• 07:30 – 08:30

Registration

  • 08:45 – 09:00

Welcome Speech

Salah Nasri photo

Salah Nasri

Senior Advisor to President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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STRENGTHENING EUROPE’S STRENGTHS & TECHNOLOGICAL LEADERSHIP

  • 09:05 – 09:25

Virtual

Opening Address

Watch on ISES TV > PPTs in ISES Docs >
Lucilla Sioli photo

Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

Ms Lucilla Sioli is the Director for “Artificial Intelligence and Digital Industry” within Directorate-General CONNECT at the European Commission. She is responsible for the coordination of the European digitisation of industry strategy and for policy development in the areas of artificial intelligence (AI) and semiconductors, including regulatory approaches such as the AI Act and the Chips Act. The directorate also supports R&D&I in key digital industrial technologies including microelectronics, photonics, robotics and AI. Lucilla holds a PhD in economics from the University of Southampton (UK) and one from the Catholic University of Milan (Italy) and has been a civil servant with the European Commission since 1997.

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The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.

Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.

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  • 09:25 – 09:45

Keynote

The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem

The worldwide demand for chips grows rapidly and is expected to double by 2030. Europe must ensure its security of supply within the global industrial value chain. The EU Chips Act aims to build on Europe’s strengths and address outstanding weaknesses. It will mobilise more than € 43 billion of public and private investments to strengthen the semiconductor ecosystem, production capacities and resilient supply chains. And finally, it will set measures to prepare and respond to future supply chain disruptions, together with EU Member States and our international partners. With this Europe is laying the foundations for technologies that are not yet available there today. Research and technology organizations play a strong role as partnerships with like-minded partners do. And besides all this, one of the most important factors is the sufficient availability and training of skilled workers.

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Dr. Thomas Morgenstern photo

Dr. Thomas Morgenstern

EVP Frontend IFAG FE

Infineon Technologies AG

Thomas Morgenstern is Executive Vice President of Infineon Technologies AG. He was born in Mosbach (Germany) in 1968. Thomas Morgenstern studied chemistry at the Heinrich-Heine-University Duesseldorf and received his PhD in 1998. He started his career in 1998 at Semiconductor 300. Before joining Infineon again in 2021, he held various positions at Biotronik SE & Co KG, BOSCH and Globalfoundries.

Positions within the company

  • Since 2022 Head of Frontend
  • 2021 Managing Director Dresden

Further positions

2017-2020 2013-2017
2010-2013 2009-2010
1998-2009
Globalfoundries Dresden

Senior Vice President and General Manager Fab 1
BOSCH Reutlingen and Souzhu

Senior Vice President Manufacturing and Technology
Globalfoundries Dresden Director Engineering

Biotronik SE & Co KG
Director Manufacturing Active Implants

Qimonda/ Infineon Dresden
Managing functions in various positions

Membership of Supervisory Boards

Infineon Technologies Dresden Verwaltungs GmbH, Neubiberg, Germany (Head of Supervisory Board)

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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ENABLING AN ELECTRIFIED & ENERGY EFFICIENT FUTURE

  • 09:45 – 10:05

Future of SiC Power Modules in Automotive and Industrial Applications

The power electronics world is developing from utilizing Si devices towards SiC devices. Power density is one of the key factors in power electronics and with the right packaging technologies, great advantages can be obtained benefitting the system level significantly. Claus Petersen will touch on the importance of SiC, and the growing adaptation of SiC in Automotive applications as well as in industrial and renewable applications. In addition he will focus on packaging technologies to leverage SiC devices to its maximum potential.

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Claus A Petersen photo

Claus A Petersen

President

Semikron Danfoss

When SEMIKRON and Danfoss Silicon Power merged in August 2022 creating Semikron Danfoss, The Ultimate Partner in Power Electronics – a 1bn Euro company with around 4.000 employes – Claus A. Petersen was named president.

Prior to the merger Claus Petersen has been responsible for Danfoss Silicon Power since 1998, where he successfully grew the business to be a top 3 supplier of Power Modules in Europe.

Claus has been part of the Danfoss Group since 1984, working in several areas of the business. However, he has spent the latter 20+ years in the Drives business, working in sales and marketing prior to starting up the Danfoss Silicon Power business.

