• 08:00 – 08:50

Registration

  • 09:00 – 09:20

ISES Welcome Address

Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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HPC Session

  • 09:20 – 09:50

Keynote

Innovation to Enable More Compute From Each Transistor

For decades, Moore’s Law has delivered the ability to integrate an exponentially increasing number of devices in the same silicon area at a roughly constant cost. This has enabled tremendous levels of integration, where the capabilities of computer systems that previously occupied entire rooms can now fit on a single integrated circuit. Although traditional scaling has slowed over the past decade, we have made tremendous progress as an industry with new approaches including chiplet-based architectures, domain-specific accelerators, and advanced packaging technologies which have enabled major milestones including the first exascale supercomputers. As we look into the future, we need to accelerate the pace of innovation to drive the next decade of advancement in high-performance computing. By far, the largest limiting factor to delivering continued compounded growth in computation power is energy efficiency. In this paper, we highlight a holistic strategy for accelerating innovation in energy efficiency required for next-generation high-performance computing and ultimately achieving zettascale performance.

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Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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  • 09:50 – 10:20

Keynote

Now is the Time to Re-imagine Memory Centric Computing

Over the last several decades, systems have focused on innovation in the logic and have strayed away from ‘balanced’ machines. As a result, a significant

number of applications have been unable to leverage the additional computational power of the latest generation machines . The machine architectures need to evolve: new systems architectures and innovations require a deep understanding of the applications. Memory will be the ‘cornerstone’ of future innovative systems, which will generate a faster time to solution in a much more energy constrained envelope.

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Steve Pawlowski

CVP Advanced Memory Systems

Micron Technology, Inc.

Steve Pawlowski is corporate vice president of advanced computing solutions at Micron Technology. He is responsible for defining and developing innovative memory solutions for the enterprise and high-performance computing markets.

Prior to joining Micron in July 2014, Steve was a senior fellow and the chief technology officer for Intel’s Data Center and Connected Systems Group. His extensive industry experience includes 31 years at Intel, where he held several high-level positions and led teams in the design and development of next-generation system architectures and computing platforms.

Steve earned bachelor’s degrees in electrical engineering and computer systems engineering technology from the Oregon Institute of Technology and a master’s degree in computer science and engineering from the Oregon Graduate Institute. He also holds 58 patents.

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Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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  • 10:20 – 11:20

Coffee Break Sponsored by CNW Business Meeting Slot 1 & 2, Networking and Coffee Break

Advanced Packaging Session

  • 11:20 – 11:50

Keynote

Unleash Product Innovations with 3DFabric

With the development of 3DIC and associated packaging technologies, semiconductor industry has extended performance and density optimization to system level, complementary to traditional chip scaling. Amid broader adoption of TSMC’s advanced 2.5D/ 3D packaging solutions along with growing chiplet complexity and form factor, the interaction between Si, packaging and components become increasingly crucial and requires continue innovations on design, process development and manufacturing.

With 3DFabric Alliance, we are extending OIP collaboration to packaging/ testing and working with industry partners on substrate and memory technology development for integrated system-level design solution to customers, together with the ecosystem of OSATs, material and equipment suppliers. In parallel, we also establish the worldwide first fully automated factory to offer best flexibility for our customers to optimize their packaging solution with better cycle time and quality control.

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Kam Lee photo

Kam Lee

Deputy Head of TSMC Advanced Packaging Technology and Service

TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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  • 11:50 – 12:20

Keynote

Heterogeneous Integration Platform for Next Generation Computing

Today’s era of smartphones, 5G, AI and big data calls for increasingly faster speeds of computing performance. However, the speed of semiconductor innovation and technology advancement has slowed down, and chip miniaturization has reached physical limits, which has caused the speed at which transistors are growing smaller to slow down. In other words, we are now falling behind Moore’s Law.

Advances in heterogeneous chip packages are need to empower today is the device manufacturers to pursue tomorrow’s breakthrough. Both 2.5D and 3D will be needed to keep innovation vibrant also higher bandwidths and density solution is important for HPC and AI systems. So memory coherency and low latency attributes across converged compute infrastructures with interconnect technologies including UCIe.

In this paper, advanced package solutions are to be introduced and discussed in terms of challenges and opportunities for emerging high end computing, memory and mobile platforms.

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Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

CVP Business Development Team, AVP

Samsung Electronics

Dr. YOON is currently working as Corporate VP/Business Development Team, AVP, Samsung Electronics

Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. YOON received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.

