• 07:30 – 08:30

Registration

  • 08:30 – 08:45

Welcome Speech

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Kamel Ait Mahiout

President

ISES

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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MEMS Microphone & Speakers

  • 08:45 – 09:05

Keynote

TBC

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Julian Kornprobst

MEMS Sensor System Competence Team Business Lead

Infineon Technologies AG

TBC

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Aldo Bruno

Product Definition Engineer

Infineon Technologies AG

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Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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  • 09:10 – 09:30

tbc

Jakob Spoetl

Head of Acoustics

Usound

Jakob Spötl works as head of acoustics in the R&D department of USound. He is one of the first employees of USound and joined the company in 2015, right after finishing his studies in electrical and audio engineering at the TU Graz in Austria. His main interest was (and still is) the multidisciplinary; combining knowledge from different fields. Therefore, his main expertise lies in understanding and modeling of the interplay between different physical domains (electronics, mechanics, and acoustics). Combining this with real-world applications and the resulting psychoacoustic experience is what he thrives on.

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The Role of AI in MEMS and sensors

  • 09:35 – 09:55

It is not only about AI in MEMS and sensors

Sensors have become ubiquitous, blurring the line between being online and offline. AI plays a key role in sensors, enabling real-time context understanding and the ability to make decisions aimed at optimizing and reducing the power consumption of the final device. Sensors are no longer merely for data collection; thanks to AI, they can interact with their environment and significantly contribute to innovation and sustainability.

Tarik Souibes

Product Marketing Director

STMicroelectronics

Tarik Souibes holds a master’s degree in physics and graduated from an engineering school with a specialization in materials dedicated to microelectronics. He joined ST in 1998 as a technical marketing engineer. With more than 26 years of experience at the company, Tarik has held various roles and responsibilities, dealing with a wide range of products including power, analog, and sensors.

Today, Tarik is responsible for product marketing for sensors within the ST MEMS Sub-Group.

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At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. We are committed to achieving our goal of becoming carbon neutral by 2027. Further information can be found at www.st.com.

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  • 10:00 – 10:20

MEMS Breaks Through the AI Bottleneck

AI serves as the computational brain for advanced electronic applications, requiring high-quality sensory data to interact effectively with the environment. Emulating sophisticated sensory systems at a micromachined scale, MEMS technologies bridge this gap to enhance AI’s potential. Current advancements in MEMS — particularly in areas such as 3D LiDAR sensors, tactile sensors for robotics, and high dynamic range microphones —are pivotal in overcoming common AI bottlenecks. Additionally, MEMS integration can streamline neural networks, facilitating more efficient AI workflows. This talk will explore how MEMS technologies address crucial performance, reliability, stability and cost issues, thereby opening new market opportunities and significantly impacting future industry trajectories. We will also discuss how MEMS mitigates the power and thermal challenges posed by increasingly powerful and energy-intensive GPUs.

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Eric Aguilar

CEO

Omnitron Sensors

An award-winning entrepreneur, Eric is a visionary leader in the field of advanced sensor systems for complex systems such robotics and autonomous platforms.

Throughout his distinguished two-decade career, Eric’s passion for sensor design and innovation has made him a key player in the industry. His expertise includes leading teams at renowned companies such as Tesla, where he managed a crew of 300 engineers on the firmware for Model 3, and at X, where he spearheaded the development of Google Project Wing, an autonomous drone delivery service.

Eric’s expertise in sensor integration includes a leadership position at Argo AI, a self-driving venture supported by Ford and Volkswagen. His role in steering product development for a sensor company later acquired by Google for $85 million — as well as his pioneering work building sensors for drones at US Navy Research Labs — further showcase his depth of experience.

Eric earned a BS in Electrical Engineering from California State Polytechnic University and has pursued advanced studies in Electrical and Electronics Engineering at the University of Southern California. His work continues to shape the future of MEMS and sensors technology, making him a sought-after thought leader and speaker in the field.

