27-28 August 2025
Suwon
07:30 – 08:30
Registration
08:45 – 09:00
Welcome Speech
Salah Nasri
I.S.E.S.
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
Lucilla Sioli
EU Commission
Ms Lucilla Sioli is the Director for “Artificial Intelligence and Digital Industry” within Directorate-General CONNECT at the European Commission. She is responsible for the coordination of the European digitisation of industry strategy and for policy development in the areas of artificial intelligence (AI) and semiconductors, including regulatory approaches such as the AI Act and the Chips Act. The directorate also supports R&D&I in key digital industrial technologies including microelectronics, photonics, robotics and AI. Lucilla holds a PhD in economics from the University of Southampton (UK) and one from the Catholic University of Milan (Italy) and has been a civil servant with the European Commission since 1997.
Company Profile
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
09:25 – 09:45
Keynote
The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem
The worldwide demand for chips grows rapidly and is expected to double by 2030. Europe must ensure its security of supply within the global industrial value chain. The EU Chips Act aims to build on Europe’s strengths and address outstanding weaknesses. It will mobilise more than € 43 billion of public and private investments to strengthen the semiconductor ecosystem, production capacities and resilient supply chains. And finally, it will set measures to prepare and respond to future supply chain disruptions, together with EU Member States and our international partners. With this Europe is laying the foundations for technologies that are not yet available there today. Research and technology organizations play a strong role as partnerships with like-minded partners do. And besides all this, one of the most important factors is the sufficient availability and training of skilled workers.
Dr. Thomas Morgenstern
Infineon Technologies AG
Thomas Morgenstern is Executive Vice President of Infineon Technologies AG. He was born in Mosbach (Germany) in 1968. Thomas Morgenstern studied chemistry at the Heinrich-Heine-University Duesseldorf and received his PhD in 1998. He started his career in 1998 at Semiconductor 300. Before joining Infineon again in 2021, he held various positions at Biotronik SE & Co KG, BOSCH and Globalfoundries.
Positions within the company
Further positions
2017-2020 2013-2017
2010-2013 2009-2010
1998-2009
Globalfoundries Dresden
Senior Vice President and General Manager Fab 1
BOSCH Reutlingen and Souzhu
Senior Vice President Manufacturing and Technology
Globalfoundries Dresden Director Engineering
Biotronik SE & Co KG
Director Manufacturing Active Implants
Qimonda/ Infineon Dresden
Managing functions in various positions
Membership of Supervisory Boards
Infineon Technologies Dresden Verwaltungs GmbH, Neubiberg, Germany (Head of Supervisory Board)
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
09:45 – 10:05
Future of SiC Power Modules in Automotive and Industrial Applications
The power electronics world is developing from utilizing Si devices towards SiC devices. Power density is one of the key factors in power electronics and with the right packaging technologies, great advantages can be obtained benefitting the system level significantly. Claus Petersen will touch on the importance of SiC, and the growing adaptation of SiC in Automotive applications as well as in industrial and renewable applications. In addition he will focus on packaging technologies to leverage SiC devices to its maximum potential.
Claus A Petersen
Semikron Danfoss
When SEMIKRON and Danfoss Silicon Power merged in August 2022 creating Semikron Danfoss, The Ultimate Partner in Power Electronics – a 1bn Euro company with around 4.000 employes – Claus A. Petersen was named president.
Prior to the merger Claus Petersen has been responsible for Danfoss Silicon Power since 1998, where he successfully grew the business to be a top 3 supplier of Power Modules in Europe.
Claus has been part of the Danfoss Group since 1984, working in several areas of the business. However, he has spent the latter 20+ years in the Drives business, working in sales and marketing prior to starting up the Danfoss Silicon Power business.
Company Profile
Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems.
In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today.
We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity, and service to deliver best-in-industry performance and for a sustainable future.
10:05 – 11:05
Networking Break and Business Meetings
11:05 – 11:25
Volkswagen Group – Power Electronics In-House Development
Volkswagen Group Components with its more than 70.000 employees in over 60 factories worldwide is one of the biggest Tier 1 suppliers in the world – a hidden gem under the roof of the Volkswagen Group. With our dedication to developing the key parts of power electronics in-house – down to the level of semiconductor specification – we will enhance our product portfolio, change supply chains sustainably and disrupt automotive electronics’ products and processes.
This keynote will give an insight into the future journey of Volkswagen Group Components by outlining the technical approach of our next generation inverter platform. The motivation behind the increased development depth will be highlighted and the importance of strong and new ways of collaboration between all players in the automotive value chain will be shown. We create future mobility – for generations to come.
Alexander Krick
Volkswagen Group Components
Company Profile
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
11:25 – 11:45
Innovative Traction Drives with SiC Semiconductors
ŠKODA ELECTRIC is a renowned supplier of traction equipment for the SKODA Group and other important finalists of rail vehicles. For many electrical equipment applications, we use HV IGBT 6.5 kV/1000A transistors in large quantities (EMU trains ). In 2016, we built the first sample of a 200 kW SiC traction inverter. In 2019, we tested a traction drive for a new metro train for 1500V DC system and HV SiC technology (3.3 kV/ 750A) with a new IPMSM traction motor with natural cooling. The goal of the modern drive was to increase the reliability and reduce the maintenance of the traction drive, to reduce the weight and above all, due to the high efficiency of the traction drive, to reduce the electricity consumption of the train. The type tests of the train confirmed all these expectations.
