• 08:00 – 08:40

Registration

  • 08:40 – 09:00

Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

Recent advancements in Large Language Models (LLMs) and Generative Artificial Intelligence (Generative AI) have presented an exciting opportunity for developers, as exemplified by ChatGPT, which can mimic human dialogue and decision-making. However, the tremendous computing power and energy consumption required by the hardware implementing these models pose a considerable cost and challenge, due to a huge number of parameters and complex neural network architecture.

This talk will explore the potential of designing more efficient hardware for deployment and inference of large language models, from an integrated circuit (IC) hardware perspective. Possible methods of AI model compression, such as quantization, pruning or knowledge distillation will be covered as well as AI chip design based on Computing-in-Memory (CIM), Deep-Learning Accelerator (DLA) and Chiplets. This talk will also discuss the hardware and software co-design methodology and tools needed for improving the design quality and productivity.

Watch on ISES TV > PPTs in ISES Docs >
Dr. Ming-Der Shieh photo

Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

Ming-Der Shieh received the B.S. degree in electrical engineering from National Cheng Kung University, Taiwan, in 1984, the M.S. degree in electronic engineering from National Chiao Tung University, Taiwan, in 1986, and the Ph.D. degree in electrical engineering from Michigan State University, East Lansing, in 1993. From 1988 to 1989, he was an engineer at United Microelectronic Corporation, Taiwan. After receiving the Ph.D. degree, he joined the Department of Electronic Engineering, National Yunlin University of Science & Technology (NYUST). Since 2002, he has been with the Department of Electrical Engineering, National Cheng Kung University (NCKU), where he is currently a professor. His research interests include VLSI design and testing, VLSI for signal processing, and digital communication.

Dr. Shieh was the Chairman of EE Department at NYUST (1999-2002) and NCKU (2014-2017), and Dean of Miin Wu School of Computing at NCKU from 2021-2022. He also served as the Deputy General Director of Information and Communications Research Laboratories (ICL) at Industrial Technology Research Institute (ITRI) from 2010 to 2014, and was an Adjunct Research Fellow at the Office of Science and Technology, Executive Yuan, Taiwan from 2017 to 2019. In addition, he served as the Chairman of Taiwan IC Design Society (TICD) (2016-2018), Associated Editor of IEEE Transactions on Circuits and Systems – Part I (2010~2012), and General Chair/Program Chair/Technical Committee Member of several international conferences. Currently, as the Chief Technology Officer of Electronic and Optoelectronic System Research Laboratories (EOSL) at ITRI, he is responsible for strategic planning and cross-disciplinary collaboration. He is in charge of the IC research and development in EOSL, particularly in the area of AI chip design from different aspects, heterogeneous chiplet design and integration, and automotive IC designs.

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ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Metaverse Session

  • 09:00 – 09:30

Keynote

How The Semiconductor Industry Is Poised to Enable The Metaverse

The Metaverse is the next evolution in social technologies and the successor to the mobile internet. But what is the role of the semiconductor industry in facilitating the Metaverse? And why should semiconductor companies invest in this field? What new experiences and value will users get from such investments? In this talk, we will discuss these questions and a point of view on the answers. We will explore some key enabling technologies for Augmented Reality and Virtual Reality. These technologies will actualize the Metaverse vision and will usher in a new paradigm of human-computer interaction. We believe these technologies will also fuel the next two decades of semiconductor innovation.

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Dr. Ofer Shacham photo

Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

Dr. Shacham is Vice President, Head of Silicon, at Meta Reality Labs. He takes pride in building a vertically integrated Silicon organization from the ground up. Shacham works to constantly redefine what is possible with custom silicon, and in turn how humans and computers interact. To co-design hardware-software systems in order to give the world seamlessly blended virtual and real experiences.

Before Meta, Shacham worked for Google leading Silicon Design and Implementation for Consumer Hardware. Shacham initiated and led Google’s Pixel Visual Core & Pixel Neural Core, from idea to deployment on all Pixel Phones. Shacham also led some generations of Titan security chip, the early phases of the Pixel 6 Tensor Chip, and more.

Shacham joined Google as part of Google’s acquisition of Chip Genesis–a company he co-founded as a spin-out of the research he led at Stanford. Before Stanford Shacham worked for IBM R&D labs in Israel. Shacham also served in an elite Israeli Navy Unit.

Ofer Shacham holds a BSc degree from Tel Aviv University, and MSc and PhD degrees from Stanford University where he also served as academic staff. Dr. Shacham is a highly cited author for dozens of patents and scientific papers. Areas of interest are research, development and productization of outstanding research where hardware and software meet under strict power, form factor, and performance requirements.