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Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems.

In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today.

We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity, and service to deliver best-in-industry performance and for a sustainable future.

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  • 10:05 – 11:05

Networking Break and Business Meetings

  • 11:05 – 11:25

Volkswagen Group – Power Electronics In-House Development

Volkswagen Group Components with its more than 70.000 employees in over 60 factories worldwide is one of the biggest Tier 1 suppliers in the world – a hidden gem under the roof of the Volkswagen Group. With our dedication to developing the key parts of power electronics in-house – down to the level of semiconductor specification – we will enhance our product portfolio, change supply chains sustainably and disrupt automotive electronics’ products and processes.

This keynote will give an insight into the future journey of Volkswagen Group Components by outlining the technical approach of our next generation inverter platform. The motivation behind the increased development depth will be highlighted and the importance of strong and new ways of collaboration between all players in the automotive value chain will be shown. We create future mobility – for generations to come.

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Alexander Krick photo

Alexander Krick

EVP Technical Development

Volkswagen Group Components

  • For more than 20 years employed at Volkswagen Group
  • Since 2020 – Head of Development E-Drive, Power Electronics & Transmission
  • 2019-2020 – Head of Planning- & Development Steering of the Business Unit Transmission & E-Drive
  • Until 2019 – several national and international managing positions in the development environment (e.g. China)
  • Dipl. Ing. Electrical Engineering (University Kassel and University of Massachusetts Dartmouth)
  • Member of the Board with the FVA and VDE GMM
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As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.

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  • 11:25 – 11:45

Innovative Traction Drives with SiC Semiconductors

ŠKODA ELECTRIC is a renowned supplier of traction equipment for the SKODA Group and other important finalists of rail vehicles. For many electrical equipment applications, we use HV IGBT 6.5 kV/1000A transistors in large quantities (EMU trains ). In 2016, we built the first sample of a 200 kW SiC traction inverter. In 2019, we tested a traction drive for a new metro train for 1500V DC system and HV SiC technology (3.3 kV/ 750A) with a new IPMSM traction motor with natural cooling. The goal of the modern drive was to increase the reliability and reduce the maintenance of the traction drive, to reduce the weight and above all, due to the high efficiency of the traction drive, to reduce the electricity consumption of the train. The type tests of the train confirmed all these expectations.

The use of SiC technology leads to fantastic results in the field of electromobility, but it must also be combined with other modern elements of the traction drive. An example is the new ŠKODA ELECTRIC traction drive with a 5-phase IPMSM motor with third harmonic injection and a SiC inverter with a weight of 14.5 kg and a maximum power of 600 kW. Based on an objective measurement, this drive brings an electrical energy saving of 27.1% compared to an IGBT inverter and an asynchronous traction motor.

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Dr. Ladislav Sobotka photo

Dr. Ladislav Sobotka

Engineering and R&D Director

Skoda Electric

Ladislav is the Director of Development and Engineering at ŠKODA ELECTRIC, part of the ŠKODA Group. He joined Skoda in 1982 to develop electric locomotives, where he worked on traction drives. In 1996 he developed a new traction drive for the City Elephant double-decker unit (3 kV DC supply system ) with new HV IGBT transistors and a double star asynchronous traction motor. He also worked extensively on the development of trams and subway vehicles. He has been in the management of ŠKODA TRANSPORTATION since 1994, and in the following years he served as Technical Director and member of the Supervisory Board of ŠKODA TRANSPORTATION. In 2003, he founded ŠKODA ELECTRIC and was a member of the Board of Directors in charge of the technical departments. At ŠKODA ELECTRIC, he has been involved in a number of foreign projects, such as a traction drive for locomotives for Turkey in cooperation with the Korean company Hyundai-Rotem and a groundbreaking traction drive for a subway train for the Chinese city of Suzhou. Ladislav works very intensively with universities and is a member of three scientific councils. Since 2015 he has been working on SiC semiconductors and high efficiency traction drives.

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We are Škoda Electric, belonging to the Škoda Group. We continue in the tradition of the one hundred and sixty-year tradition of Škoda plants and we are an experienced manufacturer of traction drives and motors for locomotives, trams, EMU, metro, mining vehicles.

