27-28 August 2025
Suwon
Lotus Microsystems is a fabless manufacturer of highly-integrated power modules and thermal management solutions. The company brings advanced packaging to the power management domain with the introduction of the industry’s first power silicon interposer. The Lotus Power Interposer™ is a proprietary technology that enables the employment of silicon interposers in power applications, with the capability to carry higher currents and withstand higher voltages. Such innovation offers several features that include the best-in-class power density, superior thermal performance, high efficiency, and heterogeneous integration capabilities. Through partnerships with leading global semiconductor facilities, Lotus Microsystems serves the industry’s skyrocketing demand for miniaturization and improved thermal management in a number of markets that include high-performance computing, consumer mobile, and telecom and networks applications.