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Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.

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  • 09:30 – 09:50

Inspiring a new reality with XR

The merge of digital and physical worlds, so called metaverse, is now happening. The metaverse is a vision of digital community. Accessing the metaverse, requires devices that allow users to experience the spatial internet. Qualcomm’s decade-plus investment in XR along with our foundational technologies enables the creation and widespread adoption of XR headsets to revolutionize digital experiences and provide an entry point of choice into the metaverse as it evolves. With the combination of high performance and low power computing, 5G and AI, we believe XR may have a greater impact on our world than PCs and smartphones combined.

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Patrick Chiang photo

Patrick Chiang

Sr Director Technical Marketing

Qualcomm Technologies Inc.

Patrick Chiang is the Senior Director of Marketing at Qualcomm Technologies, Inc. He is responsible for platform product marketing strategy and commercialization with focus on segments including mobile broadband, mobile computing, extended reality, wearable, IoT, and automotive (telematic/in-vehicle infotainment/ADAS), also enabling cross-platform leading technologies and services. Patrick’s work involves supporting Taiwan OEMs/ODMs on product portfolio planning and design, go-to-market planning, and global market development. He further supports the OEMs/ODMs on establishing collaboration with Taiwanese operators on deploying mobile technologies and developing business with Qualcomm partners.

Since joining Qualcomm in 2007, Patrick has served as the Head of Account Management for Customer Engineering at Qualcomm CDMA Technologies (QCT). In this role, he was responsible for providing technical support and project management for customer product development.

Patrick holds a Master of Business Administration degree and a Bachelor of Information Management degree from National Taiwan University.

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Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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  • 09:50 – 10:10

Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

This speech will introduce a cutting-edge technology that enables the creation of a live, 3D photorealistic Metaverse using AI, 3D modeling, and panoramic image stitching technologies. A photorealistic digital twin is a virtual replica of a physical object or space, created using 3D modeling, panoramic image stitching, and AI technologies. Some of the areas where photorealistic digital twins can have a significant impact is in smart factories and cities. By creating a digital twin of a factory or a city, we can visually simulate and optimize various processes, reducing costs and improving efficiency. One specific application in a smart factory is virtual patrolling. To create a virtual environment where personnel can patrol and control the factory remotely, we can reduce the need for on-site activities, Further examining this application, we can better understand the potential of a photorealistic digital twin in the Metaverse, and the role it will play in shaping the future of virtual but immersive experiences. Overall, this speech will demonstrate how AI, 3D modeling and panoramic image stitching technologies can be combined to create a LIVE 3D photorealistic Metaverse world, and its potential applications in various areas.

Watch on ISES TV > PPTs in ISES Docs >
CJ Hsieh photo

CJ Hsieh

COO

ASPEED

Experiences:

  • Advisory board, ISES Taiwan
  • Co-chair of Test Committee, SEMI Taiwan
  • General Manager, INTEL Innovation Tech. Ltd.
  • Spokesperson, INTEL Taiwan
  • Consulting Committee, National QUEMOY University
  • VP of Global Operations, LANTIQ Deutschland GmbH
  • GM & VP of Professional Services Lab, SPIROX Corp.
  • AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
  • Technical Manager of CPU / Memory Design, UMC
  • Project Leader of EDA DFT, SYNTEST Tech. Ltd.

Education:

  • MSEE, University of Southern California, Los Angeles, USA
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Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.

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  • 10:10 – 11:10

Coffee Break Sponsored by CNW Business Meeting 5 & 6, Networking and Coffee Break

  • 11:10 – 11:30

Display Technology for Metaverse – A Foundry’s Perspective

In the past decades, glass substrates with emission layers built on top were widely used in all kinds of display devices. Silicon chips played the traditional role as “driver ICs” to control LCD and OLED display panels. For emerging micro display technology in Metaverse applications, Silicon chips are further adopted to provide higher pixel resolution for better user experience. Emission layers on Si substrates (so called “Si-based micro display”) becomes popular for XR applications in Metaverse. There are several approaches to integrate multiple functions of chips within a Metaverse micro display. Pioneer system companies and panel companies work closely with Si foundries to develop high quality, reliable and cost-effective products. Of course, there are still several challenges in system integration and Si technology itself. In this presentation, we will share our thoughts about the role of Si technology in Metaverse micro display applications from a foundry perspective.

Watch on ISES TV >
Steven Hsu photo

Steven Hsu

VP Technology Development

UMC

Steven Hsu is working as VP of Technology Development in UMC, a pure foundry focusing on specialty technologies. Steven holds his master degree in Electronics Engineering from National Chiao Tung University. He has 24 years of experience in semiconductor industry with over 40 patents. He is currently responsible for technology development in logic, eHV, BCD, eNVM, and RFSOI product segments.