The use of SiC technology leads to fantastic results in the field of electromobility, but it must also be combined with other modern elements of the traction drive. An example is the new ŠKODA ELECTRIC traction drive with a 5-phase IPMSM motor with third harmonic injection and a SiC inverter with a weight of 14.5 kg and a maximum power of 600 kW. Based on an objective measurement, this drive brings an electrical energy saving of 27.1% compared to an IGBT inverter and an asynchronous traction motor.
Dr. Ladislav Sobotka
Skoda Electric
Ladislav is the Director of Development and Engineering at ŠKODA ELECTRIC, part of the ŠKODA Group. He joined Skoda in 1982 to develop electric locomotives, where he worked on traction drives. In 1996 he developed a new traction drive for the City Elephant double-decker unit (3 kV DC supply system ) with new HV IGBT transistors and a double star asynchronous traction motor. He also worked extensively on the development of trams and subway vehicles. He has been in the management of ŠKODA TRANSPORTATION since 1994, and in the following years he served as Technical Director and member of the Supervisory Board of ŠKODA TRANSPORTATION. In 2003, he founded ŠKODA ELECTRIC and was a member of the Board of Directors in charge of the technical departments. At ŠKODA ELECTRIC, he has been involved in a number of foreign projects, such as a traction drive for locomotives for Turkey in cooperation with the Korean company Hyundai-Rotem and a groundbreaking traction drive for a subway train for the Chinese city of Suzhou. Ladislav works very intensively with universities and is a member of three scientific councils. Since 2015 he has been working on SiC semiconductors and high efficiency traction drives.
Company Profile
We are Škoda Electric, belonging to the Škoda Group. We continue in the tradition of the one hundred and sixty-year tradition of Škoda plants and we are an experienced manufacturer of traction drives and motors for locomotives, trams, EMU, metro, mining vehicles.
11:45 – 12:05
Partnership as a Foundation for Decarbonization
Volvo Group is on a transformation journey with an ambitious decarbonization roadmap. Being a pioneer in electrification and with clear net-zero targets, it is important to transform the whole ecosystem together with a holistic view. While seizing this once in a lifetime opportunity, we make sure that we continue to provide best-in-class products that let our customers reach that extra mile. Power semiconductors such as SiC and GaN are essential foundational building blocks that let us stay ahead and keep our innovation values. As we always say, our suppliers are our business partners, and we firmly believe that partnership is the new leadership. In this journey, we want to work together with our Tier-1s and semiconductor companies as key partners in developing these leading-edge technologies.
Vishnu Kumaresan, Ph.D
Volvo Group
Vishnu Kumaresan as a Segment Leader drives Volvo Group’s Semiconductor strategy. He has a doctorate degree in semiconductor field and has specialized in strategy development. Vishnu has more than 10 years of experience in the semiconductor, software, and display technologies before joining Volvo group.
Company Profile
The Volvo Group is one of the world’s leading manufacturers of trucks, buses, construction equipment and marine and industrial engines. The Group also provides complete solutions for financing and service. The Volvo Group, with its headquarters in Gothenburg, employs about 100,000 people, has production facilities in 18 countries and sells its products in more than 190 markets.
12:05 – 12:25
Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive
For 30 years, Soitec has been designing and manufacturing semiconductor engineered substrates. Soitec is addressing markets for three key megatrends such as 5G/6G, Electrical Vehicles (EVs) and Artificial Intelligence. We foresee EVs to become a significant new growth driver by capturing the two main trends in this market: the Digitalization of the car, and the Electrification of mobility.
By 2030, more than 45 million of cars sold will be EVs. Thanks to its performances, by 2025 it is expected that more than 50% of EVs will use Silicon Carbide (SiC) in their power electronics systems. Silicon Carbide brings several advantages over silicon when it comes to power electronic devices. These include a higher breakdown voltage, higher operating temperature, and higher thermal conductivity that helped imposing SiC as preferred option for inverter for leading EVs. Although amazing progress has been demonstrated past 15 years regarding silicon carbide substrate properties and processing, major limitations remain for a straightforward transition to large volume.
Smart-Cut™ applied to SiC, generating SmartSiC™ engineered substrates aims to accelerate silicon carbide adoption and brings best of SiC by combining high conductivity ultra-flat pSiC and high quality layer of mSiC for device.
Performance wise, this unique vertical structure allows a boost in electrical performance and efficiency of power devices such as MOSFETs and diodes. It brings as well flatness and process simplifications advantages that will be discussed.
On sustainability front, SmartSiC™ is a greener route to volume by targeting CO2 footprint equivalent to silicon wafers, mostly thru vast reuse of donor wafers, obtained at very high thermal budget, for more than 10 SmartSiC wafers for each donor.
This route is also lowering risk lowering capex intensity and speeding 200mm SiC wafers introduction by two years.
All these performances had been demonstrated for manufacturing and triggered the decision for a new fab in Soitec with first production in September 2023. .
The presentation will describe the SmartSiC process and latest results on wafers and devices and how SmartSiC™ is enabling major impacts on SiC business
Ph.D. Emmanuel Sabonnadière
Soitec
Since July 2021, Mr Sabonnadiere is Vice-President of the Division Automotive & Industrial of Soitec. He is also in charge of the Strategic Program SiC.
From September 2017 to July 2021, Mr Sabonnadiere was CEO of CEA-Leti, one of the most innovative Labs in the industry of microelectronics and biotechnology, based in Grenoble (France). Previous two years, Mr Sabonnadiere was CEO & Chairman of the Business Group Professional of Signify, former Philips Lighting (Amsterdam). From 2014 till 2016, he served as Senior Associate of MidCap Private Equity firm named Gimv (Paris, Antwerpen, Munich, Den Haag).