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Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

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  • 12:20 – 12:40

New Energy to Semiconductor – Heterogeneous Integration Packaging

Heterogeneous Integration (HI) is now one of key semiconductor worldwide trends and developing important impact and increasing influence to chip designer, Fab, OSAT, OEM/ODM and entire supply-chain enablers. The view on impact and influence can be pretty different to mobile, IoT, HPC, and automotive applications’ system developers based on various HI solutions. This presentation will discuss the HI packaging as a new enabling energy for semiconductor migration.

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Dr. C.P. Hung photo

Dr. C.P. Hung

Corporate VP RD

ASE

Dr. C.P. Hung currently holds the position of Vice President, Corporate R&D, at ASE Group. Based in Taiwan, he leads teams responsible for next-generation product development featuring integrated technologies, as well as a broad range of advanced chip, package, and system integration solutions with multiple ASE and USI Sites.

During his tenure, Dr. Hung has performed a variety of management roles at ASE, including VP of Corporate Design, VP of Central Engineering & Business Development and VP of Logistic Services Integration. He holds 180 patents encompassing IC packaging structure, process, substrate and characterization technology. He has also published over 104 conference and journal papers.

Dr. Hung is a board of governor of IEEE EPS since 2019. He has being the SEMICON Taiwan PKG & TEST Committee Chair since 2013, and currently Co-Chair since 2021.

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ASE is the leading global provider of semiconductor manufacturing services in assembly and test. With a proven track record spanning almost 40 years, ASE today is at the forefront of flexible, powerful, integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are being refined and enhanced to support future generations of system integration. Heterogenous Integration through SiP is enabling significant innovation across dynamic application areas including AI, 5G, automotive, mobile, IoT and more. Our industry is driven by innovation, and through ASE’s miniaturization technologies, we are enabling transformative solutions that are literally changing lives, from health to transportation, from Robotics to AI, from IoT to 5G.

Website: ase.aseglobal.com

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  • 12:40 – 13:40

Buffet Lunch

  • 13:45 – 14:05

A 360 View of Semiconductor Test from AI and Security Perspective

This keynote will explore the impact of deep learning including large language models on the semiconductor test. We will highlight the opportunities these models present for real-time data processing and discovery of insights, with specific applications in computer vision and natural language processing. However, the use of these models also introduces new security risks, particularly regarding the use of cloud infrastructure for collection of data, training and inference. By examining past attacks on networks, we will discuss the potential for malicious actors to steal data or intellectual property from companies. Attendees will gain an understanding of the opportunities and challenges in AI and security for the coming years and the importance of considering security measures in the development and deployment of these advanced solutions.

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Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

Michael Chang is the Vice President and General Manager of Advantest Cloud Solutions (ACS), a strategic business unit within Advantest Corporation to enable customers in the Advantest value chain to deliver improved yield, quality, and time to volume / market. Michael boasts 25 years of diverse experience leading product innovations and business growth across AI/Machine Learning, Cloud Datacenter and Semiconductor spaces. Before joining Advantest, Michael was the General Manager of AI Solutions business at Supermicro Computer. Prior to Supermicro, he was the Co-founder of a deep learning startup company. He has also held multiple leadership roles at several IC companies including LSI, Marvell, and Vitesse semiconductor. Michael holds an MBA degree from Haas Business School at UC Berkeley, a bachelor degree in Electronics and Communications Engineering from the National Chiao Tung University and has completed the Executive Leadership Program from Stanford’s Graduate School of Business.

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Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

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  • 14:05 – 14:15

Hybrid Bonding: Innovation to Adoption

Hybrid bonding allows semiconductor wafers or individual die to be bonded with exceptionally fine-pitch (scalable to 1 micron) 3D electrical interconnects at low temperature without pressure or adhesives. Hybrid bonding was invented by a company called Ziptronix which was later acquired by Adeia (formally known as Xperi) in 2015. Since then, Adeia has continued to invest heavily in hybrid bonding R&D and supply chain enablement for production worthy wafer-to-wafer and die-to-wafer hybrid bonding processes. Adeia, a pioneer in hybrid bonding, has licensed numerous semiconductor companies to the bonding portfolio including Sony, SK hynix, Samsung, Micron, Kioxia, Western Digital, Qorvo, Canon, LAPIS, and UMC. Several of these companies engaged in a technology transfer program as well. Hybrid bonding technology was commercially adopted in stacked BSI image sensors, stacked 3D NAND memories, logic processors, and is anticipated to be adopted soon in HBM and RF front-end devices. In logic applications, a large die can be disaggregated into separate functions such as cache memory and processor. After disaggregation, the functional chiplets can be bonded on top of a core processor die to create a fully functional circuit. The hybrid bonding technology is a must-have tool to provide a multi-generational roadmap of products in high performance computing devices such as CPU, GPU, FPGA, SoC, other logic, memories, and 3D chiplet integrations.

