrain at the ZF Group. This includes the areas of strategy, M&A, product planning, digitalization and sustainability. With a revenue of €10 billion and around 30,000 employees at Division E, his team and he strive to make an impact for a more affordable and more sustainable mobility of tomorrow every day.
Company Profile
ZF is a global technology company supplying systems for passenger cars, commercial vehicles and industrial technology, enabling the next generation of mobility. ZF allows vehicles to see, think and act. In the four technology domains of Vehicle Motion Control, Integrated Safety, Automated Driving, and Electric Mobility, ZF offers comprehensive product and software solutions for established vehicle manufacturers and newly emerging transport and mobility service providers. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate and enhancing safe mobility.
With some 157,500 employees worldwide, ZF reported sales of €38.3 billion in fiscal 2021. The company operates 188 production locations in 31 countries.
For further press information and photos, please visit: www.zf.com
ZF Friedrichshafen AG
Corporate Headquarters / ZF Forum
Löwentaler Straße 20
88046 Friedrichshafen
Germany
Phone: +49 7541 77 – 0
Email: postoffice@zf.com
13:55 – 14:15
High Accuracy SPICE Model Faciliate Optimized Design of Power Electronics with SiC MOSFETS
An accurate SPICE model is important for power electronics RD designers to pick up the right topologies according to applications and to optimize the layouts and choose the right components. Characteristics of SiC MOSFET are difficult to modeling using conventional Si-based physics models, and current commercially available models are mostly not accurate here or there, which reduced the usefulness of simulation and increased the complexity for achieving optimized designs. We’ve developed a SPICE model which can be applied to both planar and trench SiC MOSFET with very high accuracy, which will enable engineers to reach their target in an more efficient way.
Cheng-Tyng Yen
Fast SiC Semiconductor Inc.
Founder & CEO of Fast SiC Semiconductor. fastSiC is a fabless company dedicated on SiC power devices. Fast SiC Semiconductor has mass produced 650V~1700V SiC MOSFETs with its own proprietary designs, which have been adopted by leading customers in the field of server power supplies, charging piles and PV inverters. He has more than 10 years experiences on the design, process, qualification and application of SiC power devices. He currently serves as the TPC member of ISPSD and has published and filed more than 150 papers and patents.
Company Profile
Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.
General Telephone: +886-3-6590579
General Email: info@fastsic.com
Website: https://fastsic.com
14:20 – 14:40
How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges
SiC materials and devices are rapidly gaining acceptance and being the game-changer in EV market future. The expected performance enhanced by SiC devices perfectly matches the need for the next generation of electrical vehicles, especially for the 800V EV platforms with high efficiency and high power density requirements.
However, a number of challenges must be addressed before SIC can be widely adopted and pursue its promises. Three major challenges, i.e., Manufacture Cost, Device and Packaging, and System Integration need to take care of, not alone by semiconductor manufacturers but together with up and down streams to collaborate.
Today, by gathering worldwide experts and players here, the presentation will focus on the market overview of SiC in automotive, promises and challenges, and how can we accelerate the adoption and breakthroughs.
Tong Wu, Ph.D.
onsemi
吴桐,安森美(onsemi)中国区汽车市场负责人,上海交通大学半导体物理专业,数学专业辅修本科毕业,美国田纳西大学电气工程博士学位。吴博士在半导体封装,碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场,覆盖产品设计,制造,市场及应用,了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室(ORNL),以及车厂研发团队,共在国际会议和期刊上发表了 40 多篇论文,同时获得了多项 半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
14:45 – 14:50
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
In today’s world with its increasing demand in power semiconductor devices for electrification, e-mobility and enabling the flexible use of green energy it has become more and more imminent that it is not only necessary to involve new semiconductor materials (e.g. SiC, GaN) but also apply alternative manufacturing technologies to maintain the flexibility and reliability on the next generation of power semiconductor devices.
