07:55 – 08:25

Registration

Enhancing Europe’s Leadership in MEMS & Sensors

08:30 – 08:50

Keynote

Enhancing Europe’s Leadership in MEMS & Sensors: Seizing Opportunities with the EU Chips Act

(Virtual Presentation)

MEMS sensors and actuators bridge the natural and virtual worlds, unlocking the potential of digital technologies across key industries like automotive, manufacturing, and healthcare. This sector is thriving, showing consistent growth, with Europe leading the charge through its advanced companies and world-class research institutions. Strengthening Europe’s presence in this sector is crucial for maintaining its leadership in the digital revolution. The European Commission is dedicated to sustaining this growth and enhancing Europe’s position in the field, recognizing the strategic importance of the MEMS sector. The EU Chips Act is designed to support this by addressing challenges across the entire semiconductor value chain, benefiting the MEMS sector through enhanced collaboration, research, and funding. This legislation aims to create a more resilient and innovative ecosystem for European MEMS manufacturers and developers. In this keynote, we will provide an overview of the EU Chips Act, highlighting the vast opportunities it offers, including access to world-leading research and innovation platforms, as well as various funding opportunities tailored for the MEMS sector.

Pierre Chastanet

Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT

EU Commission

08:55 – 09:15

Keynote

MEMS inertial sensors for navigation applications

Northrop Grumman LITEF started the development of micro-electromechanical systems (MEMS) gyroscope chips with Deep Reactive Ion Etching (DRIE) in 2003. Based on this technology, a six degree of freedom MEMS IMU was developed for navigation applications. After successful transfer from early MEMS IMU prototypes to series production, NG LITEFs IMU is available since many years with a specified bias error of 4 deg/h and an angular random walk (ARW) of 0.15 deg/sqrt(h) over temperature. Recently an European Technical Standard Order (ETSO) for the MEMS based Attitude Heading Reference System (AHRS) LCR-350B was received, so that NG LITEF is able to supply the first purely MEMS based AHRS worldwide to the avionic helicopter and fixed-wing market. Next generation avionic systems require even higher performing MEMS sensors. Northrop Grumman LITEF is addressing these needs with the next generation MEMS sensors.

Stefan Rombach

Head of MEMS

Northrop Grumman LITEF GmbH

RF MEMS

09:20 – 09:40

Disruptive MEMS Power Technology – The Ideal Switch for Power applications

Electromechanical Relays have been around since the 1800s, and the architecture we still see today is not drastically different than what was introduced 200 years ago. These relays tend to be very large, slow, and unreliable. The invention of transistor in semiconductor era helped to address some of those issues but they also come with big losses and inefficiencies that create significant waste heat and thermal challenges. Menlo Micro’s Ideal Switch is a revolutionary and disruptive technology that combines the benefits of electromechanical relays and solid-state switches,
offering unparallel performance, reliability, and efficiency. Developed through years of R&D which started by GE Research Lab, the Ideal Switch features a unique metal to metal contact design actuated by an electrostatic voltage on the gate electrode which forces it to close. And when we release that voltage, it opens the relay so that you have a full air gap or a zero-leakage
path for when the switch is open. In the end, it’s all about making things smaller, more powerful, and cramming more capability. Menlo Micro’s unique Ideal Switch technology provides significant energy savings, longer battery life, and lower total cost
of ownership.

Yalcin Bulut

COO

Menlo Microsystems Inc.

New MEMS Materials

09:45 – 09:55

Piezoelectric MEMS Acoustic Transducers at Silicon Austria Labs: technology platforms and emerging applications

As a top European research center for Electronic Based Systems, Silicon Austria Labs´mission is to accelerate technological growth from idea to innovation within the major market tendencies on the global arena. The Microsystems Research Division develops cuttingedge MEMS technologies, from design and proofofconcept to product prototypes, connecting key industrial and scientific players along the value chain. In her presentation, Dr Annalisa De Pastina, Senior Scientist in PiezoMEMS Microsystem Technologies, will describe the latest technology platforms for acoustic piezoMEMS development. The talk will focus on MEMS microphones and Piezoelectric Micromachined Ultrasonic Transducers, and will discuss emerging technologies and challenges related to design, fabrication and material development.

Dr. Annalisa De Pastina

Senior Scientist in Piezoelectric Microsystem Technologies

Silicon Austria Labs (SAL)

10:00 – 11:00

Networking Break, Coffee and Business Meetings

MEMS & Sensors Development Outside Europe

11:05 – 11:25

Vibration sensors with AI for in industry applications

With the capability of predictability on equipment health by sensors which may benefits to customers’ manufacturing line with saving cost, capacity maximization, and reducing risk of manufacturing stop. Vibration sensors are widely adopted in different equipment such as lathe, milling machine, ball-screw, and motor to gather their vibration data. By the help of supervised AI machine learning model, we are able to analyze these vibration data and then to classify them to predetermined causes. The noise of vibration sensor is strongly affecting the resolution of sensor and the classification resolution of machine learning model.

In the past decade, we have launched few qualified vibration sensors with both low-noise and wide bandwidth to Taiwan market for applications in industry. Almost each Industrial vibration sensing AI solution is with different features which forces the collaboration between sensor supplier, system integration provider, and user becoming must so as to short the development lead time.

Yu-Wen Hsu photo

Dr. Jacob Hsu

CTO of Smart Sensing & Systems Technology Center

Industrial Technology Research Institute (ITRI)

11:30 – 11:50

SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform

Bo Cui

Senior Director of Research

Shanghai Industrial Technology Research Institute (SITRI)

MEMS and Sensors Market Outlook

11:55 – 12:15

Exploring the latest and future MEMS trends

The global MEMS market is steadily growing to reach $20+ billion at the end of the decade. MEMS sensors and actuators can be found in variety of systems, from wearable to smart cities. Ongoing mega-trends such as the electrification of cars, autonomous driving, and Industry 4.0 are reshaping the growth of the MEMS & Sensors business, by giving tailwinds to specific devices and applications. Microspeakers, PMUT, MEMS oscillators or cooling systems are the new kids on the block of the MEMS industry.