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Abul Nuruzzaman

VP, Technology and IP Licensing

Adeia

Abul Nuruzzaman is VP of Semiconductor Technology and IP Licensing at Adeia, Inc. (formally known as Xperi), San Jose, California. Prior licensing role, he led the marketing of Adeia’s hybrid bonding technology and semiconductor IP portfolio. Throughout his successful semiconductor industry career, Abul worked in product management, marketing and business development roles at AMD, Infineon (Cypress Semiconductor), TE Connectivity and Lattice Semiconductor. He holds BSEE degree from Osaka University, Japan, and MSEE degree from the University of California, Los Angeles (UCLA).

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Adeia invents, develops and licenses fundamental innovations that shape the way millions of people explore and experience entertainment and enhance billions of devices in an increasingly connected world. Leveraging the combination of highly experienced technologists, scientists, engineers and advanced R&D labs in San Jose, California and Raleigh, North Carolina, Adeia develops industry-leading 3D integration solutions such as hybrid bonding that meet the demand for greater functionality, higher performance and smaller size for next generation electronics.

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Automotive and Power Semiconductor Panel Session

  • 14:15 – 14:35

GaN is Accelerating e-Mobility

Driven by evolving consumer preferences and regulatory pressure, it’s a consensus that the adoption of electric vehicles will continue its sharp growth trajectory in the coming years. Leading automakers and suppliers have announced rigorous investments and visionary plans to meet the booming demand. Driven by the need for longer ranges and more efficient charging capacity, EV power electronics undergo a paradigm shift toward wide bandgap semiconductors. With mature manufacturing capacity and proven reliability, GaN is changing the game for 400V and 800V EV applications by delivering unprecedented benefits in power density and even BoM cost with superior switching frequency and loss performance.

In addition, electric micro-mobility is gaining traction worldwide as it provides a greener, less expensive, and more flexible last-mile transportation option in urban areas. For applications where small size is critical, GaN has turned a new page for power electronics in two-wheeler, three-wheeler, and microcar applications.

Stephen Coates, General Manager (Asia) and VP of Global Operation of GaN Systems will address how GaN is widening its applications and making disruptive innovations in the future of mobility.

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Stephen Coates photo

Stephen Coates

GM & VP Global Operations

GaN Systems

Stephen has previously held executive level engineering & operations roles in silicon & compound semiconductor & displays technology companies including VP Operations at DigiLens, VP Operations at Symmorphix Thin Films Inc, VP Operations at Fultec Semiconductor Inc/Bourns & VP Production Engineering at MaxQ Technology heading up power module design & manufacture. A seasoned technology executive with 30 years’ experience in engineering, manufacturing operations, supply chain management and quality. Stephen has substantial experience in establishing and developing strategic supply chain relationships to support full product commercialization and high volume manufacturing, while also being an expert in device packaging, process development and integration. Stephen also previously held lead assessor qualifications for 3rd party audit to ISO 9000 & equivalent standards (eg TS16949/AS9100).

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  • 14:40 – 15:20

Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?

Moderator
Andy Chuang photo

Andy Chuang

Consultant

Mr. Chuang received his M.S. degrees in Electrical Engineering of National Tsinghua University. After graduated, he joined UMC R&D to start his professional career. Starting from R&D to give him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales and expat to Europe to manage key customers. Completely training to make him realize wafer business and supply chain. After UMC, he joined EDA vendor, Synopsys. This experience helped him connecting chip design to wafer manufacturing. After that, he joined CSMC in China as VP of marketing and sales. He led company to have creative ideas to customize BCD processes targeting to specific application and won the China market, such as Class A/B, Class D, Charger, PMIC, LED display, and LED lighting. In 2013, he joined Episil, started business in compound semiconductor (SiC and GaN-on-Si). He is the one who run both SiC and GaN-on-Si at the same, and delivered supreme manufacturing cycletime, production yield to customers. He started new career in GaN Systems from 2022. GaN Systems is a trusted company which can deliver GaN devices to Automotive and High Rel application. GaN Systems enables power conversion companies to revolutionize their industries and transform the world.

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Panelist
Walter Chen photo

Walter Chen

SVP Greater China Sales & Marketing

Amkor Technology, Inc.

