• 08:00 – 08:35

Registration

HPC and AI Session

  • 08:40 – 09:10

Keynote

TBC

Jason Ma photo

Jason Ma, Ph.D.

Engineering Director, Technical Site Lead Google Taiwan

Google

As the Engineering Director, Jason Ma oversees Google Taiwan’s site growth, business management and development, as well as leads multiple R&D projects across the board. Before taking this leadership role at Google Taiwan, Jason was a Platform Technology and Cloud Computing expert in the Platform & Ecosystem business group at Google Mountain View, CA. In his 12 years with Google, Jason has successfully led strategic partnerships with global hardware and software manufacturers and major chip providers to drive various innovations in cloud technology. These efforts have not only contributed to a substantial increase in Chromebook’s share in global education, consumer and enterprise markets, but have also attracted global talents to join Google and its partners in furthering the development of hardware and software technology solutions/services.

Prior to joining Google, Jason served on the Office group at Microsoft Redmond, WA. He represented the company in a project, involving Merck, Dell, Boeing, and the United States Department of Defense, to achieve solutions in unified communications and integrated voice technology. In 2007, Jason was appointed Director of the Microsoft Technology Center in Taiwan. During which time, Jason led the Microsoft Taiwan technology team and worked with Intel and HP to establish a Solution Center in Taiwan to promote Microsoft public cloud, data center, and private cloud technologies, connecting Taiwan’s cloud computing industry with the global market and supply chain.

Before joining Microsoft, Jason was Vice President and Chief Technology Officer at Soma.com. At Soma.com, Jason led the team in designing and launching e-commerce services, and partnered with Merck and WebMD on health consultation services and over the counter/prescription drugs/services. Soma.com was in turn acquired by CVS, the second largest pharmacy chain in the United States, forming CVS.com, where Jason served as Vice President and Chief Technology Officer and provided solutions for digital integration.

Jason graduated from the Department of Electrical Engineering at National Cheng Kung University, subsequent which he moved to the United States to further his graduate studies. In 1993, Jason obtained a Ph.D. in Electrical Engineering from the University of Washington, with a focus in the integration and innovation of power systems and AI Expert Systems. In 1997, Jason joined the National Sun Yat-sen University as an Associate Professor of Electrical Engineering. To date, Jason has published 22 research papers and co-authored 2 books. Due to his outstanding performance, Jason was nominated and listed in Who’s Who in the World in 1998.

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Our mission is to organize the world’s information and make it universally accessible and useful.

Website: www.google.com
Headquarters: 1600 Amphitheatre Pkwy, Mountain View, CA 94043
Phone: +1 (650) 253-0000

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Google
  • 09:10 – 09:40

Keynote

TBC

ST Liew photo

ST Liew

President, Taiwan & SEA Australia, New Zealand Vice President

Qualcomm

ST Liew is a Vice President of Qualcomm Technologies, Inc. and the President of Qualcomm Taiwan and South East Asia, Australia, New Zealand. ST was born in Malaysia and was educated in Malaysia, Singapore and the UK. His permanent home is Singapore.

In this role, ST is responsible for leading all business and operational functions for Qualcomm in the region. Prior to this role, ST served as the Vice President and President of Qualcomm Taiwan.

ST has more than 30 years of experience leading businesses and R&D in the telecommunication industry. Most recently ST was the President of Acer’s new Business Group SPBG that focused on R&D and Sales of non PC lines of product for the global market while living in Switzerland and later in Taiwan.

Before joining Acer, ST was in Motorola for over 18 years leading Regional R&D Teams and later in Product planning, business Teams across the world in products ranging from Mobile radios, Pagers, Data terminals to Cellular phones. ST has lived in China, Korea, USA and India during his tenure.

Liew received his MBA from the National University of Singapore, and holds a BSc. in Electrical and Electronic Engineering from the University of Leeds, UK.

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Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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Qualcomm
  • 09:40 – 10:10

Keynote

TBC

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

Dr. Bor-Sung Liang is currently a Senior Director of Strategic Technology Exploration Platform at MediaTek, Hsinchu Science Park, Taiwan, and concurrently serving as a Visiting Professor at Department of Computer Science and Information Engineering, EECS and GSAT in National Taiwan University, as well as a Professor Ranked Specialist at Institute of AI Innovation, IAIS in National Yang Ming Chiao Tung University. He received his Ph.D degree from Institute of Electronics, National Chiao Tung University, and graduated from EMBA, College of Management, National Taiwan University.

Dr. Liang has received several important awards, such as Ten Outstanding Young Persons, Taiwan, R.O.C., National Invention and Creation Award for three times on Invention (one Gold Medal and two Silver Medals) from Intellectual Property Bureau of the Ministry of Economic Affairs, Taiwan, Outstanding Youth Innovation Award of Industrial Technology Development Award from Department of Industrial Technology of the Ministry of Economic Affairs, Taiwan, Outstanding ICT Elite Award of ICT Month, R.O.C., and K. T. Li Young Researcher Award from Institute of Information & Computing Machinery and ACM Taipei/Taiwan Chapter. He is also the major inventor of more than 80 patents worldwide.

