27-28 August 2025
Suwon
Palomar Technologies is a leading supplier of precision die attach, wire bond and vacuum reflow equipment and services, supporting advanced photonic and microelectronic device manufacturers. Palomar’s automated bonding and vacuum reflow machines are known for their flexibility, accuracy, reliability and speed. With a global installed base established over four decades and operations in California, Singapore and Germany, all Palomar customers are directly supported by Palomar service engineers for the life of the equipment. Every Palomar location offers its regional customers Contract Manufacturing Assembly Services, utilizing Palomar’s equipment and process expertise to bond, assemble, package and test a broad range micro-electronic and opto-electronic devices.
Die Bonders
Ball Wire Bonders
Wedge Wire Bonders
Vacuum Pressure Reflow Ovens
High Vacuum MEMS Ovens
Ultrasonic Wire Bonders
Thermocompression Die Bonders
Wafer-Level Die Bonders
Gold Ball Bumpers