About us | Škoda Group a.s. (skodagroup.com)

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  • 11:45 – 12:05

Partnership as a Foundation for Decarbonization

Volvo Group is on a transformation journey with an ambitious decarbonization roadmap. Being a pioneer in electrification and with clear net-zero targets, it is important to transform the whole ecosystem together with a holistic view. While seizing this once in a lifetime opportunity, we make sure that we continue to provide best-in-class products that let our customers reach that extra mile. Power semiconductors such as SiC and GaN are essential foundational building blocks that let us stay ahead and keep our innovation values. As we always say, our suppliers are our business partners, and we firmly believe that partnership is the new leadership. In this journey, we want to work together with our Tier-1s and semiconductor companies as key partners in developing these leading-edge technologies.

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Vishnu Kumaresan​, Ph.D logo

Vishnu Kumaresan​, Ph.D

Semiconductor Business Specialist & Segment Leader

Volvo Group

Vishnu Kumaresan joined Volvo Group as Semiconductor Business Specialist in 2022 and is driving the Semiconductor strategy with the cross-functional team. He has a doctorate degree in semiconductor materials and has specialized in strategy management. Vishnu has more than 10 years of experience in the semiconductor, software, and display technologies prior joining Volvo Group.

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The Volvo Group is one of the world’s leading manufacturers of trucks, buses, construction equipment and marine and industrial engines. The Group also provides complete solutions for financing and service. The Volvo Group, with its headquarters in Gothenburg, employs about 100,000 people, has production facilities in 18 countries and sells its products in more than 190 markets.

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ENHANCHING RELIABILITY, QUALITY & PERFORMANCE

  • 12:05 – 12:25

Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive

For 30 years, Soitec has been designing and manufacturing semiconductor engineered substrates. Soitec is addressing markets for three key megatrends such as 5G/6G, Electrical Vehicles (EVs) and Artificial Intelligence. We foresee EVs to become a significant new growth driver by capturing the two main trends in this market: the Digitalization of the car, and the Electrification of mobility.

By 2030, more than 45 million of cars sold will be EVs. Thanks to its performances, by 2025 it is expected that more than 50% of EVs will use Silicon Carbide (SiC) in their power electronics systems. Silicon Carbide brings several advantages over silicon when it comes to power electronic devices. These include a higher breakdown voltage, higher operating temperature, and higher thermal conductivity that helped imposing SiC as preferred option for inverter for leading EVs. Although amazing progress has been demonstrated past 15 years regarding silicon carbide substrate properties and processing, major limitations remain for a straightforward transition to large volume.

Smart-Cut™ applied to SiC, generating SmartSiC™ engineered substrates aims to accelerate silicon carbide adoption and brings best of SiC by combining high conductivity ultra-flat pSiC and high quality layer of mSiC for device.

Performance wise, this unique vertical structure allows a boost in electrical performance and efficiency of power devices such as MOSFETs and diodes. It brings as well flatness and process simplifications advantages that will be discussed.

On sustainability front, SmartSiC™ is a greener route to volume by targeting CO2 footprint equivalent to silicon wafers, mostly thru vast reuse of donor wafers, obtained at very high thermal budget, for more than 10 SmartSiC wafers for each donor.

This route is also lowering risk lowering capex intensity and speeding 200mm SiC wafers introduction by two years.

All these performances had been demonstrated for manufacturing and triggered the decision for a new fab in Soitec with first production in September 2023. .

The presentation will describe the SmartSiC process and latest results on wafers and devices and how SmartSiC™ is enabling major impacts on SiC business

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Ph.D. Emmanuel Sabonnadière photo

Ph.D. Emmanuel Sabonnadière

VP Division Automotive & Industrial

Soitec

Since July 2021, Mr Sabonnadiere is Vice-President of the Division Automotive & Industrial of Soitec. He is also in charge of the Strategic Program SiC.

From September 2017 to July 2021, Mr Sabonnadiere was CEO of CEA-Leti, one of the most innovative Labs in the industry of microelectronics and biotechnology, based in Grenoble (France). Previous two years, Mr Sabonnadiere was CEO & Chairman of the Business Group Professional of Signify, former Philips Lighting (Amsterdam). From 2014 till 2016, he served as Senior Associate of MidCap Private Equity firm named Gimv (Paris, Antwerpen, Munich, Den Haag).