Previously in his career, Mr Sabonnadiere was CEO & Chairman of General Cable Europe & Africa (Barcelona). From 2005 till 2008, he was CEO of NKM Noell Gmbh, the German branch of the group REEL. Mr Sabonnadiere was vice-president of the Distribution Transformers division of Alstom T&D for 5 years. He began his career in 1992 with Schneider Electric holding various positions including that of Managing Director of equipment units for 10 years.
Mr Sabonnadiere has a strong innovation and technological background combined with a successful business track record over decades and some key innovations adopted into the markets. With 30+ years of executive leadership of large operations, he produced high level performances of operating margins & results and generation of cashflow. He gained a sound experience of change management in large multi-cultural organizations to adapt to new markets conditions and dynamics in European and International environments. He designed and set-up ambitious strategic plans including some merge & acquisitions.
Mr Sabonnadiere believes in operational excellence, innovations in technology, talents management and enthusiasm in leadership. His sound experience in the European industry make him a highly knowledgeable and respectful Board member.
Mr Sabonnadiere obtained a PhD in physics (France), and an engineering degree in Information Technology (France). He holds an MBA (France)
Mr Sabonnadière is a fully qualified instructor at the ski school in Les Ménuires, and member of the Advisory board of IAC Consultant and Sparring Capital firm.
Company Profile
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
12:25 – 12:45
Process Control Trends for WBG Power Devices
The automotive industry is continuing its secular shift towards more electrification, computing, and automation.
Consequently, both the number of semiconductors used in automotive, and their complexity are rapidly growing to support new applications. The very high standards for automotive reliability are requiring the adoption of advanced process control and inline screening methodologies.
An additional challenge in automotive electronics is the introduction of wide bandgap (WBG) materials, like silicon carbide (SiC) or gallium nitride (GaN), which are essential to the proliferation of electric vehicles because of their improved power efficiency over silicon.
I will start my presentation by outlining the yield challenges that WBG power manufacturers face while ramping production to meet industry’s skyrocketing demand. Low yield is impacting both fabrication costs and product reliability and can pose a serious threat to the EV adoption in the market.
A high amount of manufacturing costs and yield loss comes from the substrate and epitaxy processes, even before device fabrication starts, so process control for these initial steps is very critical and requires specialized inspection and metrology tools.
During the device fabrication, new processes are introduced, like SiC trench etch, which requires innovative process optimization as well as advanced metrology capability.
Moreover, the adoption of Inline Part Average Testing (I-PAT®), which has already been introduced on silicon-based automotive chips, is expected to increase during SiC device manufacturing to mitigate reliability concerns derived from low yield and substrate immaturity.
Finally, new wafer singulation, such as plasma dicing, and bare die inspection will be needed to limit the occurrence of edge die cracks and delamination issues caused by the current mechanical and/or laser dicing technologies.
Keywords: Electrification, Yield, Reliability, Inline Screening, Silicon Carbide
Oreste Donzella
KLA
Oreste Donzella serves as Executive Vice President and Chief Strategy Officer at KLA Corporation, leading key corporate growth initiatives and working closely with external stakeholders, such as financial investors and end customers in the broad electronics ecosystem.
Prior to his current role, Oreste was Executive Vice President, managing the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which included multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.
Previously, Oreste was the Chief Marketing Officer (CMO) of KLA. In this role, he oversaw corporate marketing activities, market analytics and forecast, and companywide collaborations with the broad electronics industry.
In the years before his CMO role, Oreste led the world-wide field applications engineering team, and was responsible for Customer Engagement projects and product portfolio optimization for wafer inspection platforms at KLA.
Previously, Oreste was Vice President and General Manager of the Surfscan and SWIFT divisions at KLA-Tencor. In these positions, he was responsible for the unpatterned wafer inspection, wafer geometry, and macro inspection business, overseeing new products development, sales, and marketing activities, customer support, and ultimately, division financial performance (P&L).
Oreste brings 30+ years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent almost seven years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.
Oreste holds various patents and is featured in several technical publications.
In 2020, Oreste was awarded with VLSI Semiconductor All Star for “charting KLA’s path into new markets related to More than Moore semiconductor technologies”
Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy .
Company Profile
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
12:45 – 14:00
Buffet Lunch
14:00 – 14:20
The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors
Gayn Erickson, CEO of Aehr Test Systems, to discuss the need to identify early “infant mortality” failures and the importance of Stabilization Stress and Burn-In during the production of Wide Bandgap (WBG) Semiconductors. Areas of focus will include what types of stress and burn-in conditions are used to accelerate extrinsic / early life failures and to stabilize threshold voltages of high power silicon carbide MOSFETs and why this is needed. Mr. Erickson will also discuss the impact of the transition from single die Packages to multi-die modules on the test and burn in production flows and equipment.
Gayn Erickson
Aehr Test Systems
Gayn Erickson is Chief Executive Officer & President of Aehr Test Systems (Nasdaq: AEHR) in Fremont, California, a world leader in Semiconductor Test and Burn-in solutions. Prior to this, Gayn was Executive Vice President of Verigy, Inc. and Agilent Technologies, with responsibility for their Memory Test Business Units. He has over 35 years of experience in the Semiconductor Capital Equipment market. With very high market and technology domain knowledge in defining, developing, manufacturing, and marketing semiconductor capital equipment solutions, Gayn has led the definition and development of over a dozen semiconductor test and burn-in systems and solutions at Hewlett-Packard, Agilent Technologies, Verigy, and Aehr Test Systems. Gayn received a BSEE degree from Arizona State University
Company Profile
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions.
