• 08:30 – 08:55


EV Opportunities and What it Means for the Semiconductor & Sensors Industry

  • 09:00 – 09:25


Zero Emission Becomes Real in Next-Generation Mobility

The European Union intends to cut greenhouse gas emissions by at least 55% by 2030 and has the goal be climate-neutral by 2050. Passenger cars and vans are collectively responsible for around 15% of total EU emissions of CO2. To meet the 2050 climate goal, road transport CO2 emissions would then have to decline more than three times as quickly (5.5% per year) from 2035 to 2050. Can such ambitious vehicle CO2 targets of the European Union and also those of other countries be achieved?

CS Chua will discuss the contribution of semiconductor companies to enable next-generation zero-emission mobility. Using electric vehicles, he explains how it is technically feasible to meet CO2 targets for vehicles while also meeting other crucial factors, such as extension of vehicle range, improvement of charging speed and the availability of a reliable charging infrastructure – with electricity from renewable energy sources. He discusses the market prospects for electric vehicles from 2023 to 2030 and the mix of semiconductor materials such as silicon, silicon carbide (SiC) and gallium nitride (GaN) used during this period.

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CS Chua photo

CS Chua

President & Managing Director

Infineon Technologies AG

CS Chua oversees regional sales, marketing and distribution, supply chain, R&D, and manufacturing. He is also responsible for strategy, quality management, human resources, and communications for the Asia Pacific region with local presence in Australia, India, Indonesia, Korea, Malaysia, Philippines, Thailand, and Vietnam. He has held the current role since 2017. CS joined Infineon in 2000 and has taken on roles in product marketing for industrial microcontrollers and regional marketing covering Asia Pacific’s automotive electronics segment. Previously as the Vice President of Automotive Regional Centre. CS has a Bachelor of Electrical and Electronics Engineering degree from the Nanyang Technological University in Singapore.

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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  • 09:30 – 09:50

Global Vehicle Electrification Trends and BEV Opportunities in the Developing World

Vehicle electrification is a set trend, led by developed countries and China, for the coming decades. Globally, Yole forecast (Q1 2023) a combined growth of ~1.2% in the period between 2022 to 2028, which the total light duty vehicle drops ~3% meanwhile. BEV definitely leads the growth with ~16% increase, far advancing the total market.

This change of powertrain landscape is reshaping the supply chain with several ongoing features highly relevant to the power electronics community, which are to be full explained in the presentation: Auto OEMs are turning more to in-house development and production: high voltage system integration is growing in various directions; power electronics demonstrate strong resilience towards current Si cycles; wide band gap materials are going through incubation to mainstream.

Opposite to common understanding, Yole is seeing huge opportunities of BEV development in developing countries, although the current penetration is low. Strategies, including financial promotion in both BEV supply chain and charging infrastructure, leveraging existing BEV supply chain, right positioning BEV models for local needs, and 2-wheeler early adoption, etc. can be applied by official and private investment in some developing countries, like India, Malaysia, Indonesia, Thailand, Vietnam, Turkey, etc.

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Dr. Yik Yee Tan photo

Dr. Yik Yee Tan

Sr. Market and Technology Analyst

Yole Intelligence

Yik Yee Tan Ph.D. is a Senior Technology & Market Analyst, Semiconductor Packaging & Assembly at Yole Développement (Yole), within the Semiconductor, Memory & Computing division. Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Yik Yee Tan holds a Ph.D. in Engineering from Multimedia University (MMU, Malaysia).

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Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.

With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.

Yole Group benefits from an international sales network. The company now employs more than 180+ people.

More information on www.yolegroup.com.

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  • 09:55 – 10:55

Networking Coffee/Tea Break & Business Meeting

MEMS & Sensors to Support the Growing Demands of EV

  • 11:00 – 11:20

More than Moore Emerging Technologies for the Sensing Needs in EV

EV, IoT and industry 4.0 open new market opportunities in the semiconductor field. The potential is high but so are the expectations to quickly fulfil the stringent specifications and requirements for tomorrow’s products. The customer focus is shifting into embedding more and more capabilities into their devices in order to develop smart products. Several challenges must be faced in each of the stages of the MEMS and sensors development: from the conceptual design employing unconventional materials and unique processes to the characterization and reliability assessment of complex structures. In this talk we will provide an overview to the journey from a conventional pure-play CMOS foundry to become a reference partner in more than Moore technologies with special emphasis into MEMS, sensors and its monolithic integration with CMOS devices.

