Driving the Future: Breakthroughs in Advanced Packaging, Glass Substrates, and Automotive Innovations

08:00 – 08:35

Registration

08:40 – 09:00

Welcome Speech

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

Tadahiro Suhara

CEO

TSSC

09:00 – 09:20

Opening Speech

Ministry of Economy, Trade and Industry (METI)

Powering AI Era with Advanced Innovations: Advanced Packaging, HBM, Advanced Manufacturing

09:20 – 09:40

Keynote

Terushi Shimizu

Chairman

Sony Semiconductor

09:40 – 10:00

Keynote

Reserved for TSMC  

10:05 – 11:05

Networking & Business Meeting 1 + 2

11:10 – 11:30

Keynote

Norishige (Noly) Morimoto

VP of IBM Japan & CTO of Research & Development

IBM Japan, Ltd.

11:30 – 11:50

Keynote

Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

11:50 – 12:10

Keynote

Reserved for Rapidus

12:15 – 13:25

LUNCH

13:30 – 13:50

Lode Lauwers

Senior Vice President Business Development & Sales

imec

13:50 – 14:10

Reserved for Micron Technology

14:10 – 14:30

Reserved for Samsung 

14:30 – 14:50

Takahiro Ogura

President of AI Computing Division

Preferred Networks

14:55 – 15:55

Networking & Business Meeting 3 + 4

16:00 – 16:20

Resonac Corporation

16:20 – 16:30

ASMPT Semiconductor Solutions

16:30 – 16:40

Lam Research Corporation

16:40 – 16:50

Akihiko Furuya

Executive Officer, Head of Semiconductor Subdivision, Electronics Division

TOPPAN Inc.

Market Insights

16:50 – 17:10

Yole Group

17:10 – 17:30

Akira Minamikawa photo

Akira Minamikawa

Senior Analyst

OMDIA

17:30 – 17:50

Dinner check-in

18:00 – 21:00

Gala Dinner and Award Ceremony

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