Redefining Semiconductor Excellence: Innovation, Sustainability, and Global Transformation

Topic: AI Technology and Advanced Packing Innovations

07:30 – 08:50

Registration

PART 4: AI / Power Devices Applications in Humanoid Robot, eVTOL and Date Center Power

09:00 – 09:05

Welcome speech by Day 2 moderator

Wilson Hong

Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering

NIO

09:05 – 09:25

Humanoid Robotics

09:30 – 09:50

eVTOL marketing trend

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

09:55 – 10:15

AI Chip 
CIP United 芯联芯 

10:15 – 11:15

Networking + Coffee Break

11:15 – 11:35

Henryk Dabrowski

SVP of Global Sales

Cambridge GaN Devices

11:40 – 12:00

Data Center Power

Reserved

Infineon Technologies AG

12:05 – 12:25

Heming Li

Product Marketing VP

Alpha Power Solutions (Shanghai) Ltd.

12:25 – 13:45

Buffet Lunch

PART 5: Power Packaging Innovations

13:45 – 14:05

Embeded Chip Packaging topic
AKMMV 安捷利美维 / 黄双武, Technology Expert 技术专家 

14:10 – 14:30

Gang Jung

VP & GM Automotive BU & Corp. Quality

JCET

14:35 – 14:55

Reserved

15:00 – 15:20

Hidenori Abe

CTO, Semiconductor Materials, Resonac Holdings Corporation

Resonac Corporation

15:25 – 15:35

Reserved

Semikron Danfoss

15:35 – 16:30

Networking and Coffee Break

16:30 – 17:15

Panel Discussion

Topic: Innovations in Power Electronic Packaging: Pathways to Energy Efficiency and Reliability 

 

Moderator

Onto Innovation

Panelist

Jun Li

General Manager (FAE Head Quarter), Shanghai

ROHM Semiconductor

PART 6: Investment & Venture Capital: Fueling Future Innovation

17:15 – 18:00

Panel Discussion: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem

Moderator

Alan Zhou, Ph.D.

CEO, Shanghai

Pixelworks

18:25 – 18:35

Closing speech by moderator

Wilson Hong

Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering

NIO

18:35 – 19:30

Networking and Drink Reception

The end of Day 2 

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