Previously in his career, Mr Sabonnadiere was CEO & Chairman of General Cable Europe & Africa (Barcelona). From 2005 till 2008, he was CEO of NKM Noell Gmbh, the German branch of the group REEL. Mr Sabonnadiere was vice-president of the Distribution Transformers division of Alstom T&D for 5 years. He began his career in 1992 with Schneider Electric holding various positions including that of Managing Director of equipment units for 10 years.

Mr Sabonnadiere has a strong innovation and technological background combined with a successful business track record over decades and some key innovations adopted into the markets. With 30+ years of executive leadership of large operations, he produced high level performances of operating margins & results and generation of cashflow. He gained a sound experience of change management in large multi-cultural organizations to adapt to new markets conditions and dynamics in European and International environments. He designed and set-up ambitious strategic plans including some merge & acquisitions.

Mr Sabonnadiere believes in operational excellence, innovations in technology, talents management and enthusiasm in leadership. His sound experience in the European industry make him a highly knowledgeable and respectful Board member.

Mr Sabonnadiere obtained a PhD in physics (France), and an engineering degree in Information Technology (France). He holds an MBA (France)

Mr Sabonnadière is a fully qualified instructor at the ski school in Les Ménuires, and member of the Advisory board of IAC Consultant and Sparring Capital firm.

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Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.

In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.

With more than 3,500 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness. Soitec’s technologies, projects and industrial capacity make it one of the crown jewels of France’s industrial sector.

Soitec is headquartered in Bernin France. The company was founded 25 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the Euronext, Tech 40 Paris.

For more information please visit:www.soitec.com.

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  • 12:25 – 12:45

Process Control Trends for WBG Power Devices

The automotive industry is continuing its secular shift towards more electrification, computing, and automation.

Consequently, both the number of semiconductors used in automotive, and their complexity are rapidly growing to support new applications. The very high standards for automotive reliability are requiring the adoption of advanced process control and inline screening methodologies.

An additional challenge in automotive electronics is the introduction of wide bandgap (WBG) materials, like silicon carbide (SiC) or gallium nitride (GaN), which are essential to the proliferation of electric vehicles because of their improved power efficiency over silicon.

I will start my presentation by outlining the yield challenges that WBG power manufacturers face while ramping production to meet industry’s skyrocketing demand. Low yield is impacting both fabrication costs and product reliability and can pose a serious threat to the EV adoption in the market.

A high amount of manufacturing costs and yield loss comes from the substrate and epitaxy processes, even before device fabrication starts, so process control for these initial steps is very critical and requires specialized inspection and metrology tools.

During the device fabrication, new processes are introduced, like SiC trench etch, which requires innovative process optimization as well as advanced metrology capability.

Moreover, the adoption of Inline Part Average Testing (I-PAT®), which has already been introduced on silicon-based automotive chips, is expected to increase during SiC device manufacturing to mitigate reliability concerns derived from low yield and substrate immaturity.

Finally, new wafer singulation, such as plasma dicing, and bare die inspection will be needed to limit the occurrence of edge die cracks and delamination issues caused by the current mechanical and/or laser dicing technologies.

Keywords: Electrification, Yield, Reliability, Inline Screening, Silicon Carbide

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Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

Oreste Donzella serves as Executive Vice President of the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which include multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.

Previously, Oreste covered wide range of positions at KLA, including Chief Marketing Officer (CMO), Customer Engagement VP, General Managers of the Surfscan and SWIFT product divisions and various other technical and business roles. of KLA.

Oreste brings ~30 years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent more than six years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.

Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy.

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KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com

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  • 12:45 – 14:00

Buffet Lunch

  • 14:00 – 14:20

The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

Gayn Erickson, CEO of Aehr Test Systems, to discuss the need to identify early “infant mortality” failures and the importance of Stabilization Stress and Burn-In during the production of Wide Bandgap (WBG) Semiconductors. Areas of focus will include what types of stress and burn-in conditions are used to accelerate extrinsic / early life failures and to stabilize threshold voltages of high power silicon carbide MOSFETs and why this is needed. Mr. Erickson will also discuss the impact of the transition from single die Packages to multi-die modules on the test and burn in production flows and equipment.