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Dr. Eloi Marigo Ferrer photo

Dr. Eloi Marigo Ferrer

Member of Technical Staff

SilTerra Malaysia Sdn. Bhd

ELOI MARIGO was born in Barcelona, Spain, in 1985. He received the degree in Engineer Telecommunications, a MSc and an Electrical Engineering Ph.D. from UAB, Spain, in 2008, 2009 and 2012 respectively. In 2013, he joined the Department of Technology Development, Silterra Malaysia and he is currently leading its MEMS R&D activities. Its contributions to the monolithic integration of MEMS with CMOS and piezoelectric MEMS have been instrumental for Silterra’s technology portfolio and its more than Moore roadmap. He is an actively participant at international conferences and prestigious journals and engages in cross collaborations with renowned institutions and partners.

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SilTerra, a pure-play wafer foundry, offers various CMOS technologies from 180nm to 110nm nodes. It serves a wide range of end-market applications, including IoT, power management, consumer electronics, medical and communication products. Besides CMOS technologies, SilTerra also provides MEMS foundry services, unique and patented MEMS-on-CMOS technologies, silicon photonics, bio-photonics, and power. Its excellent customer service team helps customers realize working prototypes from proof of concept to high volume manufacturing.

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  • 11:25 – 11:45

Piezoelectric MEMS Platform for Sensing and RF Applications

In the field of MEMS (Micro-Electro-Mechanical Systems), material innovation drives MEMS process platform development. Over the past decade, MEMS has experienced remarkable growth and the commercialization of RF MEMS devices, primarily due to advancements in AlN/ScAlN film processes. Therefore, to effectively translate innovations in piezoelectric materials into the development of piezoelectric MEMS devices, it is essential to establish a Piezoelectric MEMS process platform capable of implementing the optimized stack and structure required for specific applications. IME is actively developing in the development of Piezoelectric MEMS process platforms and would like to share our progress. In this presentation, we introduce IME’s MEMS platforms and their associated applications:1. Back cavity platform for ultrasonic ranging and imaging2. Piezoelectric Silicon-on-Nothing platform for dense PMUT array (e.g. microfluidics)3. Thin-film ScAlN platform for RF ME

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Dr. Yul Koh photo

Dr. Yul Koh

Senior Scientist

A*Star IME

Graduated from the Department of Electrical and Electronic Engineering at Seoul National University in Korea. Following graduation, he embarked on a journey of research at LG Electronics Sensor Solution Lab, where he focused on the developing of MEMS sensor platform and its application in products. Afterward, he assumed his current position at the Institute of Microelectronics in Singapore, where he delved deep into research at the acoustic MEMS device. His expertise spans a wide spectrum, from MEMS devices to sensor solutions, acquired through 15 years of experience in the field. He is currently engaged in various research and development initiatives in the field of piezoelectric micromachined ultrasound transducers and low-power MEMS switches.

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Established in 1991, the Institute of Microelectronics (IME) is a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). In IME, we focus on delivering high impact research and development for the global semiconductor industry. IME’s role is to collaboratively develop and innovate next-generation technologies to enable a dynamic semiconductor ecosystem. Together with our highly skilled talent pool, we develop strategic capabilities and innovative technologies through state-of-the-art infrastructure. IME’s core research areas are in Advanced Packaging, piezoMEMS, SiC, mmWave GaN, and photonics & sensors. We will continue to shape the semiconductor industry’s roadmap for many years to come.

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  • 11:50 – 12:10

SingleDieTM MEMS-Based SAW MEMS on CMOS Reference Clock for Automotive and Industrial Applications

With no doubt, we are all witnessing the digitization of all aspects of our life promising formidable devices and business opportunities. The automotive industry’s push for autonomous driving and electrification is challenging suppliers and designers. Automotive requirements are very demanding not only on reliability but also performance under harsh environments and across wide temperature ranges. Modern cars have more than 50 timing devices needing a stable reference clock. Classically these clocks were based on Quartz crystals yet such traditional solutions face many performance challenges. Pearl Semiconductor SingleDie™ technology uses an innovative MEMS based solution integrating the resonator on the CMOS die forming a true one-stop shop for a reference clock that can withstand tough and demanding automotive requirements such as temperature and mechanical vibration. This breakthrough technology will pave the way to the first reference clock and timing chiplet solution opening unprecedented levels of integration and security.