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Omnitron Sensors is rewriting the script on building high-performance low-cost sensors for the world of tomorrow. Leveraging its executive team’s extensive experience designing, fabricating, and using MEMS sensors, Omnitron has developed a “new topology for MEMS” that addresses some of the most pressing pain points in MEMS manufacturing.

Featuring the clever arrangement of silicon process steps and a new packaging method, Omnitron’s topology significantly improves performance to produce robust, rugged, reliable, repeatable, and low-cost MEMS sensors in high volumes by leveraging commercial MEMS foundries.

The company’s first proof point of its new topology for MEMS is a large, robust, low-cost, MEMS scanning mirror for long-range LiDAR.

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  • 10:25 – 11:25

Networking Break, Coffee and Business Meetings

AR/VR

  • 11:30 – 11:50

Keynote

TBC

Ken Diest

Research Manager and Tech Lead

Meta

Ken Diest is a Research Manager and Tech Lead at Meta’s Reality Labs, where he leads programs focused on MEMS and micro-actuator technologies. His focus is on developing these technologies from early stage through production to address critical opto-mechanical and display challenges in AR/MR.

A Materials Scientist by training, Ken’s prior work focused on tunable devices and materials with an emphasis on optical systems. He was the editor and co-author of the book Numerical Methods for Metamaterial Design, and has previously held technology development roles at Apple, MIT Lincoln Laboratories, and Northrop Grumman that focused on new displays and nano-photonics.

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Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.

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Automotive

  • 11:55 – 12:15

TBC

Stefan Martens

Sr. Director, MEMS and Sensor Products

Amkor Technology, Inc.

Stefan joined Amkor Technology in 2019 and currently serves as a Senior Director for MEMS and Sensor Products. He manages assembly and test services for large volume automotive and consumer MEMS sensors for European customers. Stefan has 18 years of experience in the semiconductor industry and held positions at Infineon and Huawei in Germany, primarily in the field of RF devices and modules prior to joining Amkor. He has been issued 15 patents and holds a MSc in Applied Physics as well as a PhD in Microsystem Engineering from the University of Freiburg, Germany.

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As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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  • 12:20 – 12:40

Advances in MEMS Sensors & Technologies

• MEMS based sensors are a key-enabler in a wide range of applications: from automotive, over consumer to the life science domain. MEMS is expected to even further proliferate in everyday life, due to their continued miniaturization, steady increase in performance and the accessibility of new sensing functionalities.

• This is possible due to a constant high level of innovation in e.g., processing and packaging technologies, as well as due to novel system-level concepts. This shows the need for an overarching approach, integrating all development domains.

• In his presentation, Dr. Ando Feyh (MEMS Strategy Management, New Business and M&A), will cover a brief review and compare this to the progress achieved by recent advancements in the field of MEMS based sensors. Several examples from above outlined domains will be discussed for illustration.

Dr. Ando Feyh photo

Dr. Ando Feyh

MEMS Strategy Management, New Business and M&A

Bosch

Ando Feyh received his PhD degree in Electrical Engineering at RWTH Aachen University after a Physics Diploma degree at Stuttgart University.

He started his career at Bosch in 2002 within Corporate Research and Advance Engineering. Concentrating in the field of microsystems, he worked on integration and miniaturization of MEMS sensors, in development and in project management positions.
Between 2010 and 2014 he was an expat in the Silicon Valley in Palo Alto, leading different MEMS projects and an engineering group for MEMS pre-development.
2014 he joined the Bosch internal IoT startup “Bosch Connected Devices and Solutions”, first responsible for Advance Engineering and System Architecture, later as Head of Engineering. Mid 2018 he was nominated Head of Technical Responsibility / CTO, responsible for engineering, project management and product management of IoT devices.
Since mid 2021 he is focusing on MEMS Strategy Management, New Business and M&A projects within the Mobility Electronics Sensors Business unit.