Watch on ISES TV > PPTs in ISES Docs >
Gayn Erickson photo

Gayn Erickson

President & CEO

Aehr Test Systems

Gayn Erickson is Chief Executive Officer & President of Aehr Test Systems (Nasdaq: AEHR) in Fremont, California, a world leader in Semiconductor Test and Burn-in solutions. Prior to this, Gayn was Executive Vice President of Verigy, Inc. and Agilent Technologies, with responsibility for their Memory Test Business Units. He has over 35 years of experience in the Semiconductor Capital Equipment market. With very high market and technology domain knowledge in defining, developing, manufacturing, and marketing semiconductor capital equipment solutions, Gayn has led the definition and development of over a dozen semiconductor test and burn-in systems and solutions at Hewlett-Packard, Agilent Technologies, Verigy, and Aehr Test Systems. Gayn received a BSEE degree from Arizona State University

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Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader.

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  • 14:20 – 15:00

Risk and Challenges With Capacity Investments & Supply Chain Resiliency

Moderator
Ralf Bornefeld photo

Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch

Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.

Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.

Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.

Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.

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The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). The company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in some 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. With its more than 400 locations worldwide, the Bosch Group has been carbon neutral since the first quarter of 2020. The basis for the company’s future growth is its innovative strength. At 128 locations across the globe, Bosch employs some 76,100 associates in research and development, of which more than 38,000 are software engineers.

The company was set up in Stuttgart in 1886 by Robert Bosch (1861–1942) as “Workshop for Precision Mechanics and Electrical Engineering.” The special ownership structure of Robert Bosch GmbH guarantees the entrepreneurial freedom of the Bosch Group, making it possible for the company to plan

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Panelist

onsemi

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onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

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Panelist
Jianwei Dong photo

Jianwei Dong

CEO

SK Siltron CSS

Mr. Dong is a growth-minded business executive with extensive experience in leading changes, developing organizations and people, and driving innovations. He was the general manager of the compound semiconductor solutions business unit (BU) at DuPont Electronics and Imaging prior to SK siltron’s acquisition of the BU. Post-acquisition, Mr. Dong was appointed CEO of the new SK siltron css business. Prior to that role, he was the global marketing director for the semiconductor advanced packaging technologies BU at Dow Electronic Materials. This was a continuation of Mr. Dong’s work as a marketing leader at Dow since 2012. Before that, he was in a product development role with Dow and worked as a R&D scientist at Rohm and Haas Electronic Materials in both the US and Hong Kong.

Mr. Dong’s education began at Jiao Tong University in Shanghai, China, where he received both a Bachelor of Science degree and a Master’s degree in materials science. From there, Mr. Dong attended the University of Minnesota and received his Ph.D. in Materials Science in 2003. He later completed a five-module executive education program on leadership development (PLD) from Harvard Business School.

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At SK siltron css, we provide the global compound semiconductor industry with a reliable source of leading-edge, production-proven, high-crystal-quality silicon carbide (SiC) wafers and epitaxy services.

Our SiC technology and manufacturing expertise extends from crystal growth through wafer fabrication and epitaxy. We focus our R&D efforts on finding environmentally friendly solutions using renewable energy and sustainable manufacturing practices. Our latest-generation, wide-bandgap semiconductor materials are designed to help customers meet global demands for improved environmental sustainability, increased electricity demand and higher energy efficiency.

Drawing on decades of experience providing SiC materials and products, we continue to grow and double our capacity year over year. As a dedicated materials supplier, we focus on providing wafers and materials for critical compound semiconductor applications. We do not make devices or compete with our customers. We are backed by the resources and purchasing power of SK siltron.

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Panelist
Roman Strasser photo

Roman Strasser

VP, Head of Technical Development VW Group Inverter Platform

Volkswagen Group Components

  • For more than 25 years involved in Electronics Development
  • Since 2022 – Head of Development Group Platform Power Electronics – Volkswagen Group
  • 2004-2022 – Head of Development Power Electronics and Charging – Audi AG
  • 1998-2004 – Head of Development Transmission Electronics – Jatco Europe
  • 1995-1998 – Project Lead for Transmission Scheduling – Continental AG
  • Dipl. Ing. Electrical Engineering (Technical University Munich)
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As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.