Moderator
Ralf Bornefeld
Bosch
Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Panelist
onsemi
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Panelist
Jianwei Dong
SK Siltron CSS
Mr. Dong is a growth-minded business executive with extensive experience in leading changes, developing organizations and people, and driving innovations. He was the general manager of the compound semiconductor solutions business unit (BU) at DuPont Electronics and Imaging prior to SK siltron’s acquisition of the BU. Post-acquisition, Mr. Dong was appointed CEO of the new SK siltron css business. Prior to that role, he was the global marketing director for the semiconductor advanced packaging technologies BU at Dow Electronic Materials. This was a continuation of Mr. Dong’s work as a marketing leader at Dow since 2012. Before that, he was in a product development role with Dow and worked as a R&D scientist at Rohm and Haas Electronic Materials in both the US and Hong Kong.
Mr. Dong’s education began at Jiao Tong University in Shanghai, China, where he received both a Bachelor of Science degree and a Master’s degree in materials science. From there, Mr. Dong attended the University of Minnesota and received his Ph.D. in Materials Science in 2003. He later completed a five-module executive education program on leadership development (PLD) from Harvard Business School.
Company Profile
At SK siltron css, we provide the global compound semiconductor industry with a reliable source of leading-edge, production-proven, high-crystal-quality silicon carbide (SiC) wafers and epitaxy services.
Our SiC technology and manufacturing expertise extends from crystal growth through wafer fabrication and epitaxy. We focus our R&D efforts on finding environmentally friendly solutions using renewable energy and sustainable manufacturing practices. Our latest-generation, wide-bandgap semiconductor materials are designed to help customers meet global demands for improved environmental sustainability, increased electricity demand and higher energy efficiency.
Drawing on decades of experience providing SiC materials and products, we continue to grow and double our capacity year over year. As a dedicated materials supplier, we focus on providing wafers and materials for critical compound semiconductor applications. We do not make devices or compete with our customers. We are backed by the resources and purchasing power of SK siltron.
Panelist
Roman Strasser
Volkswagen Group Components
Company Profile
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
15:00 – 16:00
Networking Break, Business Meetings and Refreshments
16:00 – 16:10
How Laser is Enabling The Power Semiconductor Roadmap
To keep up with the drive for improved electrical performance of Power Semiconductor devices, chip designers are looking at thinner wafers and moving from Si to SiC and GaN wafer substrates. Due to the increased electrification in our daily life we see a strong increase in power semiconductor applications for mobile, automotive, industrial, renewable energies, etc. As a result of this increase in volume, the market is looking at new wafer singulation technologies to keep up with the technology requirements as well as the cost. ASMPT developed a patented Ultra-Violet (UV) nano second laser dicing technology for thin SiC wafers (100 – 150 μm), which allows customers to continue their technology roadmap and which is competitive from a Cost of Ownership (CoO) to the conventional saw blade dicing technology. Blade dicing is encountering yield issues and due to the hardness of SiC, high consumable cost and low throughput. During our presentation at ISES EU Power 2023 we will share the laser technology concept used and the results achieved for dicing of thin SiC power semiconductor devices including reliability data and CoO.
Key words: SiC, Dicing, Power Semiconductors, Thin Wafer, Multiple Beam
Jeroen van Borkulo
ASMPT Limited
Jeroen van Borkulo received a Bachelors’ degree in Applied Physics – specialized in photonics from the Hague University of Applied Sciences and followed Executive Program at Nyenrode Business University.
Joined ASMPT in 2014 in the role of product marketing manager. In his current role leads the business development and marketing team for ASMPT’s Laser dicing and grooving BU. Jeroen has over 20 years’ experience in laser material processing applications in the semiconductor industry.
Company Profile
ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
16:10 – 16:20
Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?
The development of new technologies, such as GaN, have created the opportunity for more efficient and higher voltage/power performance in switching and power management circuits. GaN has high cutoff frequencies, low on-state resistance, and high breakdown voltages, enabling increased power handling densities for applications from 100 to >600 volts.
Assessment of material and processes used in device fabrication is a key aspect for fielding reliable product to the market. Process changes for cost and performance improvements must be vetted for reliability performance variance.
Reliability testing of switching power devices requires the balance of several competing challenges. The first is to understand the intrinsic reliability of the fabricated device. In order to quickly assess this, a “soft-switching” methodology may be useful.
Product or sub-system qualification, including extrinsic effects, is needed under application conditions. Assessment of product quality for application specific use is typically done using “hard-switching” tests to close approximation of the application.
The challenge for the device manufacturer is defining and implementing the reliability and qualification test regime that is both cost effective but industry applicable to the standards required. Where are we at in the journey to find a reliable and qualified part?
Roland Shaw
STAr Technologies
Mr. Shaw is President of Accel-RF Corporation and has over 40 years’ experience in RF/microwave test system development. He is an acknowledged industry leader in developing compound-semiconductor accelerated life test methodologies, and co-authored the “Gallium-Arsenide (GaAs) MMIC Reliability Assurance Guideline for Space Applications”, released by NASA-JPL in 1996 as the “guidebook” for space qualification of Gallium-Arsenide MMICs.
Mr. Shaw previously held management and technical positions at Lockheed Martin, Texas Instruments, and was Program Manager on several key projects for NASA-JSC. He has an MSEE from Southern Methodist University (SMU) and BSEE from Texas A&M University.
Company Profile
STAr Technologies, established in year 2000 and headquartered in Hsinchu Taiwan, with more than 800 employees servicing customers worldwide. We provide test technologies including software, instruments, automatic test equipment, burn-in systems, probe cards, and outsourcing test services to meet demanding challenges within the semiconductor industry. Our expertise extends across parametric electrical tests (E-test), wafer-level and package-level reliability (WLR & PLR), mixed signal tests, RF and power ICs burn-in, MEMS probe cards, load boards, test interfaces and sockets.
