• 08:30 – 09:30

Registration

  • 09:30 – 09:45

Welcome Speech

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Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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ISES

MEMS Manufacturing Complexities, Challenges and Solutions

  • 09:45 – 10:05

New Challenges for MEMS and Sensor Packaging

MEMS and sensor devices continue to enable new and exciting functionalities and applications across all market segments – automotive, industrial, communications, consumer and computing. These new functions and applications come with a new set of challenges.

The creation and use of standard packaging platforms have pushed rapid commercialization of MEMS and Sensor devices. It fueled the next evolution, from a discrete single MEMS/sensor towards sensor fusion (multi-MEMS/sensor packages) which created more opportunities and applications.

As the market continues to grow, and applications continue to become more complex, the traditional package size reduction on the X, Y, Z axes are being replaced by the need to do more integration such as reducing the PCB module to a surface mountable SIP package. The need for heterogeneous integration (HI) becomes an essential part of the new standard MEMS and sensor package platforms. Increase complexities require advanced packaging technologies and final test, as well as a closer collaboration between the different stakeholders in the MEMS and sensor ecosystem.

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Adrian Arcedera

SVP MEMS and Sensor Products

Amkor Technology, Inc.

Adrian joined Amkor in 1997, and is currently Sr VP for Memory, MEMS and Sensor Business Unit, responsible for the business and platform development for Memory, MEMS & Sensor Products. He has served in various leadership positions in Amkor’s chip scale products, including leading the platform development for Amkor’s ChipArray® package. He has authored multiple technical papers and has been granted multiple US Patents. He holds a degree in chemical engineering from the University of the Philippines.

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As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Amkor Technology, Inc.
  • 10:05 – 10:35

Keynote

Crossbreeding of MEMS, CMOS, CSOI, Optics and Assembly

This presentation will describe one aspect of the increasing complexity in MEMS foundry services including the resulting challenges and potential solutions.

The clear separation of raw wafer production, MEMS- and ASIC-manufacturing as well as packaging trend to vanish. Just some examples:

  • The raw wafer type CSOI requires MEMS processing and application of the product design.
  • Using the ASIC as cap for the MEMS requires stringent adaption of ASIC- and MEMS-design and -topography, as well as postprocessing of CMOS wafers in MEMS fabs.
  • Also the combination of MEMS and ASIC portions on one piece of silicon drives the need for mixed-mode fabs
  • Many MEMS types are made in ASIC facilities and in some cases, it is a pure question of definition, whether a product is named MEMS or ASIC, for example CMUTs or immobile optical MEMS architectures. This trend is accelerated by the need of typical CMOS tools, like ArF lithography for certain MEMS, like in some medical applications.
  • 3D stacking of CMOS, MEMS and III/ / V semiconductors drive new production approaches
  • Many more

Conclusions

Cost, size and performance requirements drive not only the transition from macromechanics to MEMS. It also supports an integration of MEMS and ASIC. Obviously, the alignment of ASIC and MEMS technology is crucial for the set up and the success. Additionally, some MEMS require processes, which are today available typically only in ASIC fabs, like lithography for narrow line widths, which are beyond i-line capability.

Cavity SOI is arising as a new category of raw wafer material. It provides additional options for future MEMS technologies. Since the mask layer “cavity” is designed depending on the product, a cooperation or merge of MEMS and raw wafer production is required.

The wafer fab to run such kind of mixed-mode device has to produce and control CMOS, MEMS and some assembly processes including cross contamination aspects.

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Dr. Stefan Majoni

Director Foundry MEMS

Bosch Sensortec

Stefan Majoni studied chemistry in Hannover and completed his PhD in solid state physical chemistry in 1994

He developed semiconductor lithography processes for DRAMs with IBM and ASICs with Philips.

Since 2005, he joins the Bosch MEMS team in several management positions, primarily in development and partly in production.

Stefan currently drives MEMS foundry service as director for Bosch.

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Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems, acoustic microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and has, to date, sold more than 15 billion MEMS sensors.

The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). According to preliminary figures, the company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.

As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. Bosch employs some 76,100 associates in research and development, as well as roughly 38,000 software engineers.

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Bosch Sensortec
  • 10:35 – 10:55

Fan-out Wafer Level MEMS Packaging for Automotive Applications

MEMS inertial sensors, including gyroscopes and accelerometers, are key components in automotive applications like electronic vehicle stability control, advanced driver assistant systems and autonomous driving. The challenging automotive reliability requirements need to be considered when selecting the sensor packaging concepts.