Pierre-Marie Visse

Senior Technology & Market Analyst, MEMS & Sensing

Yole Group

12:20 – 13:20

Lunch

13:25 – 13:45

Smart tires : powerful sensors for modern mobility

  • Smart tires are becoming relevant actors in modern mobility applications thanks to the technology maturity they have reached.

Their sensing capabilities are exploited while vehicles are circulating, generating broad data sets from the interaction of tires with roads.

Through data processing and sector specific know-how, sophisticated algorithms provide unique insights towards safety, performance, sustainability and servitization.

The paper will highlight the technical and ecosystem challenges that must still be faced to ensure the widest adoption, offering some concrete examples of deployed applications in different business environments.

Corrado Rocca

R&D Head, Cyber Unit

Pirelli

Gas Detection

13:50 – 14:10

Opening Gas Sensing Possibilities with Silicon Photonics-Based Sensors

Odorant VOCs (smells) is an infinite, nevertheless misunderstood and underestimated, source of valuable information which can offer very diverse business opportunities on different markets. In collaboration with the CEA-Grenoble, Aryballe has developed a selective VOC sensor capable of real-time detection and identification. This breakthrough technology enables the generation of large datasets, which can be analyzed using either simple algorithms or more sophisticated machine learning models.

More precisely, the 64 channels Mach Zender Interferometer (MZI) functionalized with proprietary peptide biosensors can detect a broad range of odors and chemical families. Moreover, this very innovative sensor has the property to generate live data within a large range of concentration.

In addition to addressing diverse industrial and environmental applications, Aryballe has successfully deployed its products in the Food and Cosmetics markets. More recently, breakthrough results have been obtained in the medical diagnostic domain with a focus on bacterial infection detection.

Dr. Tristan Rousselle

Founder & CEO

Aryballe

Emerging Innovations and Research in MEMS & Sensors

14:15 – 14:35

CSEM, a MEMS and PICs powerhouse in the Swiss industrial ecosystem

CSEM is a non-profit-oriented public-private Swiss technology innovation center renowned for developing advanced micro- and nanotechnologies. From high-performance materials to innovative processes, CSEM pushes the boundaries of microfabrication technologies to develop unique MEMS solutions. During the talk some of our most recent developments will be presented, including wafer scale micro-lens arrays, rubidium vapor cells for atomic clocks, our unique thin film lithium on niobate insulator (TFLN) PIC platform or the aerosol jet printing technology.

Dr. Andreas Charles Voelker

Business Development, Micro- & Nanotechnologies

CSEM

14:40 – 15:10

Networking Break, Coffee and Business Meetings

15:15 – 15:35

A Large Area, Panel-based sensor platform

Most sensor technologies are based on Silicon, wafer-based technology. This offers advantages in miniaturization and integration of advanced electronics. There is, however, a large application space in which there is a big advantage of having large sensor surfaces. Examples of these can be found in Non-Destructive Testing (e.g. pipeline or aircraft inspection) or medical imaging (e.g. wearable patches for continuous patient monitoring).
These applications require large area, low-cost, in some cases even flexible, sensor surfaces. To serve these needs IMEC is developing a large area sensor platform that is based on Flat-Panel Display compatible technology. In this presentation we will explain the benefits of this technology platform, and zoom in on our lead application for driving this technology: ultrasound medical imaging.

Erwin Hijzen photo

Dr. Erwin Hijzen

Program Director

imec

15:40 – 16:00

European Chips Act (EUCA) and the FMD Pilot line “Advanced Heterogenous Systems Integrations (AHSI)”

The European Chips Act will reinforce the semiconductor ecosystem in the EU, ensure the resilience of supply chains and reduce external dependencies. It is a key step for the EU’s technological sovereignty. The Research Fab Microelectronic Germany (FMD) propose the setup of an Advanced Heterogenous Systems Integration Pilot Line (AHSI-PL), which offered to Europe´s microelectronics community the world´s most comprehensive chiplet integration pilot. The pilot line will encompass an unprecedented range of device technologies, materials, enabled by world class system design, interconnect- and assembly techniques as well as characterization, test, reliability and security assessment. Our mission is to establish and operate a pilot line, which offers to European industry including start-ups, SMEs, verticals, Integrated Device Manufactures’(IMD’s) as well as R&D institutions innovation capabilities through advanced heterogeneous systems, based on Chiplets and novel Advanced Packaging Technologies and will have an open access. The presentation gives a strategic overview about the foundation and participation in the European Chips Act.

Dr. Michael Eritt

Head of Department Engineering

Fraunhofer Institute for Photonic Microsystems

16:05 – 16:25

From Concept to Application: INL’s Breakthroughs in MEMS Technology

The International Iberian Nanotechnology Laboratory (INL) is a research centre equipped with state-of-the-art microfabrication and characterization facilities. Aiming to be a global leader in nanotechnology innovation, INL focuses on strategic research areas, with MEMS as a crucial enabling technology. In this presentation, Dr. Filipe Alves, a Staff Researcher in the Integrated Micro and Nanotechnology Research Group, will highlight some of the key contributions in MEMS technology. Topics will include high-resolution inertial sensors for space gravimetry, multi-mass devices with 3-axis sensitivity, and an all-silicon, multispot 2D MEMS mirror.

Filipe Alves

Staff Researcher

INL (International Iberian Nanotechnology Laboratory)

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