Accel-RF Instruments and STAr-Edge Technologies, located in California, provides world leading test equipment for performing high voltage-current, and wide temperature capabilities for long-duration reliability testing and burn-in qualification of compound semiconductors, such as Gallium-Nitride (GaN) and Silicon-Carbide (SiC). These test systems have enabled successful technology developments, product launches, and industry adoption of GaN transistors and MCMs into the aerospace, military, and commercial wireless, and power electronics markets, among others.
Sales Contact Information
Phone: +1-408-416-0777
E-mail: Sales-US@STAr-Quest.com
Website: www.STAr-Quest.com
16:20 – 16:30
Addressing Testing Challenges for Power Modules and Three-Level Inverters
The use of renewable energy sources is one of the key issues when it comes to developing the next-generation worldwide energy supply. The need for improvements in efficiency and reliability is leading to the increasing diffusion of three-level IGBT inverters: featuring smaller output voltage steps than two-level topologies, they provide a cleaner output waveform, resulting in a more effective switching frequency. Because the IGBTs are subjected to a lower bus voltage, lower-voltage modules can be used. For this reason, three-level topologies are being widely used in various applications requiring high voltages, including photovoltaics and wind power inverters. Compared to the equivalent two-level modules, these products pose some specific challenges in regard to their production testing. In particular, they require to operate with multiple programmable and independent drivers to condition each section of the module under test properly, in order to measure all the working parameters. In addition to that, special attention must be paid to the design of a signal path with minimal stray inductance, in order to minimize voltage overshoots during signal commutation. These, and many other technological challenges, have been faced and solved by SPEA over the past 45 years. The DOT800T test platform represents the state-of-the-art equipment that has made SPEA a global leader in testing power products.
Elia Petrogalli
SPEA
Elia Petrogalli received his Degree in Mechanical Engineering from Polytechnic of Milan in September 2015.
While obtaining his MSc in Mechatronics and Robotics Engineering he worked in the R&D team of a local company in Milan active in the Biomechanical design field. During this experience he was in charge of designing and programming closed-loop control systems for biomedical applications based on mechanical vibrations.
After receiving his MSc in Mechatronics and Robotics, he joined Keyence Corporation Japan as a Technical Sales Engineer, being in charge of sales and service operations for high accuracy measurement systems.
After this international experience in artificial vision, Elia was employed by SPEA in 2019 as a Sales Manager for the Semiconductor and MEMS Business Unit for the Chinese region. Together with the local team of SPEA China, Elia helped in developing the business for Semiconductor (with particular focus on Power Applications for Module and KGD testing, including high power SiC and high bandwidth GaN devices). His main task was the coordination between the local sales force and the R&D team based in Italy, by transmitting the inputs received from the market and converting them into solutions for SPEA customers.
Today, Elia is in charge of sales operations in Asia by coordinating the activities of several distributors and local sales forces in order to lead state of the art technology to SPEA customers.
Company Profile
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Company Products & Services
16:30 – 16:35
Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection
Today, power devices span multiple device architecture types, are produced on a variety of wafer sizes, and leverage multiple material sets including Silicon, Silicon Carbide and Gallium Nitride, to name a few currently mainstream materials. With increasing device power ranges, breakdown voltages, switching speeds and drive currents not only does the manufacture of this class of devices become more complex but the accuracy with which each processing step is conducted plays a vital role in ensuring the performance metrics are met, further ensuring overall device reliability and lifetime. This brief overview presentation will highlight a few of the challenges faced by device manufacturers during the production of silicon based super-junction MOSFETs, Silicon Carbide MOSFETs and finally Gallium Nitride HEMT (High Electron Mobility Transistors). In doing so, optical and infra-red critical dimension (O/IRCD) metrology and acoustic metrology technologies will be presented in the context of HVPs presented in the high-volume manufacture of these power devices.
Dr. Vamsi Velidandla
Onto Innovation
Vamsi Velidandla has 20+ years of experience in developing inspection and metrology solutions for the semiconductor industry. He has worked in applications, engineering and business management roles and is currently responsible for thin film and optical critical dimension metrology at Onto Innovation.
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
16:35 – 16:40
Enabling Solutions For Advanced Power Device Fabrication
Advanced power semiconductors and PMICs are key enabling technologies in automotive, consumer and wireless communications.
Si power semiconductors continue to evolve and are becoming increasingly sophisticated in order to deliver performance improvements. These trends are also driving the need for more advanced high volume manufacturing solutions. 300mm production, ultra-thin wafer processing, higher density device architecture and more complex vertical trench designs all pose new challenges from a fabrication perspective. At the same time, new generations of wide bandgap power devices that complement established Si based technologies are increasingly being deployed.
Lam is partnering with our customers and research partners to continually innovate in these fields in order to offer market leading etch, deposition and clean solutions for advanced and next generation power device manufacturing.
Dr. Anna Battaglia
Lam Research Corporation
Dr. Anna Battaglia graduated in Physics from the University of Catania in 1989 and completed her PhD in Physics in 1993, working on material modification induced by ion implantation.
In 1994 she joined the semiconductor capital equipment industry working as a technologist for different products and applications (Etch, Deposition, Clean) and gained more than 25 years of experience in semiconductor technology. In 2010, Anna joined Enel Green Power, an Italian multinational renewable energy corporation, as R&D Manager on advanced solar cell development and manufacturing, expanding her knowledge in the field of renewable energy and becoming technical coordinator of multiple European and Italian projects. In 2018 Anna joined Lam Research as Technology Manager supporting European business with particular focus on Specialty Technologies (MEMS, Discrete Power, BCD, CIS). Anna is also author of several publications and patents in the field of microelectronics and solar cell development.