Electroless metallization processes from MKS are part of these alternative technologies for power semiconductor device manufacturing and have been established in the industry over past 10 years with their benefit of providing maskless metallization with higher throughput capability at a reduced Cost of Ownership compared to physical metallization techniques. We present these advantages on an example of an ENEPIG final finish that can be used as the basis for connecting the power semiconductor via wirebonding, soldering or sintering to the outside. The ENEPIG final finish can be obtained by using the Portfolio of MKS Electroless Metallization processes.
Dr. Stefan Pieper
mks | Atotech
Stefan Pieper has studied chemistry in Berlin, Germany where he also completed his PH.D. in analytical chemistry. In 2009 he joined Atotech as Application Scientist in the department of Semiconductor Advanced Packaging processes where he used the opportunity to gain deep insight in multiple electrochemical metallization processes and their characterization for semiconductor application. During his work as Application Scientist, he also spent over 3 years in the US where he optimized Cu dual damascene electrodeposition and Through Silicon Via plating. In 2020 he took over the position of Global Application Manager for Electroless deposition processes in semiconductor application at Atotech. In his current position he is leading a team that provides wet-chemical solutions for semiconductor metallization with the focus on power semiconductor.
Stefan Pieper博士曾在德国柏林学习化学,并在那里获得分析化学博士学位。2009年,他加入安美特,担任半导体先进封装工艺部应用科学家。利用这个机会,他深入了解了多种电化学金属化工艺及其在半导体应用中的特性。在担任应用科学家期间,他还在美国花了3年多的时间,优化了双大马士革铜互连工艺和硅通孔电镀工艺。2020年,他接任安美特半导体化学镀工艺全球应用经理一职。在目前的职位上,他领导的团队为半导体金属化提供湿制程解决方案,重点是功率半导体。
Company Profile
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
14:55 – 15:35
Networking Break and Business Meeting
Dr. KK Kuo
ATX Semiconductor (Suzhou) Co., Ltd.
Dr. KK Kuo is Vice President of ATX Group R&D Center, responsible for development of new technology, introduction of high technology. Dr. Kuo has over 22 years’ experience in semiconductor industry, good at new product development of RF modules, sensors, high reliability and intelligent automotive electronics, IoT IC and smart mobile communications. He holds more than 50 Chinese patents, dozens of U.S. and Taiwanese patents, and published many academic papers. Dr. Kuo is a member of IEEE Electronic Packaging Society, selected as “Science and Technology Entrepreneur of Jiangsu Province” in 2018. He graduated from Taiwan Sun Yat-Sen University with PhD in electrical engineering.
Company Profile
ATX Group, a worldwide well-known company to provide service of IC assembly and test, offering a full range of turnkey services that include package design, front-end engineering test, wafer test, package assembly and final test. Besides, ATX Group maintains a highly experienced and skilled engineering team dedicated to the research and development of the latest assembly technologies. ATX also invests the latest equipments and state-of-art facilities, making us a true extension of our customers’ manufacturing operations. Has a professional laboratory, with most advanced equipments and rich experience in semiconductor assembly and test, to provide customers with comprehensive solutions.
16:05 – 16:25
The Challenges in Getting a Reliable SiC Device
SiC power device is becoming crucial in new energy industry, especially in driving the BEV car to penetrate the market. However, comparing with Si devices, SiC devices are prevailing their applications, since making SiC devices reliable is still challenging. The reliability issues might arise from substrates, epi, processing, assembly, even the final test and application. In this presentation, the defects from different processing stages are sampled, and their impacts on device reliability are outlined. It can be seen that effective tools and more reliable data are needed for screening those flawed devices. In YASC, we are introducing new tools, accumulating data, and know-how to make the SiC device reliable and robust.