Fan-out wafer level packaging (FO-WLP) provides large number of IOs and offers interesting opportunities for multi-die packaging with minimum package dimensions. Typically combined MEMS sensors for motion measurement are packaged in various standard or proprietary configurations, ceramic cavity packages, pre-molded plastic cavity packages, over-molded SOIC, PBGA. The demand is towards smaller foot print & height, lower cost and better robustness to vibration. FO-WLP offers some excellent characteristics, like small size and low stress to sensitive MEMS dies. Murata presentation is focused on explaining the FO-WLP Multi-die Inertial Sensor concept (gyroscope, accelerometer and IC), which was developed in EU collaboration project and evaluated against automotive requirements.

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Senni Laaksonen

VP Research and Development

Murata

Senni Laaksonen has 20 years experience of providing inertial sensors to the automotive industry. She started her career at VTI, a company which has been the market leader in low-g accelerometers for safety critical applications since early 1990s. Senni joined Murata when the company acquired VTI in 2012. She has been working in various positions in VTI/Murata from product design to process development and project management and is currently responsible of the Research and Development activities of Murata Finland. Senni and her development teams work closely with automotive industry to provide new innovative inertial sensors for the customers. Future development in Murata is focusing to provide cutting edge products to the ADAS and autonomous driving applications.

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Murata Finland is global MEMS Center of the Japanese Murata Group. The company is a leading supplier of MEMS accelerometers, inclinometers, gyroscopes and pressure sensor elements for demanding applications in automotive, medical, instruments and consumer electronics. The silicon-based capacitive sensors are based on the company’s proprietary 3D MEMS (Micro Electro-Mechanical System) technology.

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Murata
  • 10:55 – 11:55

Networking Break, Coffee & Business Meetings

  • 11:55 – 12:15

BioMEMS

Medical devices are key to providing timely patient monitoring and treatment. This presentation provides an overview of the role of micro-technology in medical devices, the challenges related to their fabrication, and a view to emerging technologies. You will gain an understanding of BioMEMS devices, their markets, and Teledyne’s MEMS capabilities for their development and manufacture.

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Collin Twanow

Director, Technology

Teledyne

Collin Twanow serves as Director, Technology for Teledyne MEMS and is responsible for creating technical solutions for both current and new customers. He joined Micralyne in 1999 and has held a number of roles ranging from Development Engineer, Director of R&D, Product Line Manager, and Vice President of Sales and Engineering in the Edmonton, Canada fab.

Collin has managed development programs for many devices including optical telecom switches and silicon optical benches, implantable medical devices, MEMS microphones, pressure sensors, and components for military applications. He is a Professional Engineer with a MEng degree, focused on Microfabrication. Collin has also lectured in MEMS and microfabrication courses at the University of Alberta.

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Teledyne MEMS, the combination of Teledyne DALSA and Teledyne Micralyne, offers the most comprehensive toolkit of advanced processes for MEMS and microfabrication foundry manufacturing.

From process development to high volume production on both 150mm and 200mm wafers, our foundry customers have successfully brought thousands of designs to diverse markets in a wide range of applications, including automotive, industrial, medical, telecommunications and consumer sectors. We exceed your expectations whether you require 100 wafers a year or 10,000.

Email – MEMS_sales@teledyne.com

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Teledyne
  • 12:15 – 12:35

About Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors

Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process used to accurately and in a scalable way deposit nanoparticles. Unique features include: 1) full wafers patterning in 15-minutes, 2) structures can be deposited with a size ranging from 1 – 50 microns and with high aspect ratios up to 5 and 3) full 3D-control of the printed structures. In addition, I can share some of the applications we’re focusing on such as: 1) printing sensing electrodes for metal oxide gas sensors, 2) printing of getters for microbolometers and 3) printing of porous electrodes for biosensing applications.

Metal oxide gas sensor example: Traditionally, sensing elements of metal oxide gas sensors are fabricated using drop-casting. Our MPD process is used as a superior alternative to fabricate these MOX sensors as its 10x more scalable, further reduces the form factor and lowers the power consumption by 5x. In addition, our MPD technology allows for the deposition of sensing element arrays, which enables detection of environmental gasses for safety, wildfire detection, methane detection, NOx/greenhouse gases.

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Thomas Russell

CEO and Co-Founder

Mesoline

Thomas Russell is the CEO and co-founder of Mesoline. After earning a bachelor’s in physics from the Technical University of Delft in the Netherlands, Thomas moved to Los Angeles to complete his master’s degree at the California Institute of Technology (Caltech), where he studied the application of microchannel particle deposition (MPD) technology under prof. Harry Atwater.