Walter joined Amkor in 2020 and is currently Sr. Vice President responsible for Sales & Marketing in Greater China. Prior to joining Amkor, Walter worked for Cree, Inc 17 years as a position for VP of LED Chips Marketing WW & LED Component Marketing in Asia. Also as a Board member of Lextar representative for Cree. Prior to Cree, he had 6 years of IC design house experience. He has 29 years of Semiconductor industry experience in total, focused on Sales & Marketing field. He holds a Master degree of Engineering Business Management from University of Warwick in UK.

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As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Panelist
Ian Chan photo

Ian Chan

CTO & Managing Director

Cyntec

Education

  • PhD EECS, University of Michigan USA (1992)

Professional Experience:

  • CEO, Episil Holding Inc. (2013-2016)
  • CSO, Hermes-Epitek (2016-2018)
  • Independent Director, UNIVERSAL CEMENT CORPORATION(2017~ )
  • CTO&Managing Director, Cyntec Co., Ltd. (2019~ )
  • Chairman, Power Forest Technology Corporation(2019~ )
  • Independent Director, Excelliance MOS Corporation(2021~ )
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Since 1991 Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products and solutions. The product lines consist of magnetic components, passive components, power modules, RF & optical modules which serve the client, cloud computing equipment, automotive, IOT, industry, and other market segments.

Using our insight into market trends and the in depth knowledge of electronic materials and processes, we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.

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Panelist
Stephen Coates photo

Stephen Coates

GM & VP Global Operations

GaN Systems

Stephen has previously held executive level engineering & operations roles in silicon & compound semiconductor & displays technology companies including VP Operations at DigiLens, VP Operations at Symmorphix Thin Films Inc, VP Operations at Fultec Semiconductor Inc/Bourns & VP Production Engineering at MaxQ Technology heading up power module design & manufacture. A seasoned technology executive with 30 years’ experience in engineering, manufacturing operations, supply chain management and quality. Stephen has substantial experience in establishing and developing strategic supply chain relationships to support full product commercialization and high volume manufacturing, while also being an expert in device packaging, process development and integration. Stephen also previously held lead assessor qualifications for 3rd party audit to ISO 9000 & equivalent standards (eg TS16949/AS9100).

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Panelist
Dr. Wei-Chung Lo photo

Dr. Wei-Chung Lo

Deputy General Director, Electronic & Optoelectronic System Research Laboratories (EOSL)

Industrial Technology Research Institute (ITRI)

Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.

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ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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  • 15:20 – 16:20

Coffee Break Sponsored by CNW Business Meeting 3 & 4 Networking and Coffee Break

Equipment and Service Supplier Session

  • 16:20 – 16:30

Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

For years, the logistics industry has been challenged by its reliance on manual processes from order placement and tracking to delivery.Recent global disruptions such as COVID-19 and labor strikes have made shipping more and more difficult, but Airspace excels in the most challenging circumstances.You cannot rely on traditional logistics anymore.Airspace has built a shipping platform that’s powered by proprietary AI technology. With mobile and desktop functionality, Airspace has offered major companies in the semiconductor industry the most reliable shipping options and full visibility along the way. By calculating millions of routes for you in seconds, your most critical shipments can get there faster and more efficiently than you ever thought possible.

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Aziza Dada

Sector VP

Airspace

Aziza Dada is a logistics professional with 15 years experience in International supply chain and time critical logistics. She has extensive knowledge of the global semiconductor industry. Her goal is to be result-oriented with a focus on continuous process improvement and high quality service. Aziza keeps close track of changes to regulations by country as wells processes involved in international supply chain and transportation. Welcome to the future of Logistics with Airspace. Let her show you how how AI and modern technology will improve your most critical deliveries.

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Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.

With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.

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  • 16:30 – 16:45

Process Control Challenges in Packaging for High Performance Computing Applications

As the pace of Moore’s law slows, and the associated development cost increases, the industry has turned to advanced packaging to enable the improvement of the overall system performance, whilst also reducing cost. A key trend is the adoption of a “chiplet” approach, with panel level packaging and hybrid bonding being the two key advanced packaging enablers for the heterogenous integration. In this presentation, we will discuss the challenges and solutions for process control as well as the importance of chiplet genealogy.