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The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). The company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in some 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. With its more than 400 locations worldwide, the Bosch Group has been carbon neutral since the first quarter of 2020. The basis for the company’s future growth is its innovative strength. At 128 locations across the globe, Bosch employs some 76,100 associates in research and development, of which more than 38,000 are software engineers.

The company was set up in Stuttgart in 1886 by Robert Bosch (1861–1942) as “Workshop for Precision Mechanics and Electrical Engineering.” The special ownership structure of Robert Bosch GmbH guarantees the entrepreneurial freedom of the Bosch Group, making it possible for the company to plan

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  • 12:45 – 13:45

Lunch

  • 13:50 – 14:10

Keynote

TBC

Mo Maghsoudnia

Founder & CEO

UltraSense Systems

Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.

Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.

Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.

Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.

Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.

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UltraSense Systems transforms driver touch interfaces in automotive with its In-Plane Sensing solutions, which enable multi-mode sensing, processing, and AI / Machine Learning algorithms to turn almost any surface into the ultimate touch experience. UltraSense In-Plane Sensing includes a SmartSurface Human Machine Interface (HMI) controller for programmable audio, illumination, haptics, and user feedback. When integrated into steering wheels, infotainment systems, and other in-vehicle interfaces, UltraSense offers a more intuitive and modern experience for drivers; a more integrated, easier to manufacture and thinner solution for tier-suppliers; and greater design options plus recyclability and sustainability benefits for automakers.

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  • 14:15 – 14:35

Industrialization challenges for advanced packaging in foundry environment

MEMS process sequences and capabilities are frequently reused for advanced packaging and 3D integration applications. Bringing these to market presents multiple technology and business model challenges. This presentation will discuss progress and future trends.

Volker Herbig

VP, BU MEMS

X-FAB

Volker Herbig, VP BU Microsystems at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.

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X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.

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  • 14:40 – 15:00

TBC

Corrado Rocca

R&D Head, Cyber Unit

Pirelli

During his career, Corrado held several managerial roles in telco, media, IoT, communications and automotive industries, mainly in technical, product and business areas.

He is currently heading in Pirelli Tyre the R&D department developing tyre connectivity solutions, for OE and aftermarket applications. He is leading for Pirelli several international standardization initiatives in the field of future mobility.

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Established in 1872, Pirelli is the only pure consumer tyre company that includes car, motorbike, and bicycle tyres as well as associated services. With 19 production plants in 12 countries and a commercial presence in over 160, Pirelli has around 31,600 employees and had a turnover in 2019 of about 5.3 billion euro.

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  • 15:05 – 15:50

Networking Break, Coffee and Business Meetings

IoT Industries

  • 15:55 – 16:15

TBC

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Ruby Yan

HMI Director, IoT End Market

GlobalFoundries

Ruby Yan is a seasoned Business Line Director at GlobalFoundries, where she oversees the HMI (Human-Machine-Interface) and healthcare business line. With more than 12 years of experience in the company, she has held various roles and responsibilities including technology development and product management. She is also a Master Inventor in GlobalFoundries, boasting an impressive track record with more than 20 patents granted and over 70 peer-reviewed papers published. Ruby is passionate about promoting diversity and inclusion and advocating for female leadership in the tech industry. As a company representative to the German Diversity Charter Association (Charta der Vielfalt), she works to support and inspire underrepresented groups in STEM fields.

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GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.

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  • 16:20 – 16:40

TBC

Alastair Attard

Director of Technical Program Management & Business Development

UTAC

Alastair Attard is Director of Business Development at UTAC Group. He has a Bachelor’s degree in Mechanical Engineering and an Executive MBA from the University of Malta, and has over 18 years of experience in the assembly & test of semiconductor devices.

Prior to joining UTAC, Alastair worked at STMicroelectronics firstly as part of the process engineering team for flip chip and SiP, and later in process and package development for MEMS packages. He later joined Besi, where he was manager of the process development group, with focus on advanced die attach and pick & place technologies.

