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July 19 (Live Webinar) – 08:00 AM PST, San Francisco
08:00 – 08:10
08:15 – 08:35
Silicon Technology Challenges for FPGA in 5G Applications
Presented by: Nui Chong, Principle Engineer and Project Lead – Xilinx
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08:40 – 09:00
5G/IoT – Applications, Challenges and Contributions from a Packaging Perspective
Presented by: Curtis Zwenger, VP, Advanced SiP Product Development – Amkor Technology, Inc.
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09:05 – 09:25
Wi-Fi 6E & 5G Benefits for IIoT
Presented by: Irvind Ghai, VP, Marketing, Wireless Connectivity & Signal Process Division – On Semiconductor
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09:30 – 09:50
Foundational Technologies Driving 5G and Edge Innovation
Presented by: Robert Dimond, Fellow and System Architect 5G and IoT – Arm
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Principle Engineer and Project Lead – Xilinx
Nui Chong received his PhD and BSc degrees in Physics from University of Cambridge, United Kingdom, and University of Hong Kong, Hong Kong, respectively. He has been working in new product introduction, process technology development, design enablement and advanced technology assessment on multiple technology nodes since 90nm in Xilinx. He is currently 7nm project lead in silicon technology driving Xilinx product roll-out with foundry partner.
Continuous silicon technology scaling from 7nm to beyond allows richer design features and stronger capability to be integrated into high performance FPGA to enable 5G deployment. We will brief advanced FPGA applications found in 5G infrastructures. The challenges of optimizing high performance computing design to advanced nodes will be discussed, in terms of area scaling, power-performance and IP integration, as well as an outlook of technology trend.
Xilinx is the inventor of the FPGA, programmable SoCs, and now, the ACAP. Our highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies – from consumer to cars to the cloud. Xilinx delivers the most dynamic processing technology in the industry, enabling rapid innovation with its adaptable, intelligent computing
2100 Logic Drive
San Jose, CA 95124
Tel: (408) 559-7778
Fax: (408) 559-7114
VP, Advanced SiP Product Development – Amkor Technology, Inc.
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package, MEMS/Sensor and Memory product development. Curtis is Past General Chair for the IMAPS Symposium on Microelectronics 2019 and serves on the IMAPS Executive Council as Director of Membership. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies.” Curtis has been issued 30 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
The internet of things, while already booming, can expect a big boost from 5G cellular technology as it becomes more widely available and as commercial services catch up with enhanced standards that are already in the pipeline. 5G is an incredibly complex technology presenting many hurdles for engineers, service providers and users. Amkor will present the current market, applications, challenges and value contributions from packaging perspective as 5G becomes a key enabler for IoT products.
You may know us for high-quality semiconductor packaging and test services. But do you know what inspires us to do what we do? An unswerving commitment to customer service, engineering expertise, and high volume manufacturing excellence. Helping solve the complex technological challenges facing the industry is what continually motivates us. We want our customers to focus their resources on semiconductor design and wafer fabrication while trusting us to be their reliable packaging technology innovator and test partner.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, we’ve delivered innovative packaging solutions with the service and capacity global customers rely on. We’re proud of what we’ve done and can’t wait to show you what’s next.
晶圆加工，并将我们视为其可靠的封装技术创新者与测试合作伙伴。Amkor 的经营场地包括位于亚洲、欧洲和美国主要电子制造地区的工厂设施、产品开发中心和销售及支持办公室。作为OSAT 行业的创新先驱者，Amkor Technology 一直帮助定义和优化技术制造现状。自 1968 年起，我们持续提供创新的封装解决方案，以及全球客户都能信赖的服务和功能。我们以此为豪，并迫不及待地向您展示美好的未来前景。
VP, Marketing, Wireless Connectivity & Signal Process Division – On Semiconductor
Irvind Ghai focuses on innovative connectivity solutions for the Service Provider, IoT, Industrial and Automotive markets. His charter is to create value for ON Semiconductor’s customers via end-to-end infrastructure and client platforms. Prior to that, he was Vice President for the Connectivity Business Unit of Qualcomm Technologies, where he oversaw product management and business development for Wi-Fi, mmWave 60GHz and 4G/5G Small Cell solutions for the Home and Enterprise. He is experienced in defining market strategies leveraging PON, DSL, DOCSIS, Video and VoIP platforms given his time with Texas Instruments. Irvind holds a Master’s degree in Electrical Engineering from Purdue University, and an MBA from the University of St. Thomas.
Industrial IoT (IIoT) Devices, essentially embedded systems, that operate in manufacturing environments run the gamut from simple wireless smart sensors to multi-processor devices with significant compute resources. While developers face many of the same design challenges (i.e. power management) related to IoT devices, there are special considerations in the industrial space. This presentation explores the new innovations and trends in IIoT technologies around device monitoring, security, connectivity and processing.
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The Company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The Company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit www.onsemi.com.
Fellow and System Architect 5G and IoT – Arm
Rob Dimond is System Architect and Fellow at Arm. Rob works in the Architecture and Technology group at Arm where his focus is developing technology in a 3-5 year time horizon for the infrastructure segment (servers and networking). Prior to Arm, Rob was Chief Hardware Architect at Maxeler. Rob holds degrees in Electronic Engineering and Computer Science from Imperial College, London.
The world’s digital infrastructure is in the midst of a fundamental transformation that will reshape communications, computing and commerce. 5G and edge services will be key to accelerate this digital transformation for the coming decade with their promise of blazing speeds, reduced latencies and the capacity to connect billions of devices. But to achieve that, we need to first understand the foundational technologies that are needed to ensure the networks can scale exponentially and remain economical. We need to understand new security technologies to reduce data theft and breaches, while also being cognitive about the sustainability of expanding the 5G and edge footprint. Tune into the session for a quick take on these technology updates and how they will dramatically alter the trajectory of global 5G networks and edge services.
Arm technology is at the heart of a computing and data revolution that is transforming the way people live and businesses operate. Our energy-efficient processor designs and software platforms have enabled advanced computing in more than 190 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. Together with 1,000+ technology partners we are at the forefront of designing, securing and managing all areas of AI-enhanced connected compute from the chip to the cloud.
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