Ayman Ahmed photo

Ayman Ahmed


Pearl Semiconductor

With a genuine passion for entrepreneurship, Ayman accumulated +28 years of engineering and managerial experience in the semiconductor industry. As one of the co-founders of Si-Ware Systems in 2004, he assumed several roles including VP of ASIC Engineering and VP of ASIC Marketing & Business Development before starting the Timing BU and then spun it out as Pearl Semiconductor in 2020. Ayman has notable contributions in the Timing industry such as leading the MEMS-Based Programmable Clock Generator Development program for Discera (Microchip) and a CMOS only LC-Based Self-Compensated Oscillator (SCO). Ayman holds 10 patents and received his B.Sc. and M.Sc. degrees in electronics and communication engineering from Ain-Shams University, Cairo, Egypt in 1994 and 2002 respectively.

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Coming soon…

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  • 12:15 – 12:35

Progress of Wafer Level Advanced Packaging Technology for MEMS and Sensor Integration

The development of the semiconductor industry in the new era has appeared new characteristics. On the one hand, it is still developing in the direction of continuing Moore’s Law, and the technology node is in the 3nm era; on the other hand, it is developing in the direction of beyond Moore’s Law, and advanced packaging has significant impact on it. In the past two decades, advanced packaging technology has developed rapidly in the direction of system integration, high-speed, high-frequency, three-dimensional and fine pitch interconnections. As wafer-level advanced packaging can achieve system miniaturization and high performance, the advanced microsystem integration technology with wafer-level advanced packaging as the core is gradually developed.

  1. The report focuses on the latest progress of advanced packaging in the new era,;
  2. discusses Through Si Via (TSV), Fan-Out packaging (WL-FO) and Through Glass Via (TGV) wafer-level packaging technology will be widely used in MEMS and EV fields;
  3. then further discusses the development path and trend from advanced packaging to advanced microsystem integration.
Jovin Li photo

Jovin Li

Technical Marketing Director

Xiamen Sky Semiconductor Technology Co., Ltd.

Graduated from HUAZHONG University OF Science and Technology Electronics Department in 2006, then successively engaged in customer technical support and marketing work in China Resources Shanghua and Kunshan Huatian. With more than 15 years of working experience in semiconductor industry,I have clear understanding of wafer manufacturing, packaging , testing and module industry. As Moore’s law slows down and the perspective of the upstream and downstream of the semiconductor industry chain, the advanced packaging plays an increasingly important role and has huge potential for future development. Based on this, I worked with Dr. Yu Daquan to establish Xiamen Sky-Semi Semiconductor in 2018 and now I am responsible for the marketing work in Sky-Semi Semiconductor.

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Founded in July 2018, Xiamen Sky-semi commits to the development and industrialization of advanced packaging and system integration technology for high-speed and high-frequency communication applications. Through independent R&D and collaborative innovation, we provide customers with integrated solutions and services from collaborative product design, process research and development to mass production.

The main business of Xiamen Sky-semi includes Wafer Level 3D Package (WLP), Fan Out Package (FO), System in Package (SIP) and Module, IPD device manufacturing, High Density Glass Through Via (TGV) technology, manufacturing of high precision antenna ,etc. We have provided design, packaging and integration services for nearly 100 customers at home and abroad。Sky-semi has a core team with outstanding innovation ability that has broken through a series of core and key technologies and has full range of wafer level system packaging as well as precision manufacturing capabilities from 4 inch, 6 inch, 8 inch to 12 inch.

Sky-semi Semiconductor based on technological innovation embarking on seize the historical opportunity to achieve leapfrog development in the new era of global semiconductor industry competition pattern by adhere to customer-centered ,Innovative and progressing philosophy,5G application as a breakthrough.

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  • 12:35 – 13:55

Lunch Buffet

Power Semiconductors to Support the Growing Demands of EV

  • 14:00 – 14:20

Innovative Power Solutions in Industrial Applications driving towards Carbon Neutrality and Greener Future

The world is confronting extraordinary challenges, and the preservation of our planet is no longer a choice, but a necessity. The semiconductors ecosystem emerges as a trailblazer, propelling rapid innovations. In this presentation, Mr. Muggeri will share the unwavering commitment of ST on sustainability, and how ST actively fosters sustainability by spearheading the production of renewable energies, amplifying power efficiency with the cutting-edge diffused intelligence (Digitalization) and pioneering Energy and Power Conversion. He will also discuss the new technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN) contribute to better power efficiency and more intelligent solutions for energy usage.