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Dr. Monita Pau photo

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

Dr. Monita Pau is Strategic Marketing Director for Advanced Packaging at Onto Innovation. Prior to joining Onto, she held various application engineering, marketing and strategic business development roles at DuPont and KLA. Her expertise spans across FOEL/BEOL process control solutions as well as advanced packaging and assembly materials serving both core and specialty semiconductor markets. Dr. Pau holds a Ph.D. degree in Chemistry from Stanford University.

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Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com

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  • 16:45 – 16:55

Challenges and Solution of FLI Technologies in various HI Packaging Architetures

“More Than Moore” with heterogeneous integrated Chiplets in different Advanced Packaging Architectures are continuously being developed in our Industry.

Along the development of these Advanced Packaging Architectures with the objectives of delivering the same or even better device performance as if it is in System On Chip (SOC), while at the same time of achieving the best cost of making, it brings challenges to advanced packaging engineer. ASMPT, being the total interconnect solution provider, has determined to collaborate with our customers and partners to overcome these challenges and offer the best-in-class interconnect equipment solutions to address their needs in a timely manner.

ASMPT is aiming to be a Total Interconnect Solution supplier establishing the widest product portfolio in Advanced Packaging Technology, from with thin film interconnect, to first level (die to wafer & substrate) as well as broad level interconnect (package to PCB). I am happy to share more with this presentation.

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Nelson Fan photo

Nelson Fan

VP, Head of KPU Advanced Packaging

ASMPT Limited

Nelson, VP of Business Development, Advance Packaging Technology focuses on High Precision Bonding and “Pick & Place” Solutions for Advanced Packaging. He has worked for more than 30 years in Semiconductor Packaging Industry. Prior to joining ASMPT, he held multiple senior management roles in R&D and manufacturing in both OSAT and design house. He has more than 40 US patents in semiconductor packaging technologies. Nelson holds a Bachelor degree in the field of Electrical Engineering from the University of Colorado at Colorado Springs, USA.

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ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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  • 16:55 – 17:05

Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

In our digital-driven society the increasing importance of information, automation and hence data processing requires the next generation of faster and smaller semiconductor devices. Metallization processes play a crucial role in enabling the newest interconnects and are hence of high importance for further technological advances. Requirements such as reliability, functionality and downsizing are thus common targets of semiconductor devices as well as plating processes.

We will present some of MKS Atotech’s new solutions for advanced packaging, such as Cu-to-Cu direct bonding as well as new processes for SnAg solder bump plating. Additionally, we will give insights into our offerings for highly reliable Si- and SiC-based Power Semiconductors.

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Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

Christian finished his PhD in chemistry and joined MKS Atotech in 2010. After holding various management positions, he was appointed Head of R&D in 2013 for the company’s electrolytic copper plating activities, mainly focusing on plating of various metals in different equipment tool sets (horizontal and vertical).

Christian Ohde is leading MKS Atotech’s global Semiconductor and Functional Electronics Coatings activities. He is a reputable industry expert and thought-leader in this field.

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Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com

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  • 17:05 – 17:10

3DIC W2W and D2W Hybrid Bonding

Replacing traditional solder based micro-bump interconnects with Hybrid Bonding process flows is still considered a game changer for 3D integration. This interconnect method offers a unique solution for contact pitch scaling and therefore is in the spotlight of R&D roadmaps at all major research institutions, IDMs and foundries as well as the equipment and materials industry. In order to ensure optimum overlay results to allow for small interconnect pitches, the best possible alignment accuracy and repeatability needs to be consistently maintained during the joining process. Depending on the specific application there are different processing schemes for Hybrid Bonding which co-exist. These include wafer to wafer (W2W), collective die to wafer (CoD2W) as well as sequential die to wafer (D2W) approaches which all need to be carried out at cleanliness levels that are comparable to front-end-of-line (FEOL) requirements. Each of these process flows comes with specific challenges which need to be addressed from an equipment as well as a process perspective. SUSS MicroTec leverages its leading position in wet processing and precision alignment for wafer level processes and has partnered with SET (Smart Equipment Technology), who is one of the technology leading flip-chip bonder manufacturers. SUSS MicroTec looks back at many years of hybrid bonding co-optimization activities with the research partner imec for collective D2W, while SET has worked for many years with CEA Leti on sequential D2W. Our solutions are optimized based on the learnings from these activities. In order to ensure optimum yield it is essential to monitor the overlay results with no blind spots across the wafer. Therefore a high throughput metrology system has been developed at SUSS MicroTec, which can be used for in-line inspection to trigger control loops and to record quality data for all dies on the wafer. Stand-alone metrology solutions with multiple overlay verification modules allow customers to scale their measurement capabilities according to their manufacturing needs. Specific state-of-the art alignment and overlay results for both, integrated W2W and D2W Hybrid Bonding schemes will be reviewed.