In 2017 he spun-out Mesoline from this research, which led to him being recognized as a Forbes 30 under 30 entrepreneur in 2019. In the same year, after relocating to the Netherlands to expand Mesoline, Thomas raised a $2.5M Horizon 2020 grant from the European Commission and several $M from private investors, which enabled him to further accelerate the development of the MPD technology to a reliable process.

Currently, he’s working on ensuring further growth of the company, market entry of Mesoline with the MPD technology and overseeing the buildup of a new production facility in Rotterdam, The Netherlands.

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Mesoline has developed and is scaling up a fundamentally new micro-fabrication process, micro-channel particle deposition (MPD), used to deposit nanomaterials. This wafer-scale thick-film deposition process is a cost-effective and scalable platform technology that enables next generation semiconductor devices such as MEMS & Sensors and other ultra-miniaturized products.

Founded in 2017, Mesoline is headquartered in the Netherlands and enjoys strong financials. Mesoline provides MPD as a contract manufacturing service to semiconductor companies.

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Mesoline
  • 12:35 – 12:55

Let’s Mobilize Digital Innovation in Europe

Digital technologies are indispensable in today’s interconnected world. They drive economic growth, empower individuals, enable social networking, increase access to educational resources, empower telemedicine, enhance efficiency and productivity, and many more. Europe has been the birthplace to many scientific breakthroughs in the field of semiconductor and quantum technologies, but it is lagging in translating scientific achievements into market products. Often European innovators and start-ups struggle to raise necessary financial support to bring their products from lab to fab or scale up. European Innovation Council (EIC) as the largest public fund organization in the world that aims to identify, develop, and scale up breakthrough technologies and game changing innovations in Europe. This presentation will introduce EIC digital activities as well as EIC Funding opportunities for digital technologies, from responsible electronics to quantum technologies, in 2023.

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Samira Nik

Programme Manager – Quantum Technologies and Electronics

European Innovation Council and SMEs Agency (EC EISMEA)

Samira obtained a PhD in Materials Science from the Applied Physics Department of Chalmers University of Technology, specialising in superconducting quantum devices, nanoelectronics and materials characterisation.

After her postdoctoral fellowship in nanoelectronic devices, she became an R&D project manager in one of the leading foundries in the semiconductors industry in Sweden, where she developed the expertise to create proof-of-concept of innovative piezoelectric sensors and energy harvesting devices. Samira learned even more about the practical obstacles that scientists and startups face through her role in the cleanroom management team in one of the largest nanoelectronics hubs in the world, IMEC, Belgium.

Samira transitioned from technical to policy work with becoming Project Manager – Innovation in the European Standardisation Organisations (CEN-CENELEC). In this role, she worked very closely with the European Commission and National Standardisation Bodies for creating a stronger connection between R&I communities and industry.

Since April 2022, Samira works a Programme Manager for Quantum Technologies and Electronics in EC European Innovation Councils and SMEs Agency, where she is responsible for developing visions for technological and innovation breakthroughs, the active management of portfolios of EIC supported projects to support these visions, and bringing together stakeholders to put these visions into reality.

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The EIC is Europe’s flagship innovation programme to identify, develop and scale up breakthrough technologies and game changing innovations.

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European Innovation Council and SMEs Agency (EC EISMEA)
  • 12:55 – 13:15

Accelerating MEMS Product Validation and Commercialization with IME ScAlN MEMS Platform

There is strong interest in PiezoMEMS due to its unique piezoelectric effect property that enables precise control of mechanical motion, actuation, and sensing at the microscale, potential for miniaturization and integration, and their applicability across a wide range of applications.

However, piezoMEMS commercialization faces several challenges such as manufacturing scalability, integration challenges, reliability and rigorous testing and market adoption.

Addressing these challenges requires a collaborative effort among research institutions, MEMS manufacturers and industrial players to invest in research and development, materials and process characterization & optimization and reliability testing to drive a successful commercialization of PiezoMEMS devices. The 1st of its kind “Lab in the Fab” concept by Institute of Microelectronics (IME), ST Microelectronics and ULVAC, focusing on Piezo MEMS technology aims to accelerate and ease the transition from POC to volume production with the development of PiezoMEMS platforms.

IME ScAlN MEMS platforms integrates advanced modelling, simulation, and design tools with a comprehensive MEMS process building blocks, to enable faster prototyping and optimization of MEMS devices. These ScAlN MEMS platforms with distinct features will be showcased with examples of devices implementation for various applications, and are now available for application in MEMS-based products like speaker, PMUT, RF filter, etc.

