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(Agenda in US PST time zone)
08:00 – 08:10
08:15 – 08:35
Semiconductor 2022 Outlook
Presented by: John Ciacchella, Principal – Deloitte Consulting LLP
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08:40 – 09:00
Advanced Packaging and Heterogeneous Integration Trends for High Performance Applications
Presented by: Santosh Kumar, Senior Director and Principal Analyst – Yole Développement
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09:05 – 09:25
The New Semiconductor Industry Era: Enabled by Advanced Packaging
Presented by: Jan Vardaman, President and Founder – TechSearch International
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09:30 – 09:50
Chinese Market is the One to Watch Over the Next Ten Years
Presented by: Lin Fu, Principal Analyst – VLSIresearch Europe
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09:55 – 10:00
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Principal – Deloitte Consulting LLP
John Ciacchella currently serves as the Chief Commercial Officer for Deloitte’s Technology, Media and Telecom Industry Practice. He also leads Deloitte Global Semiconductor Center of Excellence. He has over 22 years consulting to the Semiconductor and Technology Industry focused on business transformation, operations improvement, and M&A. During that time John has also sponsored multiple market research efforts on competitiveness and transformation in the Technology Industry. Prior to his shift to consulting, John worked for Fairchild Semiconductors as a Member of the Research Staff and at National Semiconductors as a Product Manager. He also holds two patents in thin film technologies. John has also served on the boards of Joint Venture Silicon Valley and 3 private companies in Silicon Valley.
As we kick off the new year, Semiconductors have taken their rightful place as a national strategic industry. What’s the market outlook for the industry in the new year and going forward? In terms of revenue growth, Deloitte predicts the semiconductor industry will grow by 10% in revenues this year, in line with most industry analysts. This presentation will review 6 key market themes we see for 2022 and present some of the key strategic questions each of these themes will pose for industry players, customers, investors, and governments.
“Deloitte” is the brand under which approximately 330,000 dedicated professionals in independent firms throughout the world collaborate to provide audit and assurance, consulting, financial advisory, risk advisory, tax and related services to select clients. These firms are members of Deloitte Touche Tohmatsu Limited, a private company limited by guarantee incorporated in England and Wales (“DTTL,” also referred to as “Deloitte Global”). DTTL, these member firms and each of their respective related entities form the “Deloitte organization.”
Senior Director and Principal Analyst – Yole Développement
Santosh Kumar is currently working as Senior Director & Principal Analyst at Yole Développement. He is a technologist and strategist with a multifaceted experience in the materials, process and business development including industrial market & technology strategic analysis in the field of semiconductor packaging and manufacturing. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging. He worked on multiple projects with several multi-national companies covering entire microelectronics supply chain from fabless players, OEMs, IDMs, OSATs to equipment & material suppliers. He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul, respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
While demand by industry was uneven throughout the year due to global lockdowns, remote work and education, online entertainment, and shifts in consumer buying behavior, global semiconductor revenue grew by 6.8% YoY to reach $440 billion in 2020. The Advanced Packaging (AP) market was worth $30B in 2020 and is expected to grow at a CAGR2020-2026 of ~8% to reach $47.5B in 2026. The industry is seeking alternatives to design and manufacture the latest Systems on Chips (SoCs) using System in Package (SiP) and chiplet-based approaches by leveraging Advanced Packaging to mix both the latest and mature nodes. 2.5D/3D packaging is accelerating into new technical breakthroughs for 3D Interconnect Density (3D ID). 3D SoC – D2W and D2D hybrid bonding is viewed as the next technology breakthrough to achieve 10 μm fine pitch. Regarded as a FE packaging technology, this enables system-level high-end performance with denser 3D IC stacking of 3D DRAM, heterogenous integrated packages and packaged partitioned SoC dies. Leading suppliers, especially TSMC, YMTC, Samsung and Intel, are all targeting this by providing cutting-edge hybrid bonding solutions. This is perhaps the true contact point between the semiconductor and packaging worlds. This presentation will discuss the key market drivers, benefits and challenges of high-end performance packaging technologies.
Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, corporate finance services, reverse engineering and costing services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Group of Companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics, Batteries & Energy Management and Memory. Yole, along with its partners System Plus Consulting, PISEO and Blumorpho, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.
More information on www.yole.fr. Follow Yole on LinkedIn and Twitter.
President and Founder – TechSearch International, Inc
E.Jan Vardamanis president and founder of TechSearch International, Inc., which has provided market research and technology trend analysisin semiconductor packaging since 1987.She is the co-author of How to Make IC Packages(by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly,and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPSand is anIEEE EPSDistinguished Lecturer.She is a member of SEMI,SMTA,IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
The new semiconductor era with next generation silicon nodes is driving adoption of new packaging and co-design. This presentation examines semiconductor industry trends and the role of advanced packaging in achieving the meeting industry needs. The role of chiplets in sided-by-side and 3D configurations will be discussed.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly, as well as developments in advanced technologies and semiconductor packaging materials. TechSearch International provides technical and economic analysis of markets for packages including silicon interposers (2.5D), flip chip, fan-in wafer level packages (WLP) and fan-out WLP. Our recent analysis is focused on understanding the drivers for heterogeneous integration. TechSearch International analysts have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.
Principal Analyst – VLSIresearch Europe
Lin is a Principal Analyst of VLSI Research Europe. She received the Doctoral Degree in Engineering from University of Cambridge in 2017. Lin has published more than 20 academic papers as the first author or co-author in the IEEE Transactions, SUST, Journal of Physics D.
Lin started to join VLSI Research Europe from February 2017, focusing on the technical and marketing research and analysis related to semiconductor test consumables.
Currently, the semiconductor industry is being driven by several megatrends including the cloud, 5G, artificial intelligence, intelligent edge, gaming, and visualization tool, which will lead the market size to double to $1Tn in ten years’ time. As a fast-growing and critical strategic industry, governments think more control of semiconductor supply chain and find ways to increase chip manufacturing knowhow.
Over the next ten years China is definitely the one to watch as it is vigorously developing its own cutting-edge technology. In this presentation, I will explain what changes are happening now and how these activities are likely to impact the landscape of industry and have far-reaching effects.
VLSI Research Europe provides market research and economic analysis on the technical, business and economic aspects of the semiconductor and related manufacturing industries to help our clients within these industries the make better decisions faster. Our clients rely on us to provide accurate and timely data and intelligence on their served markets. We believe we are able to deliver this because of the strong, personal relationships we have nurtured and developed with industry players at all levels of the supply chain.
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