Webinar Topic
ISES 2022: 5G & IoT – Live Webinar
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Webinar Agenda
(Agenda in US PDT time zone)
Theme: 5G & IoT – Technology Inflection: A long wave
08:00
Welcome Address
08:15
Inflections in Bluetooth Technology
Presented by: Sonal Chandrasekharan, VP Bluetooth Product Line – Infineon Technologies
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08:40
5G/IoT Applications and Their Impact on Packaging Trends
Presented by: Vik Chaudhry, Senior Director, Product Marketing and Business Development – Amkor Technology, Inc.
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09:05
New RFIC Challenges and Trends in 5G Networks
Presented by: Dr. Marzieh Veyseh, CTO & 5G Wireless Technologist – SiTune Corporation
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09:30
Closing Remarks
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Presentations
VP Bluetooth Product Line – Infineon Technologies
Sonal Chandrasekharan is Vice President, Bluetooth Product Line @ Infineon Technologies, a leading provider of semiconductor solutions for automotive, industrial, power and the Internet of Things. In this role, she has P&L responsibility to Blue tooth Products drives strategic product development for Bluetooth connectivity, software, data services and ecosystem. She is also responsible for creating complementary Bluetooth solutions synergistic to Infineon product line
Sonal has over 15+ years of technology sector experience leading to executive positions responsible for Revenue, P&L, marketing, product strategy and business operations. She has developed a strong understanding of system architectures across multiple market segments while interfacing with customers and industry organizations. Her responsibilities have included all aspects of new product definition, business planning, product development, market introductions and follow-on sales in world-wide markets. She has strong marketing and business development skills when turning new ideas into leading-edge products, then positioning these solutions in vertical markets, achieving market share gains and best-in-class profitability. She works well with all elements of an organization and take pride in developing strong team collaboration to achieve corporate goals.
Sonal holds an B.Tech in Electrical Engineering from Calicut University, Kerala India and and an M.B.A. degree from NITIE, Mumbai, India. She is currently a member of Chief, a private women’s network designed for the women in executive leadership to strengthen their leadership, magnify their influence, and pave the way to bring others with them.
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Senior Director, Product Marketing and Business Development – Amkor Technology, Inc.
Vik joined Amkor in 2014 as Sr. Director of Product Marketing and Business Development for the Advanced Products BU. Prior to joining Amkor, he was Sr. Marketing Manager for networking and communication products at IDT. Prior to IDT, Vik held engineering and marketing management roles at White Electronics (MicroSemi), TDK Semiconductors and Motorola SPS. Vik has also authored several technical papers. He holds a BS in Electrical Engineering from National Institute of Technology, Bhopal, India, and a Masters in Electrical Engineering and an MBA from Arizona State University.
Projections for 5G anticipate continued growth in the near future, especially in infrastructure space. In last two years, the first wave of expansion resulted in robust growth in the handset space. In fact, 570 million, 5G smartphones were shipped last year. Handset manufacturers such as Apple and Samsung benefitted from this expansion the most. In the second wave, other areas are expected to grow. High speed internet connection to home with 5G is one such area. Proliferation of 5G is expected in other vertical markets as well such as PCs, tablets, smart cars, smart factories and more. In this webinar, Amkor will present the current market, applications, challenges and value contributions from the packaging perspective to make 5G projections a reality.
As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.
We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.
As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.
Phone: 480-821-5000
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.
Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.
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CTO & 5G Wireless Technologist – SiTune Corporation
Marzieh has been actively involved in the development of science and technology in the field of Wireless communication for the past 18 years. She has authored and co-authored numerous papers and patents with novel fundamental ideas to improve the performance of wireless networks by designing new protocols in the medium access layers as well as new hardware implementation techniques that support and help the higher layer distribution algorithms to attain lower latency and higher reliability. This includes her PhD Thesis, papers and patents while working as a scientist and CTO as well as CPO at SiTune corporation. She has acted as Journal reviewer, Book co-author and Teaching assistant during her graduate studies and Co-founded SiTune in 2007 during her PhD years.
Marzieh has helped in developing SiTune’s successful commercialized products in terms of architecture design, research and product development. She has directly managed the R&D team and handled patents composition and submission as well as managing projects and partnerships while working on the innovation aspects of the company’s products. She is the chief architect for SiTune’s advanced products such as 5G Transceivers, DPD design for Power Amplifiers, and Full Duplex Design for DOCSIS 3.1 RF Front End. Her PhD work was based on implementation of novel communication protocols for wireless network and cross-layer design for attaining concurrency in wireless spectrum allocation. She worked at Hitachi America in 2011 for a year on protocol development for lowering power consumption in WiFi based monitoring systems. Her work across wireless communication layers from complex physical layer optimization algorithms to meticulous MAC layer protocol resulted in many publications and more than 20 patents.
With the world moving towards AI and machines capable of making tactile decisions, the need for 5G enabled infrastructure and user Equipments is imminent. 5G requires wider bandwidths, higher frequencies, and more signal power support for longer ranges in the sub-6GHz frequencies. This introduces new challenges in terms of RFIC design and manufacturing. With larger signal power requirement and power amplifiers nonlinearity and heat, transceivers should be highly linear and add pre-distortion capabilities while supporting wider bandwidths. This is when more integration is required to reduce cost and to support multiple bands. In this talk, we cover the new trends and how new high performance RFIC solutions are essential in building 5G connected networks.
SiTune Corporation is an innovator of multiple generations of state-of-the-art RF and Mixed signal System on a Chip transceiver solutions for 5G/LTE wireless infrastructure and user equipment market. SiTune products and technology are shifting the paradigm in enabling true deployment of 5G New Radios through offering a rich family of low power transceiver solution. SiTune transceivers IceWings and SnowWings are uniquely differentiated due to their superior feature sets, level of integration and lower power consumption. SnowWingsTM with digital interface and IceWingsTM with analog interface are based on the patented ultra-wide-band Hardware intelligence circuits (HICTM) Technology.
Website: https://situne-ic.com/
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