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
Company Products & Services
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
16:40 – 16:45
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Christian Ohde
mks | Atotech
Christian finished his PhD in chemistry and joined MKS Atotech in 2010. After holding various management positions, he was appointed Head of R&D in 2013 for the company’s electrolytic copper plating activities, mainly focusing on plating of various metals in different equipment tool sets (horizontal and vertical).
Christian Ohde is leading MKS Atotech’s global Semiconductor and Functional Electronics Coatings activities. He is a reputable industry expert and thought-leader in this field.
Company Profile
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
16:45 – 16:50
Customized Silicon and SOI Wafers Enabling Enhanced Power Devices
Advanced silicon wafers can greatly improve power device performance and reduce power losses.
Bonded Silicon-On-Insulator (SOI) wafer is a cost-effective substrate choice for power management devices since its inherent isolation capability pushes towards monolithic integration reducing the die size. The device and buried oxide layer specification flexibility helps establish high freedom of design to streamline the chip development process.
Fully customizable gallium nitride (GaN) silicon substrate wafers with advanced stress management provide an enhanced platform for up to 1200 V lateral GaN power devices. All parameters including wafer thickness, crystal orientation and oxygen levels can be customized to enhance customer’s GaN epitaxy process efficiency and end product capability. Further benefits can be gained through GaN growth on SOI wafers. The layered structure of the SOI substrate enables monolithic integration increasing device performance and power efficiency, reduces dislocations and allows the use of thinner buffer layers.
Dr. Atte Haapalinna
Okmetic Oy
Dr. Atte Haapalinna is chief technical officer at Okmetic, the leading supplier of advanced silicon wafers. He has published two dozen papers on various applications of advanced silicon substrates, silicon damage characterization and silicon photodetectors. Dr. Haapalinna has been with Okmetic since 1998, holding various positions including senior vice president of products, senior vice president of customer support and senior manager of new business development. He has participated in development of C-SOI® wafers, ultra-low resistivity wafers for power devices and engineered high resistivity wafers for RF filters and devices. Dr. Haapalinna received his Ph.D. at the Helsinki University of Technology (now Aalto University), Finland.
Company Profile
Okmetic, established in 1985, is the 7th largest silicon wafer manufacturer in the world. The company specializes in 150-200 mm silicon and SOI wafers, serving power, MEMS, and RF device industries. Okmetic is a key player in the power device sector, offering optimized silicon wafers for discrete power devices, power management applications, and GaN growth.
Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. The company’s fab expansion set to be operational in early 2025 will increase 200 mm wafer capacity significantly. Okmetic operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, highlighting its commitment to quality and sustainability.
Company Products & Services
Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. We have the most extensive 150 to 200mm wafer portfolio in the market comprising of comprehensive lines of SOI wafers and High Resistivity RFSi® wafers as well as Patterned wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices and GaN-on-Si applications.
Okmetic’s silicon wafers are tailored to the customer’s product, process and technology needs, and produced in volume production. This ensures optimum wafer performance leading to multiple customer benefits: increased device performance and functionality, more advanced design possibilities, improved yield as well as streamlined and cost-effective manufacturing. Our silicon wafer solutions can be found e.g. in smartphones, portable devices and automotive electronics, and they support applications related to industrial process control, healthcare, the Internet of Things, and power and efficiency improvement.
Neil Armstrong
Tokyo Electron
Neil Armstrong is Director of Business Development at Tokyo Electron Europe, a leading global company in semiconductor production equipment. Prior to joining the semiconductor industry he lectured mathematics at the National College of Ireland. In his 25 years working in the semiconductor industry he led TEL’s successful introduction of Ti-TiN CVD, SiC and advanced Oxide Etch into Europe. Neil has a Masters in Applied Physics and Mathematics from Trinity College Dublin(Dublin University)
Company Profile
As a leading global company of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TEL) engages in development, manufacturing, and sales in a wide range of product fields. Building on the technological expertise and know-how that we have been cultivating since our inception over 50 years ago, we strive to contribute to the development of a dream-inspiring society. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.
Website: https://www.tel.com/
Phone: +1-512-424-100
Additional Contact Information: https://www.tel.com/contactus/
16:55 – 17:00
Thin Film Solutions for Wide Bang Gap (WBG) Power Devices
Recently, there has been a big demand for power semiconductors due to latest macroeconomic technology trends like electrification (EVs) and carbon footprint reduction (clean source of energy). Among the available power semiconductors materials, there is a strong interest towards wide bandgap semiconductors (WBG) like silicon carbide (SiC) and gallium nitride (GaN) in various applications due to their inherent material properties. There are several benefits for wide bandgap materials over traditional Si devices in terms of better electrical & thermal performance, and compactness. Device makers have come up with novel device structures to maximize the benefit out of these materials and reduce the fabrication costs, thereby demanding more rigorous processing capabilities. Thin film deposition is a key element in the value chain of WBG power device fabrication.
As a leading thin film powerhouse, Evatec offers several thin film solutions for this purpose like a.) Ohmic contact (backside & frontside) and Schottky contact formation, b.) frontside protection, c.) thin wafer handling, and d). trench filling. We offer solution using amorphous carbon layers for protection on the frontside surface to withstand high thermal budget during implant activation in silicon carbide devices. Our systems include necessary hardware solutions to handle thin wafers (robot handlers, chuck etc.,) used by several WBG power device makers. In addition, we also offer enhanced solutions to cover the frontside with thin barrier and thick aluminum layers, generally required in devices with high topography to achieve planar surface on power devices.
