27-28 August 2025
Suwon
22-23 September 2025 - Shanghai
07:30 – 08:50
Registration
09:00 – 09:05
Welcome speech by Day 2 moderator
Wilson Hong
NIO
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
09:05 – 09:25
Humanoid Robotics
09:30 – 09:50
eVTOL marketing trend
KeDa Xu
Falcon Sichuan Aviation Technology Co. Ltd
Mr. Xu Keda holds a master’s degree from Renmin University of China and brings over 20 years of experience from the General Armament Department.
He has deep insights into both the Chinese and global aviation engine markets, which allow him to set a clear strategic direction for the company and to navigate opportunities in today’s complex, fast-changing environment.
许可达,中国人民大学硕士毕业,曾在总装工作20余年,对中国乃至世界航空发动机市场 的现状、趋势有着深刻理解,清晰定位企业发展方向,助力企业在复杂多变的市场环境中把 握发展机遇。
Company Profile
Falcon Aerospace Power Group, founded in 2020, specializes in the research and development, production, sales, and maintenance of power systems for general aviation and low-altitude applications. The company has established an R&D center in Zhuzhou, Hunan, and a heavy-fuel piston engine assembly base in Zhuhai, Guangdong. As of June 2025, Falcon has been recognized as a “Specialized and Innovative Enterprise” in Sichuan Province and as a National High-Tech Enterprise, holding over 40 patents. With leading capabilities in engine technology development, the company has launched three product lines—piston engines, turboprops, and hybrid power systems—providing practical power solutions for various types of low-altitude aircraft.
09:55 – 10:15
AI Chip
CIP United 芯联芯
10:15 – 11:15
Networking + Coffee Break
11:15 – 11:35
Henryk Dabrowski
Cambridge GaN Devices
Company Profile
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
11:40 – 12:00
Data Center Power
Reserved
Infineon Technologies AG
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
12:05 – 12:25
Heming Li
Alpha Power Solutions (Shanghai) Ltd.
Company Profile
Alpha Power Solutions (APS) is China’s leading supplier of wide band gap power semiconductor devices. It is one of the pioneering companies in China to engage in the research and development of SiC devices and is the first to successfully use 6-inch SiC technologies , helping China make a breakthrough in this field.
APS adopts the CIDM strategy and has successfully deployed applications in leading domestic companies in the renew energy, photovoltaic energy storage, and EV-charging industries, providing them with Silicon carbide products and solutions for carbon neutrality.
Company Products & Services
SiC MOSFET, SiC Diode
12:25 – 13:45
Buffet Lunch
13:45 – 14:05
Embeded Chip Packaging topic
AKMMV 安捷利美维 / 黄双武, Technology Expert 技术专家
14:10 – 14:30
Gang Jung
JCET
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
14:35 – 14:55
Reserved
15:00 – 15:20
Hidenori Abe
Resonac Corporation
Hidenori Abe CTO for semiconductor materials, Resonac Holdings Corporation Executive director, Electronics Business Headquarters, Resonac Corporation. He is leading electronics materials R&D and strategy for semiconductor, substrate and display. Until 2023, he was the head of Electronics R&D Center and Packaging Solution Center, which is open innovation hub in advanced packaging development. I launched JOINT2, new advanced packaging consortium targeting 2.xD and 3D package in 2021.Prior to the above mission, he have been a General Manager of CMP Slurry Business Sector for three years. Before that he was a Manager of Marketing Promotion Group in Innovation Promotion Center at Hitachi Chemical (HC) for 2 years. When the career, he was promoted new R&D projects, especially targeting new business field using new technologies, and also to promote developing R&D products. As a side note, HC is one of the merged companies of Resonac. Hidenori Abe was Manager of Business Development Group in Packaging Solution Center at HC for 1 year with responsibility to promote open laboratory to partners such as customers and equipment makers, responsibility of marketing wearable related materials. Before that, he was epoxy molding compounds (EMC) engineer. During his 16 years carrier as engineer, he spent time doing responsibility of development of non-conductive carbon, green EMC, Cu wire compatible EMC, wafer level compression compounds, power module EMC and so on. His Cu wire compatible EMC development work contributed to the promotion to Cu wire conversion through several published papers. He received a master degree in chemical engineering field from Tokyo Institute of Technology, Japan and a master degree at the EMBA course from Oxford, UK.
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
15:25 – 15:35
Reserved
Semikron Danfoss
Company Profile
Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems.
In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today.
We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity, and service to deliver best-in-industry performance and for a sustainable future.
15:35 – 16:30
Networking and Coffee Break
16:30 – 17:15
Panel Discussion
Topic: Innovations in Power Electronic Packaging: Pathways to Energy Efficiency and Reliability
Moderator
Onto Innovation
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panelist
Jun Li
ROHM Semiconductor
JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Silan, Nexperia, CuNex GmbH, UNT
17:15 – 18:00
Panel Discussion: The critical role of investment and venture capital in driving breakthrough technologies and supporting the growth of China semiconductor ecosystem
Moderator
Alan Zhou, Ph.D.
Pixelworks
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Future X, Longdin Investment, SCVC, ZXholdings
18:25 – 18:35
Closing speech by moderator
Wilson Hong
NIO
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
18:35 – 19:30
Networking and Drink Reception
The end of Day 2
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