Forehope Electronic (Ningbo) Co., Ltd.

Forehope（FHEC） was founded in Nov 2017, devoted to a worldwide and industry-leading high-end IC ，package assembly and testing . The end customer application covered consumer electronics，AI, industry, Automotive, Network,Data center etc. We can deliver package type include WBQFN, WBLGA, WBBGA, FCCSP, Hybrid-BGA, SiP, MEMS.,QFP, FCBGA etc. And also we can provide wafer level package include Bumping, WLCSP. Forehope continue to research & develop advanced wafer level package like as Fan-out, 2.5D/3D , which for chiplet solutions.