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Thomas Schmidt photo

Thomas Schmidt

Product Manager, Bonder Division

SUSS MicroTec

Thomas Schmidt is Product Manager in the Bonder Division of SUSS MicroTec in Sternenfels. After his graduation in Microsystems Technology at the University of applied sciences in Kaiserslautern he has held various positions in MEMS/semiconductor processing and has also lectured on advanced lithography as well as on MEMS and advanced CMOS fabrication.

Since December 2017 Thomas Schmidt is a member of the Bonder Division of SUSS MicroTec product line “Permanent Wafer Bonding“) with a strong focus on automated cluster platforms for MEMS/packaging applications and hybrid bonding for advanced packaging.

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SUSS MicroTec is a leading manufacturer of system and process solutions for micropatterning in the semiconductor industry and related markets. The company has more than 70 years of engineering experience and is a partner for high-volume production as well as for research and development. In close collaboration with research institutes and industry partners, SUSS MicroTec drives the development of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED production. With its global infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. The headquarters of SUSS MicroTec is in Garching, near Munich, Germany.

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  • 17:10 – 17:15

Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications

A wide range of applications in consumer electronics, automotive electronics, IoT applications and 5G cellular communications are increasingly dependent on devices such as sensors, including MEMS, and CMOS image sensors, RF Devices, advanced power semiconductors and Bipolar-CMOS-DMOS ICs. This trend means these specialty technologies currently account for approximately 30% of all global IC demand1.

Deep reactive ion etching (DRIE), initially developed for the fabrication of MEMS devices2, has since become one of the key enabling technologies used in the fabrication of such devices as well as in advanced packaging schemes that require through silicon via (TSV) integration. At the same time, demands on the capability of the DRIE process have increased as device architectures have advanced and production has shifted to high volume manufacturing on 300mm substrates.

Lam Research’s Rapidly Alternating Process (RAP) and Syndion® DRIE tools have been well established in such high-volume manufacturing for more than two decades. Today we are focused on continued enhancement of our systems and process control methodologies in order to meet future requirements.

In this work we show how development of our deep silicon etch hardware and process capabilities is resulting in significant improvements in on-wafer results and supporting next generation device fabrication. Such challenges include the continuous improvement of process productivity, improved profile control, achieving smoother etched sidewalls, and improving uniformity of both etch depth and feature CD.

To illustrate this, we will discuss critical applications such as advanced deep trench isolation (DTI) in CMOS image sensors, etching of power device trenches and TSV fabrication.

  1. IC Insights, McClean Report, Feb 2022
  2. Franz Laermer and Andrea Schilp, Robert Bosch GmbH, Method of anisotropically etching silicon, United States Patent 5501893
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Elpin Goh photo

Elpin Goh

Senior Director, Strategic Marketing, CSBG

Lam Research Corporation

Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.

Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.

Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.

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Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

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  • 17:15 – 17:20

Thinfilm Technology for Heat Dissipation Layers in HPC Applications

HPC (High Performance Computing) is a powerful tool that can be applied to solve intricate problems and overcome obstacles in diverse areas such as life science , environmental sciences, industrial and finance. To achieve high computing power, cutting-edge system-on-chips (SOCs) or next generation advanced packaging technologies are utilized to integrate processors, memory, and storage either on a die or package level. However, a critical hurdle in this process is effectively managing heat to preserve computing performance and power efficiency. In this context, we will discuss the challenges and present latest progress in thin film deposition of a solderable layer stack deposition on the wafer backside (BSM) to allow a perfect, reliable connection to the thermal interface material (TIM) foil. This back side metal (BSM) layer stack has not only to meet excellent adhesion and solderability, but also minimum film stress requirements and compatibility to tight process temperature restrictions of molded substrates.

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Ralph Zoberbier photo

Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging

Evatec

After completing his first degree in applied sciences, Ralph completed his MBA in 2006 and gained over 20 years experience in the semiconductor equipment business across roles in engineering, product management and global business and sales management before joining Evatec in 2019 as Head of BU Advanced Packaging. In addition to thin film technology, his technical expertise covers areas including lithography and ECD for both wafer and panel level applications.

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Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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  • 17:20 – 18:20

Cocktail Reception

  • 18:20 – 18:30

Dinner Check-in

  • 18:30 – 21:00

Gala Dinner Sponsored by Onto Innovation

Welcome Speech:

Vincent Wang photo