C4Technology, LLC

Company Profile

C4 – Semiconductor & Electronics Disruptive Innovation Technologies Linked In Group

C4Technology is advanced technology, innovation discovery, sales and support company, representing Original Equipment Manufacturers (OEM) of Advanced Materials (Ultra Pure Graphene), Angstrom Resolution Optical Metrology, T-ray 3D Subnanometer Imaging & Spectroscopy, Wafer / Substrate Processing and Semiconductor Process Automation tools.

Our core competencies include product management within semiconductor, electronics, sensors, and optics, which enables us to provide effective solutions for diverse and complex customer needs. C4 is passionate about delivering high-quality, innovative products and services. Our mission is to empower and support our clients and partners with cutting-edge technology and reliable performance.

Product & Services

APPLIED RESEARCH & PHOTONICS, INC. Terahertz Nanoscanning 3D Camera-Less Imager & Spectrometer systems. Proprietary Continuous Wave, Dendrimer Dipole Excitation technology to deliver unsurpassed analytical, and imaging capability. A Disruptive Technology enabling the revolution in advanced materials, structures & subnanometer analysis.

n&k Technology, Inc. Semiconductor Optical Metrology – IF YOU CAN MAKE IT, WE CAN MEASURE IT.
Foundry / Logic / Memory – Photomask – Power Device – Advanced Packaging – MEMS – CMOS -CIS – IC
* FEOL/BEOL Angstrom Thin Film, Deposition, Diffusion, Litho, Pattern, Etch & CMP control.
*Process monitoring for current and next generation technology nodes – complex 3D structures
*Trench/OCD Critical Processes such as Deep Trench, Critical Dimension, & Sidewall Angle monitoring
* Etch Processes such as FinFET, STI, DTI, Deep Etch for 3nm-5nm and legacy technology nodes
* High Aspect Ratio Trench Structures (i.e. 20:1)

S-Cubed, Inc. SUPPLYING BETTER TOOLS TO THE SEMICONDUCTOR INDUSTRY – One Architecture, Many Processes. Custom Tool Designs to solve customer specific process challenges using proprietary architecture.

  • Photoresist Coat & Develop.
  • Liftoff Resist Processing.
  • Wafer Edge Exposure Control.
  • Thermal Reflow Processes.
  • Wafer Cleans- Dual Contactless Scrubbing.

MicroSil Silicon Services MICROSIL, Nampa Idaho USA based wafer and substrate processing services have supported the Semiconductor and related industries since 1977. Wafer and substrate material processing include Aluminum Nitride, Silicon, Silicon Carbide, Sapphire, Quartz, Gallium Nitride, Gallium Arsenide, Ceramics, and Composite Alloys. Customer supplied wafer/substrates processed to customer specification. Services include substrate cut down/shaping, lapping, laser marking, final polish, cleans and packaging. Applications range from High Power/High Frequency Semiconductor, LED to LIDAR sensors.