Advanced Driver Assistance Systems (ADAS) are designed to help the driving process and enhance car/road safety. Automotive optical sensors enable ADAS and the autonomous driving transition from SAE J3016 Level 2 towards Level 4/5, according to SAE International (formerly the Society of Automotive Engineers).

Current optical sensor chip designs require custom package solutions which have assembly packaging and test challenges. In addition, stringent reliability requirements increase the development time to select materials, run process evaluation, optimize process parameters and complete reliability verification for automotive applications.

New automotive optical package innovations extend Amkor’s broad package portfolio capabilities and expertise to benefit automotive customers. The solution to current automotive image sensor application challenges involves creating a package platform that utilizes an assembly open toolbox, adopts a new generation of wafer fabrication requirement, achieves faster development cycle time and manages cost efficiency.

This presentation will discuss a standard package platform to design alternative package solutions, overcome technical challenges and satisfy the Automotive Electronics Council’s AEC Q100 reliability requirements for automotive optical sensors.

We are living in the era of technological revolution, where the integration of embedded Artificial Intelligence (AI) and Micro-Electro-Mechanical Systems (MEMS) sensors is shaping the future in astounding ways. This speech delves into the potential of this collaboration and demonstrates how it is bringing practical and exciting transformations to our daily lives. Embedded AI utilizes learning algorithms and data analysis to enable devices not only to meet our needs but also to predict and surpass them. MEMS sensors serve as the senses of these intelligent systems, allowing them to perceive and understand the physical world around them.

In this speech, Mr. Hongyu will explore specific application and use cases, such as personal environmental & health monitoring and personalized fitness application, to illustrate how these technologies are impacting and enhancing our quality of life.

Heterogeneous Integration requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.

A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.

MEMS device advancements are often correlated with the basic development of specific technologies. The Fraunhofer IPMS, renowned for its expertise in MEMS technology development, offers comprehensive development services ranging from initial ideation to qualified processes and transfer towards volume production. Ultrasonic sensors have already found widespread use in numerous application areas, including medical monitoring and object detection. Micromechanical ultrasonic transducers (MUT) based on MEMS, as exemplified by the Fraunhofer IPMS, introduces unique characteristics that enable innovative applications. This presentation will cover the key development aspects, from the initial concept to a stable technology, using this technology development example and is specifically tailored for business executives and development managers.

The average semiconductor value in a typical car is expected to grow from USD $812 per car in 2022 to USD $1,467 per car in 2029.1

MEMS devices are well established as critical components in a wide range of systems in the automotive sector. Accelerometers and gyroscopes improve safety, RF filters enable wireless connectivity, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart functions. As the demand on device performance and manufacturing volume increases, the need for improved MEMS manufacturing solutions becomes ever more prevalent.

For example, many established MEMS fabs and foundries are running at very high utilization and continuous improvements in manufacturing productivity and yield are becoming increasingly desirable. At the same time, MEMS developers are looking to the next generation of devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to piezoelectric based MEMS devices that can offer a paradigm shift in capability.

In this short overview, we will discuss how Lam Research is combining production proven high-volume manufacturing solutions, and novel process capabilities to address these challenges and technology inflections.

Source 1: S&P Global Mobility Automotive Semiconductor Tracker—April 2023

As a global semicondutor foundry. Silterra commits to its customers for innovation on processes technologies.

In this presentation, Silterra’s latest progress of emerging technologies development such as MEMS, SiPh and Life Science technologies will be presented.

MEMS testing is facing new challenges in terms of wafer-level solutions for production volumes. On one hand, there is no doubt that testing prior to packaging is beneficial for several reasons, resulting at the end in production cost reduction and faster time to market. On the other hand, a reliable wafer-level test of MEMS and sensors cannot be limited to the electrical characteristics of the devices. Dynamic testing of MEMS devices requires a new-generation of test equipment, able to determine and analyze also the device mechanical functions by measuring its non-electrical behavior. Field-proven equipment for the wafer-level sensor test of MEMS devices like accelerometers, gyroscopes, pressure sensors, magnetic sensors, are expected to be adopted as a standard by the industry. Another test challenge concerns the growing adoption of the wafer-level chip scale packaging technology (WLCSP) for MEMS sensors and actuators, in both consumer and automotive fields. The adoption of a complete solution for the production final test of WLCSP MEMS devices will be essential. Such equipment must be able to perform the high-throughput, soft handling of the devices directly from a diced wafer on film frame, to stimulate and test the devices at tri-temp, to perform the finishing on reel after testing. This presentation will explore these challenges, providing possible solutions, raising open points and questions.

Enriching lives and enhance human interactions in a digital world through innovative sensing solution is TDK’s mission and commitment to sensor business. The company would like to build the premier MEMS sensing platform to enable innovation and create customer values by delivering unique sensor solutions into targeted markets. Our MEMS sensor product spectrum includes motion tracking devices such as accelerometer and gyroscopes, microphone, pressure sensor, ultrasonic time of flight sensors, and CO2 environmental sensors. The company has a network of design and manufacturing locations and sales offices. Of particularly importance is TDK-InvenSense regional presence; where ~300 engineers are located with all aspects of operation and engineering activities to deliver 1 Billion units of intelligent sensors per year. This presentation will start with a brief history of TDK, its business evolution, and sensor business. Operation principle and product features of TDK MEMS sensors; particularly those developed and manufactured in the region, are introduced. Among these, TDK-InvenSense’s proprietary CMOS-MEMS system-on-chip platform enables the sensors with the industry-leading performance, power, and size. Finally, the presentation is wrapped up with TDK’s mission and commitment to sensor business. Sensing solution is the foundations of smart systems. Sensor is everywhere including hearable, metaverse, entertainment, environmental, drones, automotives, mobiles, computing, wearable, and industry.