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UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC’s 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity over 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with worldwide total 20,000 employees.

For more information, please visit: https://www.umc.com.

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  • 11:30 – 11:50

Opportunities and Challenges for MicroLED Display

Micro-light-emitting diode (MicroLED) display technology has drawn a lot of attention in display industry recently owing to the superior optical and electrical properties. Compared to conventional display technologies, MicroLED display demonstrates higher efficiencies, longer lifetime, much higher brightness, ultra-high pixel density, faster response time and wider color gamut. MicroLED display is an emerging technology which can be used for all current display applications and new scenarios, such as transparent, seamless tiling, and AR glasses for metaverse. Based on our proprietary PixeLED display, SMAR·Tech, PixeLED Matrix, and µ-PixeLED technologies, we could utilize different process for each application with MicroLED displays.

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Dr. Charles Li photo

Dr. Charles Li

CEO & Co-Founder

PlayNitride Display Co., Ltd.

Dr. Yun-Li (Charles) Li is the CEO and co-founder of PlayNitride, one of the most advanced MicroLED companies in the world. PlayNitride was established by Dr. Li and his partners in 2014. Under Dr. Li’s leadership, PlayNitride has steadily grown to more than 300 employees within 6 years and keeps the leader position in development of MicroLED display technology. From September 2019, PlayNitride starts running the first MicroLED production line in Taiwan to deliver products to customers.

Dr. Li received his Ph.D. degree from Rensselaer Polytechnic Institute (USA) with Prof. Fred Schubert in 2003. Dr. Li’s Ph.D. work focused on gallium nitride (GaN) based light-emitting diodes (LEDs) and LED-based applications.

In 2020, Dr. Li received Special Recognition Award from Society for Information Display (SID). It recognized Dr. Li and his team in development and commercialization of MicroLED technology. It also indicated that MicroLED has been identified as the new generation display technology and key development topic.

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PlayNitride has become a leading company of MicroLED technology through the breakthrough innovations and diverse business models with PixeLED Display, PixeLED Matrix, µ-PixeLED, and SMAR・Tech solutions. PlayNitride has strong capability to integrate all required technologies to realize MicroLED display applications.

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  • 11:50 – 13:10

Buffet Lunch

AI Session

  • 13:10 – 13:30

Keynote

AI Computing in Large-Scale Era – The Golden Age of AI and IC

AI technology has made great progress recently. The number of parameters of the neural network has rapidly increased to the “pre-trillion-scale” level. With huge amount of computing, large-scale neural networks have shown “Emergent Abilities” in various AI functions. The growth rate of AI computing is far exceeding that of Moore’s Law for semiconductors. The huge amount of AI computing demand also brings new opportunities for semiconductor, and opens the door for a new golden age of AI and IC.

Watch on ISES TV > PPTs in ISES Docs >
Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

Dr. Bor-Sung Liang is currently a Senior Director of Strategic Technology Exploration Platform at MediaTek, Hsinchu Science Park, Taiwan, and concurrently serving as a Visiting Professor at Department of Computer Science and Information Engineering, EECS and GSAT in National Taiwan University, as well as a Professor Ranked Specialist at Institute of AI Innovation, IAIS in National Yang Ming Chiao Tung University. He received his Ph.D degree from Institute of Electronics, National Chiao Tung University, and graduated from EMBA, College of Management, National Taiwan University.

Dr. Liang has received several important awards, such as Ten Outstanding Young Persons, Taiwan, R.O.C., National Invention and Creation Award for three times on Invention (one Gold Medal and two Silver Medals) from Intellectual Property Bureau of the Ministry of Economic Affairs, Taiwan, Outstanding Youth Innovation Award of Industrial Technology Development Award from Department of Industrial Technology of the Ministry of Economic Affairs, Taiwan, Outstanding ICT Elite Award of ICT Month, R.O.C., and K. T. Li Young Researcher Award from Institute of Information & Computing Machinery and ACM Taipei/Taiwan Chapter. He is also the major inventor of more than 80 patents worldwide.

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MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do.

Visit www.mediatek.com for more information.