Dr. Hongchao Liu 刘红超
Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
16:30 – 16:50
GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges
The mobility industry is living through the most dramatic changes since the invention of the internal combustion engine and the standardization of the manufacturing process. Society and governments are looking for zero-emission transport, while car makers are seeking the most efficient way to manufacture low-cost and long-distance electric cars. In this context, inverter efficiency became the critical performance parameter, and semiconductors with low loss switching energy, such as SiC and GaN are getting into the spotlight. In this keynote the successful development of a three- phase GaN-based inverter reference design with 400V bus voltage and 400ARMS current is discussed and the results are presented. The major steps on the way from semiconductor chip design, through module development and to full current inverter operation are discussed, chosen solutions explained and results are presented. The main challenges include robust high current > 100A GaN die, with low parametric shift because of repetitive unclamped switching tests up to 1600V; driving 4 dies in parallel to obtain equal current sharing, smooth waveform at needed current and obtaining low voltage overshoots on the gate and on the drain.
Jim Jian
VisIC Technologies
Jim Jian is Vice President of Sales for Asia Pacific and North America at VisIC Technologies, responsible for all aspects of Sales and Business Development of VisIC’s GaN semiconductors to Automotive OEMs and Tier-1s. Jim has over 25 years of experiences in semiconductor industry, spanning across Sales, Business Development, Product Management, Applications Engineering, and Design Engineering at various semiconductor companies including Broadcom, Provigent, Lucent Technologies. Jim graduated from California State University at San Jose with a BSEE degree.
Company Profile
VisIC Technologies has a decade of experience in creating, developing, and advancing concepts based on cutting-edge Gallium Nitride-on-silicon technology. We develop solutions that help reduce energy waste in power conversion systems, with a focus on battery electric vehicles (BEV). Our patented D3GaN technology – Direct Drive D-mode GaN – addresses the automotive industry’s cost, supply, sustainability, reliability, quality, and performance needs.
With our D3GaN technology, BEV can save up to 50% on power losses over the driving cycle of the electric car, thus reducing battery cost and increasing driving range and performance. This solution also reduces the cooling system requirements and the size of the BEV inverter.
VisIC Technologies has produced the first GaN-based transistors used in automotive inverters. By utilizing the GaN on Silicon technology, we address the supply chain concern as we are using existing semiconductor high-volume production lines.
Moderator
Dr. Hongchao Liu 刘红超
Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
Panelist
Cheng-Tyng Yen
Fast SiC Semiconductor Inc.
Founder & CEO of Fast SiC Semiconductor. fastSiC is a fabless company dedicated on SiC power devices. Fast SiC Semiconductor has mass produced 650V~1700V SiC MOSFETs with its own proprietary designs, which have been adopted by leading customers in the field of server power supplies, charging piles and PV inverters. He has more than 10 years experiences on the design, process, qualification and application of SiC power devices. He currently serves as the TPC member of ISPSD and has published and filed more than 150 papers and patents.
Company Profile
Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.
General Telephone: +886-3-6590579
General Email: info@fastsic.com
Website: https://fastsic.com
Panelist
Jiemin Cao 曹杰敏
Hangzhou Silan Microelectronics Co., Ltd.
Graduated from Shandong University in 2003
2003~2004 engaged in process development of Ningbo SMIC(Riying&IMP)
From 2004 to today , I worked in Silan Microelectronics, respectively engaged in chip testing, FA&RA ,quality director, Power module product &assembly development .
Now is VP of Silan, in charge of: power module product &package development, IGBT/SIC chip platform management, product quality engineering, RA&FA, etc.
Company Profile
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.
Company Products & Services
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
Panelist
Dr. Hongliang Shi
Hunan Sanan Semiconductor Co., Ltd.
Dr. Shi Hongliang, Director of SiC Application of Hunan SANAN, is responsible for customer requirement introduction, system level application solutions, technical support and new product definition. He has 10+ years of R&D experience in system application design of SiC power devices, optimized design of high frequency high power magnetic devices, etc. He holds a PhD degree in Electrical Engineering from Tsinghua University.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Company Products & Services
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
17:40 – 17:50
Closing Remarks and Lucky Draw
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