Teikoku Taping System, Inc.
ISES Member
Company Profile
With over twenty-five years of semiconductor equipment experience, Teikoku Taping System (TTS) applies its core technologies of Haru (taping, bonding), Hagasu (de-taping, de-bonding), and Hakobu (handling, transportation) to the latest process challenges.
In addition to legacy processes like back-grind tape lamination and mounting wafers to dicing tape and frame, TTS enables some of the latest Dry Film Resist applications, and specialty tapes for Temporary Bonding, Sheet Molding, and others.
TTS is now working with PulseForge to integrate their photonics de-bonding with surface cleaning, tape removal, and wafer mounting to improve overall yield and process costs for backside processing of power devices.