Telephone: +886-3-567-0766 ( more sites )
Email: https://corp.mediatek.com/about/contact-us

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  • 13:30 – 13:50

From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

Large language models (LLMs) have become an increasingly prominent feature in various computing platforms, such as data centers, smartphones, and microcontrollers. As such, their potential applications in both human-to-machine interfaces (HMIs) and machine-to-machine interfaces (M2MI) have been extensively studied and discussed. However, implementing hyper-scale LLMs on heterogeneous multicore System-on-Chips (SoCs) poses significant challenges. In this talk, we will discuss the key challenges, including issues related to hardware/software interfaces, verification, and SoC architecture exploration. At the end of this talk, we will propose a practical workflow and corresponding solutions we’ve applied in many cases. And see how our standard tool – ONNC – is used in the workflow.

Watch on ISES TV > PPTs in ISES Docs >
Luba Tang photo

Luba Tang

CEO

Skymizer Taiwan, Inc.

Luba Tang is the founder and CEO of Skymizer Taiwan Inc., which is in the business of providing system software to IC design teams. Skymizer’s system software solutions enable AI-on-Chip design houses to automate AI application development, improve system performance, and optimize inference accuracy. Luba Tang’s research interests include electronic system level (ESL) design, system software, and neural networks. He had focused on iterative compilers, ahead-of-time compilers, link-time optimization, neural network compilation, and neural network optimization. His most recent work focuses on exploiting various types of parallelism from different accelerators in a hyper-scale system-on-chip.

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Skymizer provides AI-on-chip system software subscription services, including compilers, calibrators, runtime systems, and various AI models (Model Zoo) to the complete source code of the basic application (application). Skymizer also provides customize software and relevant source code for the IC design company.

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  • 13:50 – 14:10

Unleashing the Power of AI: Opportunities and Challenges Ahead

Artificial intelligence (AI) has rapidly become an integral part of our lives, bringing convenience and efficiency to various aspects of work and daily life. This speech will explore the latest AI applications and examine the opportunities they offer. However, as we embrace the benefits of AI, we must also be aware of the potential challenges it poses. We will discuss the risks of workforce displacement, bias, and privacy infringement that come with AI deployment. Additionally, we will examine the environmental impact of AI, with a focus on the energy consumption of model training. We will discuss how the rapid growth of AI model parameters leads to the crossing of energy production and consumption curves, and suggest potential solutions to mitigate the issue. Ultimately, this speech will provide a comprehensive overview of the current state of AI, its opportunities, and its challenges, and offer guidance on how we can navigate this transformative technology.

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Dr. Justin Chueh photo

Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron Technology Inc.

Dr. Justin Chueh is the Director of the Monolithic and Heterogeneous Integration Department at Etron Technology, and he holds a Ph.D. in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor. His research focused on low power circuit design and resonant clock generation and distribution, which led to the granting of four US patents that were later utilized in CPU products by AMD.

Dr. Chueh has extensive experience in the semiconductor industry, having previously worked for AMD and TSMC before joining Etron Technology in 2019. During his time at AMD, he led the exploration of new standard cell architecture, managed the Memory Compiler Team, and contributed to the development of CPUs and GPUs. At TSMC, he incubated new technology platforms for Lidar, ADAS, and mmWave applications, overseeing product development from definition to mass production.

Dr. Chueh has authored papers published in prestigious conferences and journals and has been granted eleven patents, with more pending. He currently serves on the Memory TPC at ISSCC and also served on the Memory TPC at A-SSCC 2022.

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Etron Technology Inc. (TPEx: 5351.TW) is a world renowned fabless IC design and product company founded by Dr. Nicky Lu in the Hsinchu Science Park (February 1991). The company specializes in the production and research of buffer memory, logic chip designs, electronic applications, and system-on-chips.

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  • 14:10 – 15:10

Coffee Break Sponsored by CNW Business Meeting 7, Networking and Coffee Break

  • 15:10 – 15:55

Future of Taiwanese Semiconductor Supply Chain: Collaborations with International Partners

Moderator
Ray Yang photo

Ray Yang

Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)

Industrial Technology Research Institute (ITRI)

Ray Yang is consulting director at Industry, Science and Technology International Strategy Center of ITRI (Industrial Technology Research Institute), which is one of influential think tanks in Taiwan. Ray currently serves as principal investigator of semiconductor cross-disciplinary research group for National Science and Technology Council of Taiwan. He is also appointed by ITRI HQ as BD director at Office of Business Development. Ray is responsible for emerging technology and market dynamics research especially about semiconductors as well as industry-related geo-political issues.

Ray has more than 30 years’ experience with semiconductor industry, and had been advisor to Horizon 2020 “NanoElectronics Roadmap for Europe: Identification and Dissemination” 3-years’ project, and continues to serve as international advisor to Horizon Europe project “International Cooperation on Semiconductors” since 2023. Ray is serving as committee member at SEMI Taiwan Packaging & Testing, Smart Manufacturing, and MEMS & Sensors committees.