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Angeline Tee

Deputy Director Business Development

A*Star IME

Angeline Tee has over 25 years of international experience in the Semiconductor and MEMS industry. Currently serving as the Business Development Deputy Director at IME, ASTAR, Angeline actively engages with industry leaders and identifies business development opportunities to create and capture value for industry partners and contribute to Singapore’s economy.

Angeline has earned an Honor’s degree in Bachelor of Applied Science (Materials Engineering) and a Master of Science (MSc) in Electrical Engineering from the National University of Singapore (NUS). Furthermore, she holds a Master of Business Administration (MBA) from the University of Birmingham, which adds a strategic and managerial perspective to her skill set.

Her career in MEMS began at EG&G Heimann Optoelectronics, where she successfully commercialized the MEMS accelerometer for automotive airbag applications. Throughout her professional journey, Angeline has gained extensive experience in various areas, including research and development, process engineering, marketing, and business development. She has worked with both small start-up companies and large corporations, accumulating a wealth of knowledge and expertise in the field. Angeline’s technical proficiency in MEMS technology led her to assume the role of product marketing manager at GLOBALFOUNDRIES where she spearheaded the business development of GLOBALFOUNDRIES’s newly setup MEMS BU in 2010. Subsequently, she joined XFAB in Germany, and played a pivotal role in China regional marketing, supporting the sales team in market expansion.

With her diverse skill set, extensive industry experience and strong academic background, Angeline hopes to contribute significantly to both technological advancement and innovation creation in the MEMS industry.

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Established in 1991, the Institute of Microelectronics (IME) is a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). In IME, we focus on delivering high impact research and development for the global semiconductor industry. IME’s role is to collaboratively develop and innovate next-generation technologies to enable a dynamic semiconductor ecosystem. Together with our highly skilled talent pool, we develop strategic capabilities and innovative technologies through state-of-the-art infrastructure. IME’s core research areas are in Advanced Packaging, piezoMEMS, SiC, mmWave GaN, and photonics & sensors. We will continue to shape the semiconductor industry’s roadmap for many years to come.

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A*Star IME
  • 13:15 – 14:15

Buffet Lunch

MEMS Microphones and Speakers

  • 14:15 – 14:35

Keynote

Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics

As a globally leading supplier of MEMS microphones, Infineon has been driving audio innovation by enhancing SNR, AOP, and power consumption to pioneer new use-cases such as ANC in TWS and studio-quality audio recording with laptops. As the trend for better audio in communication and recording continues, new requirements have moved into the focus of device manufacturers. Sustainability, including extending the lifespan of products, recycling, and eco-design, is no longer an afterthought but has become a major sales argument. EU authorities are accelerating the trend through regulations and ecodesign labels, with the goal of shifting to a circular economy model and moving away from a linear economy model that consists of producing, consuming, and dumping.

MEMS microphones are particularly vulnerable components requiring external shielding against liquids, dust, light, ultrasound, compressed air, and electromagnetic interference. Through forward integration, our next generation of XENSIV™ MEMS microphones will take care of their own protection, thus lowering integration, testing, and repair costs. At Infineon, we believe that our next generation of XENSIV™ MEMS microphones can contribute to more sustainable and energy-efficient consumer electronics while maintaining superior audio quality.

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Dr. Gunar Lorenz

Sr Director Technical Marketing and Application Engineering for Consumer Sensors

Infineon Technologies AG

Dr. Gunar Lorenz is currently heading the technical marketing and application engineering for consumer sensors at Infineon Technologies. Gunar joined Infineon in 2016 as system project manager responsible for Infineon’s first open market MEMS microphone. Prior joining to Infineon he worked as director of system-level simulation at Coventor, where he and his group invented and developed Coventor’s MEMS/IC co-simulation design environment MEMS+. The original ideas for MEMS+ are embodied in his PhD carried out at Robert Bosch R&D Center in 1999. Gunar graduated in mechanical engineering at the TU Braunschweig in Germany and received his PHD in electrical engineering from the TU Bremen in 1999.

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Infineon Technologies AG
  • 14:35 – 14:55

Sound Generation by Active Modulation of Ultrasound

We present a cutting-edge method for sound generation using actively modulated ultrasound. This innovative approach is specifically designed for MEMS technology, resulting in a smaller speaker with superior audio capabilities. We will provide detailed explanations of the speaker’s physics, implementation, and potential applications.

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Moti Margalit

CEO

SonicEdge

Moti Margalit is CEO of SonicEdge and the inventor of its game changing speaker technology. With a multidisciplinary background spanning from quantum optics to MEMS and as a named inventor on over 90 patents, Moti has a demonstrated track record of innovation and entrepreneurship, having founded several successful deep tech companies and held technology leadership roles in both large and small companies.

