Henkel Ltd.
ISES Member
Company Profile
Henkel was found in 1876 by founder Fritz Henkel. With our business units – Adhesive Technologies and Consumer Brands – we hold leading market positions in both the industrial and consumer goods businesses.
Henkel adhesive technologies is world No. 1 producer in adhesives, sealants and functional coatings. With trusted brands and high-impact solutions based on an unmatched technology portfolio we are creating value for all our stakeholders. As experts for industrial applications in more than 800 industries, we work closely with our customers and partners. Based on our broad technology portfolio and our strong innovative power, we continuously develop customized solutions.
In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Today employs a diverse team of about 48,000 people worldwide.
Product & Services
Henkel is the world’s leading provider of qualified, compatible material sets for semiconductor packaging. We’re your global partner prepared to handle any challenge and develop a solution that is smart and sustainable — together with you.
Henkel’s total solutions approach leverages extensive global resources to deliver superior semiconductor packaging material technologies and cost-competitive performance. From die attach adhesives used in traditional wirebond packaging to advanced underfills and encapsulants for advanced packaging applications, Henkel provides the cutting-edge materials technology and global support top microelectronics companies require.
Henkel’s advanced packaging solution include:
•Anhydride-free, low warpage liquid compression molding underfill (LC-MUF) for fine-gap filling and low wafer-level warpage.
• High fracture toughness, low CTE capillary underfills for faster flow and thorough bump encapsulation on large dies.
• Low-stress, high-elongation lid attach materials for improved warpage control and enhanced reliability performance.