Dr. Vinoth Sundaramoorthy
Evatec
Dr. Vinoth Sundaramoorthy has completed his PhD in Semiconductors devices from the University of Nottingham, UK and Executive MBA in General Management from Executive Business School, University of St Gallen.
He has extensive experience in the semiconductor field for over 18 years that includes hand on experience in power semiconductors and related applications development. In his previous job at ABB Switzerland, he was involved in the product development of various power semiconductor devices and managed several semiconductor related global projects for different business units. He is a senior member of IEEE and recipient of awards in semiconductor field.
Currently, he is working as Product Marketing Manager at Evatec AG in Switzerland. He is responsible for the managing and leading the product portfolio of Evatec for ‘power devices’ market segment.
Company Profile
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
17:00 – 17:05
Empowering Power Electronics Packaging Through Photonic Debonding
PulseForge’s cutting-edge photonic debonding solution is spearheading the advancements in the power electronics packaging industry. Leveraging high-intensity light pulses, from sophisticated flash lamps, in conjunction with an ingenious reusable inorganic light absorber layer, our state-of-the-art technology presents exceptional opportunities for lowering processing costs while effectively debonding materials crucial for wafer thinning, RDL build, Fan-out, and substrate transfer.
In this presentation focused on Power MOSFETs packaging, we will delve into the intricacies of our photonic debonding process, demonstrating its ability to overcome traditional debonding method limitations and cost-effectively facilitate the detachment of temporarily bonded wafers from glass carriers. By exploiting broadband light spanning a wide spectrum (200 nm – 1100 nm) with intense pulses reaching up to 45 kW/cm2 over micro-second intervals, the photonic debonding process delivers unmatched efficiency and reliability, showcasing successful debonding of thinned wafers (<100 µm) from glass carriers.
Beyond the captivating results of our Power MOSFETs processing study, we will delve into the intricacies of cost savings afforded by our photonic debonding method. With large area illumination capabilities (75 mm x 150 mm) per flashlamp, the photonic debonding approach exhibits a high-throughput and clean solution, further driving down costs, and encouraging on-shoring of back-end processes.
Vikram Turkani
PulseForge
Vikram Turkani, serves as the Director of Technology Partnerships and Strategic Business Development at PulseForge Inc., a prominent technology company specializing in advanced packaging solutions based in Austin, Texas. In this pivotal role, Vikram is instrumental in steering the development and implementation of cutting-edge technologies at PulseForge. Through close collaboration with global technology partners, he ensures the successful transition of these state-of-the-art solutions into practical applications within the market.
Beyond driving the development of innovative technologies, Vikram actively engages with PulseForge’s customers, facilitating the seamless adoption of these innovations on a large scale. In addition to his professional pursuits, Vikram enjoys hiking Texas hill country and exploring the vibrant Austin food scene.
Company Profile
PulseForge, Inc. develops and manufactures state-of-the-art flashlamp-based tools that deliver energy in a precise and targeted manner to enable innovation in industrial manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale.
17:05 – 17:10
The EDA breakthrough solution for SiC and GaN Front-End and Back-End
The growth of WBG semiconductor Market (i.e., Silicon Carbide, Gallium Nitride) has placed challenging demands on traditional burn-in and test systems, mainly due to failure mechanisms related to these new technologies.
In this context, EDA Industries has used the experience gained in the WBG Back-End environment, extending the same approach also to Front-End. The result is a unique test platform for both environments, strengthened by innovative development and data analysis software tools and by the introduction of advanced automation processes. This is a key to mix and correlate production results and data, allowing quick feedback to chip makers for product and process improvement.
This results in an overall yield and quality enhancement and, as a consequence, in a dramatic reduction of the devices’ costs.
Luca Lillacci
EDA Industries S.p.a
Luca Lillacci was born in Perugia in 1972 and started his career in 1992 in Eles as Application Engineer. During that period, he was able to learn and practice many aspects related to the HW Design, Testing and Measurements of the Electronic Equipment.
Later, Luca has held different roles of greater responsibility until 2005, when he founded Origin Technology, a start-up created for delivering services and integrated solution for the semiconductor market.
In 2012 Lillacci and his team decided to join EDA Industries, an international and highly specialized company in the field of Burn-In and Test Equipment for the semiconductor industry, where, since May 2023, he has become the General Manager.
Leadership, passion, strategic thinking and attraction for innovation are all elements that have always distinguished Luca’s professional profile.
Company Profile
Established in 1993 in Italy, EDA Industries is a dynamic and experienced engineering company, focused on the production of Burn-In and Test Equipment for the semiconductor industry.
EDA Industries has its headquarter in Rieti and over the years has opened new offices not only in Terni and Catania, but also in the Philippines, Singapore, Malaysia, China and Morocco.
EDA Industries has more than 500 systems installed worldwide in 25 countries, providing a full turn-key solution for Testing, Burn-In and Reliability Test:
With a strong focus on the Automotive market, EDA has been walking the road of Innovation for over 30 years and began 2016 by expanding its Research Centre for SiC & GaN technology.
Thanks to the evolution of its SocrATE WLBI and ETNA Equipment, EDA’s principal strategic objective is to strenghten and confirm its leadership in Burn-In & Testing both in Front-End and Back-End, furnishing a unique Testing Platform for WBG devices.