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MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do.

Visit www.mediatek.com for more information.

Telephone: +886-3-567-0766 ( more sites )
Email: https://corp.mediatek.com/about/contact-us

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MediaTek
  • 10:15 – 11:15

Networking and Coffee Break Business Meeting Slot 5&6

  • 11:20 – 11:40

TBC

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Samuel Chiang

Deputy Technical Director

Andes Technology

Samuel Chiang is currently the deputy technical director of Andes Technology’s marketing department, assisting in the planning and promotion of Andes RISC-V 32/64-bit processors and related products. He has 15 years of experience in semiconductor IP design and development, sales and marketing, and customer technical support. He also has four years of sales and marketing experience in the field of IoT cloud and security software. Before Andes, Samuel worked at Canonical in charge of IoT sales for the Asia-Pacific region. Prior to this, he worked at Arm for 16 years, leading the Asia-Pacific and global pre-sales technical teams to cooperate with customers. He was also in charge of business development in the Asia-Pacific region at Pelion, Arm’s IoT software service subsidiary. Samuel worked as a SRAM circuit designer in TSMC’s Design Service Department in the early days. Before that, he worked on C language compiler development in IBM Software Lab in Toronto. He holds a master’s degree in administrative management from National Taiwan University, and a master’s degree and a bachelor’s degree in computer engineering from Queen’s University Canada.

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As a Founding Premier member of RISC-V International, Andes is a publicly-listed company (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099) and a leading supplier of high-performance/low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit Out-of-Order processors with DSP, FPU, Vector, Linux, superscalar, automotive and/or multi/many-core capabilities. By the end of 2022, the cumulative volume of Andes-Embedded™ SoCs has surpassed 12 billion. For more information, please visit https://www.andestech.com.

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Andes Technology

Glass Substrates Session

  • 11:45 – 12:15

Keynote

Advanced Packaging Technologies for Heterogenous Integration: Glass Core Package Substrate

(Virtual Presentation)

Rahul Manepalli, Ph.D. photo

Rahul Manepalli, Ph.D.

Intel Fellow; Director Substrate TD Module Engineering

Intel

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

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Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Intel
  • 12:20 – 13:40

Buffet Lunch

Exploration of Taiwan Semiconductor Manufacturing Specialities and Technological Highlights

Immersive Experience Application

  • 13:45 – 14:05

TBC

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

Experiences:

  • Advisory board, ISES Taiwan
  • Co-chair of Test Committee, SEMI Taiwan
  • General Manager, INTEL Innovation Tech. Ltd.
  • Spokesperson, INTEL Taiwan
  • Consulting Committee, National QUEMOY University
  • VP of Global Operations, LANTIQ Deutschland GmbH
  • GM & VP of Professional Services Lab, SPIROX Corp.
  • AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
  • Technical Manager of CPU / Memory Design, UMC
  • Project Leader of EDA DFT, SYNTEST Tech. Ltd.

Education:

  • MSEE, University of Southern California, Los Angeles, USA
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Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.

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ASPEED

microLED Session

  • 14:05 – 14:25

Reserved

  • 14:25 – 14:45

TBC

Dr. Charles Li photo

Dr. Charles Li

CEO & Co-Founder

PlayNitride

Dr. Yun-Li (Charles) Li is the CEO and co-founder of PlayNitride, one of the most advanced MicroLED companies in the world. PlayNitride was established by Dr. Li and his partners in 2014. Under Dr. Li’s leadership, PlayNitride has steadily grown to more than 300 employees within 6 years and keeps the leader position in development of MicroLED display technology. From September 2019, PlayNitride starts running the first MicroLED production line in Taiwan to deliver products to customers.

Dr. Li received his Ph.D. degree from Rensselaer Polytechnic Institute (USA) with Prof. Fred Schubert in 2003. Dr. Li’s Ph.D. work focused on gallium nitride (GaN) based light-emitting diodes (LEDs) and LED-based applications.

In 2020, Dr. Li received Special Recognition Award from Society for Information Display (SID). It recognized Dr. Li and his team in development and commercialization of MicroLED technology. It also indicated that MicroLED has been identified as the new generation display technology and key development topic.

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PlayNitride has become a leading company of MicroLED technology through the breakthrough innovations and diverse business models with PixeLED Display, PixeLED Matrix, µ-PixeLED, and SMAR・Tech solutions. PlayNitride has strong capability to integrate all required technologies to realize MicroLED display applications.

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PlayNitride
  • 14:50 – 15:50

Networking and Coffee Break Business Meeting Slot 7&8

Wafer-Level Manufacturing for Optical Devices

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