Enabling Intelligence at the Edge: MEMS and Sensors Powering the AI Era

08:30 – 08:45

M.S.W.S. & I.S.I.G. Welcome

08:50 – 09:10

Keynote

Ken Diest

Research Manager and Tech Lead

Meta

09:15 – 09:35

Keynote

Christina Strohrmann, Ph.D.

Director Engineering, Advanced Products

Bosch Sensortec

09:40 – 10:00

Keynote

Gunar Lorenz, Ph.D.

Senior Director Technical Marketing Sensors

Infineon Technologies AG

10:05 – 11:05

Networking Break

11:10 – 11:30

Hiroshi Miyajima

Fellow ICT Division

MEMS Infinity / Sumitomo Precision Products

11:35 – 11:55

Senni Laaksonen

VP Research and Development

Murata Manufacturing Co., Ltd.

12:00 – 12:20

Amkor Technology, Inc.

12:25 – 12:45

Kees Wesdorp

Chairman of the Board

XIVER Mems Foundry

12:50 – 13:50

Buffet Lunch

13:55 – 14:15

From Sensing to Thinking: The Evolution of MEMS with Embedded AI

2024 was a welcome turning point for the MEMS industry, with global revenue estimated at $15.4 billion. This is primarily due to the winding down of the inventory stockpiling in the second quarter of 2024. The race for innovation is crucial to maintaining a high sensor value and stabilizing the average selling price (ASP). Implementing first-stage data processing at the sensor level is one possible solution that brings several advantages, from power consumption to versatile applications and ease of integration.
The presentation will provide an overview of the current status of the MEMS industry, key trends expected over the next five years, and insights into the evolution of the MEMS ecosystem within the global economic context.

Pierre-Marie Visse

Senior Technology & Market Analyst, MEMS & Sensing

Yole Group

14:20 – 14:40

Ruby Yan

Business Unit Director

GlobalFoundries

14:45 – 15:05

Thomas Russell

CEO and Co-Founder

Mesoline

15:10 – 15:40

Networking Break

MEMS & Sensor Testing

15:45 – 15:55

SPEKTRA GmbH Dresden

16:00 – 16:10

Ari Kuukkala

Development Manager

Pentamaster Technology

16:15 – 16:25

Oleg Fotteler

International Sales & Support – Management

SPEA

16:30 – 17:30

Panel Session: Breakthrough Innovations, Industry Collaborations and Roadmap

Panelist

Volker Herbig

VP BU Microsystems

X-FAB

Panelist

Alastair Attard

Director of Technical Program Management & Business Development

UTAC

Panelist

Ken Diest

Research Manager and Tech Lead

Meta

Panelist

Fraunhofer Institute for Photonic Microsystems

Panelist

STMicroelectronics

Panelist

Silex Microsystems

Panelist

Northrop Grumman LITEF GmbH

Panelist

chem

CSEM

End of content

End of content