Ray’s analysis and commentary have been featured in the New York Times, the Wall Street Journal, Al Jazeera, Deutsche Welle, Voice of America, Radio Free Asia, Le Monde, among others. He also regularly appears on Taiwan’s media such as Central News Agency, Radio Taiwan International, United Daily News, Liberty Times, and has provided commentary for ERA TV, a Taiwanese broadcast media outlet.

Ray holds a MBA from Tel-Aviv International School of Management in Israel, and receives bachelor degree of electrical engineering with honor from National Tsing Hua University of Taiwan in 1986.

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ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Panelist
Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Panelist
Albert Lan photo

Albert Lan

Global Packaging Account TD Head

Applied Materials

Experience:

  • Over 30 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies.
  • Senior Engineering Center RD Head, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  • PD, Quality, & Sales, 5 years, Amkor Taiwan(Bumping)
  • Vice Chairman of SEMI Taiwan PKG&TEST Committee.
  • Executive Co-Chair – PKG Committee of IMPACT / TPCA.
  • Chairman of TILA (Taiwan Intelligent Leader Association).
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We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

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Panelist
Bruce Lu photo

Bruce Lu

VP Asia Technology

Goldman Sachs

Bruce Lu joined Goldman Sachs in 2018 as a Vice President and works in the Global Investment Research team where he is responsible for covering Asia technology stocks. He previously worked at Barclays, HSBC and CLSA, with a combined experience of 17 years in equity research covering semiconductor industry. Prior to equity research, Bruce worked at UMC, Applied Materials and JAFCO Asia as a senior investment manager. Bruce has a Master’s degree in Mechanical Engineering from Cornell University.

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The Goldman Sachs Group, Inc. is a leading global financial institution that delivers a broad range of financial services to a large and diversified client base that includes corporations, financial institutions, governments and individuals.

Founded in 1869, the firm is headquartered in New York and maintains offices in all major financial centers around the world.

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Panelist
Dr. Kuan-Neng Chen photo

Dr. Kuan-Neng Chen

Chair Professor

NYCU

Dr. Kuan-Neng Chen is Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, and M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He was Vice President for International Affairs and Associate Dean of International College of Semiconductor Technology in NYCU, Program Director of Micro-Electronics Program in National Science and Technology Council in Taiwan, and a Research Staff Member at IBM Thomas J. Watson Research Center. 

Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NSTC Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Awards (7 times), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 67 book chapters, and holds 87 patents. He was Guest Editor of MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society. 

In addition to his faculty position, Dr. Chen is Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration. 

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NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.

At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.

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Panelist
Jian Zhang photo

Jian Zhang

VP Product Test Engineering

Qualcomm Technologies Inc.

Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.

Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.

Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work

Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University

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Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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Market Trend Session

  • 16:00 – 16:20

Navigating the Dynamic Memory Market: Trends and Insights

The memory market is a cornerstone of the semiconductor and technology industry, with products such as DRAM, NAND flash, and emerging memory technologies powering everything from smartphones and laptops to data centers and autonomous vehicles. Keeping up with the latest trends and insights in this dynamic and constantly evolving market is essential for making informed decisions about product strategies, design innovations, and investments. Furthermore, the impact of global events such as the COVID-19 pandemic and geopolitical tensions cannot be ignored when considering the future of the memory industry. In this presentation, attendees will gain a comprehensive understanding of the latest trends, supply and demand dynamics, pricing trends, and potential emerging memory technologies that are shaping the market.

Watch on ISES TV > PPTs in ISES Docs >
Marco Mezger photo

Marco Mezger

COO & Executive Vice President

Neumonda

Marco Mezger is a global entrepreneur, investor, and advisor with over 25 years of experience in the semiconductor industry. Born in Germany and based in Taipei, Marco has a unique understanding of global semiconductor businesses with their challenges, resulting in a track record at various companies and as a matchmaker in the industry. As a thought leader focusing on memory technology, Marco has a sizeable global follower base on LinkedIn. He is also a regular guest on the business TV program “Taiwan Talks” commenting on the semiconductor industry news and market trends.

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Neumonda has been founded with profound know how and the ‘DNA’ of former German memory powerhouse ‘Qimonda’. It has the ability to provide memory and storage solutions to worldwide customers, especially targeting the industrial and specialty market segments.

“Deep understanding of the technical/supply chain aspects of product design and developments, in addition to sales and marketing are building the foundation of the the global management team to serve these markets with real ‘Memory Competency‘.”

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  • 16:20 – 16:30

Closing Address

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Salah Nasri

Senior Advisor to President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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