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  • 15:00 – 16:00

Networking Break, Business Meetings and Refreshments

EQUIPMENT & MATERIAL SUPPLIER SESSION

  • 16:00 – 16:10

How Laser is Enabling The Power Semiconductor Roadmap

To keep up with the drive for improved electrical performance of Power Semiconductor devices, chip designers are looking at thinner wafers and moving from Si to SiC and GaN wafer substrates. Due to the increased electrification in our daily life we see a strong increase in power semiconductor applications for mobile, automotive, industrial, renewable energies, etc. As a result of this increase in volume, the market is looking at new wafer singulation technologies to keep up with the technology requirements as well as the cost. ASMPT developed a patented Ultra-Violet (UV) nano second laser dicing technology for thin SiC wafers (100 – 150 μm), which allows customers to continue their technology roadmap and which is competitive from a Cost of Ownership (CoO) to the conventional saw blade dicing technology. Blade dicing is encountering yield issues and due to the hardness of SiC, high consumable cost and low throughput. During our presentation at ISES EU Power 2023 we will share the laser technology concept used and the results achieved for dicing of thin SiC power semiconductor devices including reliability data and CoO.

Key words: SiC, Dicing, Power Semiconductors, Thin Wafer, Multiple Beam

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Jeroen van Borkulo photo

Jeroen van Borkulo

Head of Business & Marketing

ASMPT Limited

Jeroen van Borkulo received a Bachelors’ degree in Applied Physics – specialized in photonics from the Hague University of Applied Sciences and followed Executive Program at Nyenrode Business University.

Joined ASMPT in 2014 in the role of product marketing manager. In his current role leads the business development and marketing team for ASMPT’s Laser dicing and grooving BU. Jeroen has over 20 years’ experience in laser material processing applications in the semiconductor industry.

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ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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  • 16:10 – 16:20

Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?

The development of new technologies, such as GaN, have created the opportunity for more efficient and higher voltage/power performance in switching and power management circuits. GaN has high cutoff frequencies, low on-state resistance, and high breakdown voltages, enabling increased power handling densities for applications from 100 to >600 volts.

Assessment of material and processes used in device fabrication is a key aspect for fielding reliable product to the market. Process changes for cost and performance improvements must be vetted for reliability performance variance.

Reliability testing of switching power devices requires the balance of several competing challenges. The first is to understand the intrinsic reliability of the fabricated device. In order to quickly assess this, a “soft-switching” methodology may be useful.

Product or sub-system qualification, including extrinsic effects, is needed under application conditions. Assessment of product quality for application specific use is typically done using “hard-switching” tests to close approximation of the application.

The challenge for the device manufacturer is defining and implementing the reliability and qualification test regime that is both cost effective but industry applicable to the standards required. Where are we at in the journey to find a reliable and qualified part?

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Roland Shaw

President of Accel-RF

STAr Technologies

Mr. Shaw is President of Accel-RF Corporation and has over 40 years’ experience in RF/microwave test system development. He is an acknowledged industry leader in developing compound-semiconductor accelerated life test methodologies, and co-authored the “Gallium-Arsenide (GaAs) MMIC Reliability Assurance Guideline for Space Applications”, released by NASA-JPL in 1996 as the “guidebook” for space qualification of Gallium-Arsenide MMICs.

Mr. Shaw previously held management and technical positions at Lockheed Martin, Texas Instruments, and was Program Manager on several key projects for NASA-JSC. He has an MSEE from Southern Methodist University (SMU) and BSEE from Texas A&M University.

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STAr Technologies, established in year 2000 and headquartered in Hsinchu Taiwan, with more than 800 employees servicing customers worldwide. We provide test technologies including software, instruments, automatic test equipment, burn-in systems, probe cards, and outsourcing test services to meet demanding challenges within the semiconductor industry. Our expertise extends across parametric electrical tests (E-test), wafer-level and package-level reliability (WLR & PLR), mixed signal tests, RF and power ICs burn-in, MEMS probe cards, load boards, test interfaces and sockets.