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Our game-changing technology has revolutionized sound generation, allowing us to create the smallest speaker with the best sound on the market. Through a patented process, our speakers utilize an array of ultrasound technology, paired with acoustic modulators, to frequency shift the ultrasound and create high-quality sound. Our solid-state MEMS device is manufactured using industry-standard processes and includes a full stack solution, from digital audio to sound. Complete with an ASIC and MEMS speaker, SonicEdge is pushing the boundaries of what’s possible in the world of sound.”

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SonicEdge
  • 14:55 – 15:15

Virtual

Improving the LLM experience with sensor provided context

Large Language Models (LLM’s) are a truly transformative technology that will alter many aspects of our lives. It has quickly become apparent that the usefulness of these LLMs is multiplied by the exactness of the prompt, leading to a rise in prompt engineering. In this presentation we will discuss how sensors on devices will play a significant role in helping generate more useful and contextual prompts and how audio and voice might play a role in the future of this technology.

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Dr. Michael Pate

Mobile Audio Systems, Algo, Architecture Lead

Google

Dr. Michael Pate received advanced degrees from Texas Tech University and Denmark Technical University concentrating in the design of Class-D amplifiers for audio systems. After completing his Ph.D. work he began at Texas Instruments where he led the design of some of the highest power integrated Class-D amps on the market. From there Dr Pate moved to product definition roles at Cirrus Logic, Audience and Knowles Electronics where he focused on mixed signal audio, DSP and algorithms and MEMS microphones respectively. Having worked in all audio components as a semiconductor supplier he moved to Fitbit and now works at Google where he runs audio technology development across Pixel Phones, Pixel Buds and Pixel Watch.

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Our mission is to organize the world’s information and make it universally accessible and useful.

Website: www.google.com
Headquarters: 1600 Amphitheatre Pkwy, Mountain View, CA 94043
Phone: +1 (650) 253-0000

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Google
  • 15:15 – 15:35

High-performance miniature optical MEMS microphone

sensiBel is a Norwegian deep-tech scale-up company bringing to the market an optical MEMS microphone with 80dB SNR (14 dBA noise floor) and 132 dB dynamic range (146 dB Acoustic Overload Pressure or 10 % THD) in a small package.

This is a considerable improvement over state-of-the-art capacitive MEMS microphones. Despite constant improvement over the years, these are today limited to a SNR in the order of 73 dBA (21 dBA noise floor) with overall dynamic range in the order of 101 dB. There are fundamental challenges to driving the performance of capacitive MEMS microphone technology in small packages to new heights. Piezoelectric MEMS microphones have not demonstrated SNR performance >65 dBA.

We will present the fundamentals of optical acoustic transduction, explain why it can enable higher performance and how it can be implemented in a MEMS-based component.

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Matthieu Lacolle

CTO

sensiBel

Matthieu Lacolle is an optical MEMS expert, CTO and co-founder of sensiBel.

He joined the Norwegian research organization SINTEF in 2006, where he worked as a Research Scientist and Research Manager at the department of Microsystems and Nanotechnologies. His research interests have included optical MEMS and in particular diffractive MEMS, MEMS-based spectroscopy and sensors with optical readout. He was strongly involved in the development of optical readout methods for MEMS sensors such as microphones, when he co-founded sensiBel in 2017 as the technology was spun-off from SINTEF.

Matthieu Lacolle received a M.Sc. degree in electrical engineering from Supélec, France, in 2001, and a M.E. degree in photonics and telecommunications from the University of Sydney, Sydney, Australia, in 2001. He holds a Ph.D. degree from the University of Oslo, Norway, in the field of optical MEMS, obtained in 2006. He is the author or co-author of 30+ publications and of several granted and pending patents.

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SensiBel is a Norwegian deep-tech scale-up company specialized in optical Micro-Electro-MechanicalSystem (MEMS) microphone technology. The company spun off from SINTEF, Norway’s largest independent research organization in 2016. Based on 10 years of research at SINTEF, sensiBel has developed and patented a unique technology for a high-performance miniaturized microphone, with 10 times lower noise (10dB) than other state-of-the-art MEMS microphones. Our core team consists of MEMS, electronics, optics and acoustics technology experts, as well as a business and leadership team with vast multi-national experience and several successful high tech startups in electronics for high volume applications.

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sensiBel
  • 15:35 – 16:05

Networking Break, Coffee and Business Meetings

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