Alastair joined UTAC in 2018, focusing on technical program management and assembly business development in the European region. Today he is responsible for worldwide business development of assembly and test solutions for semiconductor devices at UTAC with particular focus on MEMS, Sensing, and Advanced Packaging.

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UTAC is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end-use applications including communication, consumer, computing, automotive, security, industrial and medical. Our customers include fabless companies, integrated device manufacturers and wafer foundries.

UTAC is headquartered in Singapore with more than 12 production facilities. Our global sales network is widely focused on five regions: the United States, Europe, China and Taiwan, Japan and the rest of Asia with sales offices located in each of these regions.

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MEMS Testing

  • 16:45 – 17:05

Ensuring Performance and Accuracy: Production Testing Strategies for Next-Generation Environmental Sensors

This presentation delves into the critical world of production testing for MEMS environmental sensors. As these devices play a pivotal role in the environmental monitoring in many situations (from industry, to homes, to hospitals), ensuring their correct performance is of vital importance. Manufacturers face several challenges in guaranteeing the accuracy and reliability of their sensors, whose production testing can be a complex and time-consuming process. As these devices are sensitive to multiple environmental factors and respond to various stimuli (pressure, temperature, humidity, gas, …), the key thing about their testing resides in the need to develop testing setups able to capture all the electrical and mechanical aspects of the sensor, simulating and controlling a multiplicity of environmental factors. The sensor-type specificities represent a second challenge: each sensor type might require unique testing procedures and hardware setup, and this customization can be time-consuming and costly. Finally, while many applications are requiring more accurate and sensitive devices (that means, very accurate test equipment too), achieving high-volume production requires test cost efficiency. We will showcase how the latest advancements in test equipment are revolutionizing the approach for MEMS environmental sensors, solving all these challenges.

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Marco Pratillo

Sales Manager Semi & MEMS Test Equipment BU

SPEA

Marco Pratillo received his M.S. degree in Electrical Engineering from the Polytechnic of Turin (Italy) in 2012. He promptly joins SPEA as part of the Product and Test Engineering Group in Electronic Industries and Custom Semiconductor Test Equipment. Starting from 2017, he relocated to Suzhou (China) as Test Engineering Manager Mems and Power Semiconductor, where he contributed to the exponential growth of the Semiconductor Division, Power and MEMs. He spent five years working closely with the Sales team aiming to affirm and expand the presence of SPEA’s products. In 2022, Marco returned to Italy in the role of Technical Sales Manager, specifically dedicated to the biggest Semiconductor manufacturing leaders in Asia.

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Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

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MEMS and Sensors Market Outlook

  • 17:10 – 17:30

TBC

Pierre-Marie Visse

Senior Technology & Market Analyst, MEMS & Sensing

Yole Group

Pierre-Marie Visse is Senior Technology & Market Analyst, MEMS & Sensing at Yole Group. He is working within the Photonics & Sensing team. Pierre-Marie contributes daily to the technical, marketing, and strategic analysis on various MEMS and sensing technologies.Prior to Yole Group, Pierre-Marie served as an R&D project manager at eLichens, specializing in the detection of environmental gases, for more than 2 years. His primary focus was the development of gas sensors and IoT for gas detection. Previously, Pierre-Marie worked at TDK-Tronics for more than ten years as an inertial MEMS designer for custom sensors, accelerometers, and gyroscopes. He then worked as an R&D project manager for the navigation, industrial, and watchmaking industries. Pierre-Marie graduated from ESIEE-Engineering (France) in 2010, specializing in microsystems.

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Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, corporate finance services, reverse engineering and costing services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Group of Companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics, Batteries & Energy Management and Memory. Yole, along with its partners System Plus Consulting, PISEO and Blumorpho, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

More information on www.yole.fr.
Follow Yole on LinkedIn and Twitter.

Company website: www.yole.fr
www.i-micronews.com
Company phone: +33 472 83 01 80

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  • 18:00 – 19:00

Cocktail Reception

  • 19:00 – 21:00

Gala Dinner

Advisory Board Recognition
Industry Awards
Entertainment

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