Accel-RF Instruments and STAr-Edge Technologies, located in California, provides world leading test equipment for performing high voltage-current, and wide temperature capabilities for long-duration reliability testing and burn-in qualification of compound semiconductors, such as Gallium-Nitride (GaN) and Silicon-Carbide (SiC). These test systems have enabled successful technology developments, product launches, and industry adoption of GaN transistors and MCMs into the aerospace, military, and commercial wireless, and power electronics markets, among others.

Sales Contact Information
Phone: +1-408-416-0777
E-mail: Sales-US@STAr-Quest.com
Website: www.STAr-Quest.com

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  • 16:20 – 16:30

Addressing Testing Challenges for Power Modules and Three-Level Inverters

The use of renewable energy sources is one of the key issues when it comes to developing the next-generation worldwide energy supply. The need for improvements in efficiency and reliability is leading to the increasing diffusion of three-level IGBT inverters: featuring smaller output voltage steps than two-level topologies, they provide a cleaner output waveform, resulting in a more effective switching frequency. Because the IGBTs are subjected to a lower bus voltage, lower-voltage modules can be used. For this reason, three-level topologies are being widely used in various applications requiring high voltages, including photovoltaics and wind power inverters. Compared to the equivalent two-level modules, these products pose some specific challenges in regard to their production testing. In particular, they require to operate with multiple programmable and independent drivers to condition each section of the module under test properly, in order to measure all the working parameters. In addition to that, special attention must be paid to the design of a signal path with minimal stray inductance, in order to minimize voltage overshoots during signal commutation. These, and many other technological challenges, have been faced and solved by SPEA over the past 45 years. The DOT800T test platform represents the state-of-the-art equipment that has made SPEA a global leader in testing power products.

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Elia Petrogalli

Sales Manager Semi & MEMS Business Unit

SPEA

Elia Petrogalli received his Degree in Mechanical Engineering from Polytechnic of Milan in September 2015.

While obtaining his MSc in Mechatronics and Robotics Engineering he worked in the R&D team of a local company in Milan active in the Biomechanical design field. During this experience he was in charge of designing and programming closed-loop control systems for biomedical applications based on mechanical vibrations.

After receiving his MSc in Mechatronics and Robotics, he joined Keyence Corporation Japan as a Technical Sales Engineer, being in charge of sales and service operations for high accuracy measurement systems.

After this international experience in artificial vision, Elia was employed by SPEA in 2019 as a Sales Manager for the Semiconductor and MEMS Business Unit for the Chinese region. Together with the local team of SPEA China, Elia helped in developing the business for Semiconductor (with particular focus on Power Applications for Module and KGD testing, including high power SiC and high bandwidth GaN devices). His main task was the coordination between the local sales force and the R&D team based in Italy, by transmitting the inputs received from the market and converting them into solutions for SPEA customers.

Today, Elia is in charge of sales operations in Asia by coordinating the activities of several distributors and local sales forces in order to lead state of the art technology to SPEA customers.

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Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

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  • 16:30 – 16:35

Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection

Today, power devices span multiple device architecture types, are produced on a variety of wafer sizes, and leverage multiple material sets including Silicon, Silicon Carbide and Gallium Nitride, to name a few currently mainstream materials. With increasing device power ranges, breakdown voltages, switching speeds and drive currents not only does the manufacture of this class of devices become more complex but the accuracy with which each processing step is conducted plays a vital role in ensuring the performance metrics are met, further ensuring overall device reliability and lifetime. This brief overview presentation will highlight a few of the challenges faced by device manufacturers during the production of silicon based super-junction MOSFETs, Silicon Carbide MOSFETs and finally Gallium Nitride HEMT (High Electron Mobility Transistors). In doing so, optical and infra-red critical dimension (O/IRCD) metrology and acoustic metrology technologies will be presented in the context of HVPs presented in the high-volume manufacture of these power devices.

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Dr. Vamsi Velidandla

Senior Director, Product Management

Onto Innovation

Vamsi Velidandla has 20+ years of experience in developing inspection and metrology solutions for the semiconductor industry. He has worked in applications, engineering and business management roles and is currently responsible for thin film and optical critical dimension metrology at Onto Innovation.