17:10 – 17:20
SiC / IGBT Power Module Assembly & Test Equipment Solutions
With over 30 years of extensive experience and proficient skills in providing standard and customized automation solutions, Pentamaster serves customers across various industries sector ranging from semiconductor (consumer electronics, automotive), optics & photonics sensor, MEMS sensor, medical devices, food & beverages to general manufacturing. Over the years, Pentamaster had expanded its global footprint and market share to California, USA / Munich, Germany / Suzhou, China and Yokohama, Japan.
Since 2010, Pentamaster has been providing automated test equipment solutions for power modules used in home appliances. In 2018, Pentamaster expanded its range of equipment solutions to cover power module electrical burn-in, assembly and final test solutions for the EV industry. With their vast experience and engineering technology, Pentamaster is currently serving most of the key power module manufacturers across the globe
Michael Koelbl
Pentamaster Technology
Michael Koelbl, who has been working in the semiconductor industry for over 26 years, started his career with a medium-sized German-based machine manufacturer for wafer laser marking and sorting systems. After graduating in Micro- and Precision Engineering from the University of Applied Sciences in Munich in 1995, Mr. Koelbl worked as a service engineer, installing and maintaining equipment in front-end semiconductor fabs around the world. From 2007 to 2011 he was based in Singapore, where he set up a subsidiary to provide sales and service activities in the growing South East Asian region. Since returning to Germany, Mr. Koelbl has been actively involved in the development of robotic and laser applications as Technical Director and Business Development Manager.
In early 2023, Mr. Koelbl joined Pentamaster, a global supplier of automated test equipment and factory automation systems with customers in the semiconductor, automotive and medical industries. Pentamaster has been offering power module automated test equipment solutions for home appliances application since Y2010. They advanced to the EV industry in Y2018 with a wider range of equipment solutions covering electrical burn-in, assembly and final testing of power modules. With Pentamaster’s presence in Germany, Mr. Koelbl sees a great opportunity to support customers in the booming EV segment. Last but not least, the recently agreed European Chips Act, to strengthen the semiconductor ecosystem in the European Union, will support Pentamaster’s group expansion plan to increase its geographical footprint in Europe.
Company Profile
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
17:20 – 17:30
Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB
A faster and more reliable semiconductor equipment chamber process kits resource including spare parts and refurbishment solutions from concept to mass production is demonstrated as a critical competition strength to meet the booming demands of even larger wafer fabrication capacities. The booming markets with diversified application scenarios for AI, EV and power devices simultaneously request a flexible supply chain to support process technology changing and evolving. One-stop solution of chamber process kits from TESSVIDA is focusing on integrating the technology strengths of different partners and helping all product engineers or commodity specialists from equipment makers to approve the right plan of components or modules effectively from materials, functions to structure and applications, and helping all equipment owners and supply chain experts to maintain the fab operation at a reliable and competitive status.
Jimmy Tao
Tessvida
Jimmy Tao serves as Director of Marketing and development of TESSVIDA Technologies Pte. Ltd to constantly provide spare parts and surface treatment solutions to fabs and equipment manufacturer. His career path from Silicon Valley to China mainland and South East Asia is thrive to deliver reliable solutions to clients from IC, Pan-semiconductor, Electric, Auto, New energy, Medical device, etc. He graduated with MS in Material engineering from University of Florida.
Company Profile
Tessvida ( www.tessvida.com )is an experienced total process kits solutions (TKS) provider for IC, pan-semiconductor, new energy and more leading industries. We continuously improve and expand our R&D and manufacturing capabilities with engineering expertise in advanced materials, precision machining and surface treatment, to provide customers with complete product and service solutions. We are in a position to provide a one-stop-shop to meet custom engineered material requirements.
As a continually growing reliable partner for advanced materials manufacturing, Tessvida continues to make substantial investment in developing, strategic suppliers, key technologies, manufacturing capacity, and more comprehensive solutions. Tessvida strives to be a one stop solution provider for customers, to create value and shape the future of technology.
Company Products & Services
Tessvida’s competitive TKS ( Total process Kits Solution ) includes but not limited to: Spare parts, especially on ceramic parts; Surface treatment and Precision cleaning; R&D, Design, Prototype, and Mass-production.
Tessvida’s ability to offer responsive competitive solutions which meet customer needs in the changing market has a foundation in, qualified suppliers ( mainly in Asia ), integrated manufacturing capabilities, critical quality and cost control, timely response and fast delivery. Practical solutions for emerging challenges can be coordinated through our R&D team per customer roadmap.
17:30 – 17:45
Closing Address
18:00 – 21:00
Cocktail Reception & Gala Dinner
Wojciech Tyborowski
Invest in Pomerania
Wojciech Tyborowski, director of Invest in Pomerania since 2017. Previously, he worked at the Association of Business Service Leaders (ABSL), the Association of Chartered Certified Accountants (ACCA), as well as held the position of Project Manager responsible for attracting foreign investments in the modern business services sector at Invest in Pomerania. Graduate of the Faculty of Economics at the University of Gdansk.
Company Profile
Invest in Pomerania is a regional non-profit initiative that supports foreign direct investment projects in Pomerania (Gdansk Area, Northern Poland). We act as a “one-stop-shop”, providing help and services at every stage of the investment process. We are a SEMI member, a World Association of Investment Promotion Agency member, the official partner of Polish Investment and Trade Agency. Within the region of Pomerania we coordinate collaboration with special economic zones, municipalities, municipality-owned companies. We have been supporting forign companies for 12 years. The investors we have worked with declared to create over 23 thousand jobs in the region. Top projects included Intel, Amazon, Bayer, Swarovski, Northvolt, Aptiv, Flex, Jabil, State Street, Lufthansa Systems, Boeing.
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