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Francesco Muggeri photo

Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, APeC/China


Francesco Muggeri is Vice President for Power Discrete and Analog Products, Asia Pacific at STMicroelectronics. In his role, Francesco leads ST’s Industrial Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and coordinates ST’s global Mass Market Industrial Task Force, with regards to consumer segment.

Muggeri joined ST in 1995, as a designer for automotive sensors in Italy. In 2000, he moved to product marketing for power transistors before relocating to Shanghai as marketing manager for transistors in 2002. In 2008, Muggeri moved to Commercial Marketing for STMicroelectronics’ Asia Pacific operations in Hong Kong. He became director for Discrete and Analog Products in 2015 and added Marketing Communications to his mandate in 2016.

Francesco Muggeri was born in Zambrone, Italy, in 1969, and graduated with a Master’s degree in Electronic Engineering from the University of Pisa, Italy. In 2014, he was awarded an EMBA degree from the Global Asia Program organized by the London Business School of London, the Colombia University of New York, and the University of Hong Kong.

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At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. We are committed to achieving our goal of becoming carbon neutral by 2027. Further information can be found at www.st.com.

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  • 14:25 – 14:45

Wolfspeed’s SiC Optimized Power Module Approach

Wolfspeed’s founders were the first to successfully commercialize Silicon Carbide, and for more than 35 years have focused on designing and supplying the industry’s highest-performing Silicon Carbide and GaN-on-Silicon-Carbide materials and devices for high-power applications.

In 2015 Wolfspeed acquired Arkansas Power Electronics International Inc. (APEI), which specialized with approx. 50 employees in wide-bandgap advanced and high-performance power modules for a variety of customers and applications, including the defense, aerospace and automotive markets. Since its foundation in 1997, APEI created more than 100 patents and developed a broad power module portfolio above 10,000V and 1,000A.

The acquisition combined two experts with complementary skills to define the ideal combination of device and packaging technology to set the industry standard for power modules.

Today, Wolfspeed’s Power Module Business Unit with almost 150 people globally is developing and offering Silicon Carbide optimized power modules for mainly I&E, automotive and MV/HV applications.

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Sascha Dern photo

Sascha Dern

Director of Product Line


Sascha Dern is Director of Product Line of Wolfspeed in Fayetteville, AR, USA, where he is overseeing the global overmolded power module business. Born in Berlin, Germany, Sascha studied Electrical Engineering at the Technical University in Darmstadt and received his Dipl.-Ing. degree in 1998. He started his career at Texas Instruments when he joined the European Graduate Program with three assignments across Europe. Before joining Wolfspeed in 2021, he held various positions in Europe and in the USA at TI, EM Microelectronic Marin, Sensortechnics, Lantiq and Infineon.

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Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.

Wolfspeed® is a registered trademark of Wolfspeed, Inc.

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  • 14:50 – 15:10

Intelligent Power and Sensing Packaging Solutions for a Sustainable Future

Vehicle electrification, autonomous driving, renewable energy and big data are enabling unprecedent changes in human life, and are pushing the technology to new limits. Those major evolutions require power electronics and sensing solutions, driven by optimum technology and packaging solutions to deliver maximum product efficiency.

This talk will review recent progress in front end technology , packaging (discrete, power modules) and highlight the importance of system integration.

It will illustrate the challenges of simultaneously meeting a wide range of power density, product scalability , cost and reliability requirements, and are made possible by the ongoing progress in semiconductor research, engineering and manufacturing.

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Jerome Teysseyre photo

Jerome Teysseyre

VP Package Development & Engineering


Jerome is having 25 years of experience in Package development and engineering.

His career started in Europe with the introduction of BGA , System in Package, embedding and optical camera sensors. Soon after Jerome moved to Singapore to develop southeast Asia packaging center of excellence focusing on next generation wafer level packaging introduction such as E-WLB (fan out).

Jerome transitioned in 2014 to onsemi and power electronics. Jerome’s team are focusing on the development and release to production of differentiated automotive package portfolio and solutions for wide band gap.

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onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

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  • 15:15 – 15:25

Closing Remarks

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