27-28 August 2025
Suwon
Lead laser technology is mainly engaged in the research and development, production, sales, and service of semiconductor laser precision processing machine; Committed to providing customers with comprehensive solutions for semiconductor equipment and processes.
Lead laser offers: wafer laser grooving/full cut machine, wafer backside marking machine, wafer steath dicing machine etc., Widely used in advanced semiconductor packaging, wafer level packaging, TSV, 3D packaging and other processes.