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Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com

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  • 16:35 – 16:40

Enabling Solutions For Advanced Power Device Fabrication

Advanced power semiconductors and PMICs are key enabling technologies in automotive, consumer and wireless communications.

Si power semiconductors continue to evolve and are becoming increasingly sophisticated in order to deliver performance improvements. These trends are also driving the need for more advanced high volume manufacturing solutions. 300mm production, ultra-thin wafer processing, higher density device architecture and more complex vertical trench designs all pose new challenges from a fabrication perspective. At the same time, new generations of wide bandgap power devices that complement established Si based technologies are increasingly being deployed.

Lam is partnering with our customers and research partners to continually innovate in these fields in order to offer market leading etch, deposition and clean solutions for advanced and next generation power device manufacturing.

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Dr. Anna Battaglia

Technology Manager

Lam Research Corporation

Dr. Anna Battaglia graduated in Physics from the University of Catania in 1989 and completed her PhD in Physics in 1993, working on material modification induced by ion implantation.

In 1994 she joined the semiconductor capital equipment industry working as a technologist for different products and applications (Etch, Deposition, Clean) and gained more than 25 years of experience in semiconductor technology. In 2010, Anna joined Enel Green Power, an Italian multinational renewable energy corporation, as R&D Manager on advanced solar cell development and manufacturing, expanding her knowledge in the field of renewable energy and becoming technical coordinator of multiple European and Italian projects. In 2018 Anna joined Lam Research as Technology Manager supporting European business with particular focus on Specialty Technologies (MEMS, Discrete Power, BCD, CIS). Anna is also author of several publications and patents in the field of microelectronics and solar cell development.

 

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Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

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  • 16:40 – 16:45

Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

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Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

Christian finished his PhD in chemistry and joined MKS Atotech in 2010. After holding various management positions, he was appointed Head of R&D in 2013 for the company’s electrolytic copper plating activities, mainly focusing on plating of various metals in different equipment tool sets (horizontal and vertical).

Christian Ohde is leading MKS Atotech’s global Semiconductor and Functional Electronics Coatings activities. He is a reputable industry expert and thought-leader in this field.

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Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com

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  • 16:45 – 16:50

Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

Advanced silicon wafers can greatly improve power device performance and reduce power losses.

Bonded Silicon-On-Insulator (SOI) wafer is a cost-effective substrate choice for power management devices since its inherent isolation capability pushes towards monolithic integration reducing the die size. The device and buried oxide layer specification flexibility helps establish high freedom of design to streamline the chip development process.

Fully customizable gallium nitride (GaN) silicon substrate wafers with advanced stress management provide an enhanced platform for up to 1200 V lateral GaN power devices. All parameters including wafer thickness, crystal orientation and oxygen levels can be customized to enhance customer’s GaN epitaxy process efficiency and end product capability. Further benefits can be gained through GaN growth on SOI wafers. The layered structure of the SOI substrate enables monolithic integration increasing device performance and power efficiency, reduces dislocations and allows the use of thinner buffer layers.

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Dr. Atte Haapalinna

CTO

Okmetic Oy

Dr. Atte Haapalinna is chief technical officer at Okmetic, the leading supplier of advanced silicon wafers. He has published two dozen papers on various applications of advanced silicon substrates, silicon damage characterization and silicon photodetectors. Dr. Haapalinna has been with Okmetic since 1998, holding various positions including senior vice president of products, senior vice president of customer support and senior manager of new business development. He has participated in development of C-SOI® wafers, ultra-low resistivity wafers for power devices and engineered high resistivity wafers for RF filters and devices. Dr. Haapalinna received his Ph.D. at the Helsinki University of Technology (now Aalto University), Finland.

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Okmetic, founded in 1985, is the 7th largest silicon wafer manufacturer in the world and a true pioneer in the field of advanced silicon wafers. Okmetic supplies tailored, high value-added silicon wafers for the manufacture of MEMS, sensor, RF and power devices. Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. Okmetic’s operations rely on quality and environmental systems in line with the ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 standards.

 

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  • 16:50 – 16:55

TEL: Moving Into the MAGIC Era of Semiconductors

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Neil Armstrong

Director Sales Development