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ISES CMOS Image Sensors
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Webinar Agenda
September 16 (Live Webinar) – 08:00 (AM) PST, San Francisco
08:00
Welcome Address
The Image Sensor Journey – to the Human Eye and Beyond
Presented by: Dr. Min-Sun Keel, Principal Engineer, Head of Automotive Sensor Design Group – Samsung
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Patterning Material and Process Innovations Enhance CIS Performances
Presented by: Dr. Guanyang Lin, Business Technology Manager, Patterning R&D, Global Semiconductor R&D – Merck
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Pixel Architecture Technology and Innovation for New Optical Sensor Applications
Presented by: Helene Wehbe-Alause, Director of Technology for Optical Sensors Department – STMicroelectronics
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New Package Solutions for Automotive Optical Sensors
Presented by: Weilung Lu, Sr Director, MEMS and Sensor Products – Amkor Technology, Inc.
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Presentations
Principal Engineer, Head of Automotive Sensor Design Group – Samsung
Min-Sun Keel received the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2015. From 2002, he is working for Samsung Electronics as an analog IC designer and a system architect for CMOS image sensors. His research interests include high dynamic-range sensors, 3D depth sensors, and low-noise sensor readout architectures with energy-efficiency. He is currently a head of Automotive Sensor Design Group, to develop and investigate high-performance automotive CMOS image sensors.
CMOS image sensors are evolving rapidly for the past 20 years to emulate the human vision system. In the near future, we will see image sensors, which are comparable to the human eyes in terms of resolution, dynamic range, frame-rate, and autofocus. The key enabling technologies will be introduced to realize human-eye-like image sensors. Then, what will be the next? We expect CMOS image sensors will augment the human eye system. Wider dynamic range will make autonomous driving much safer. Multi-spectral sensors will let us see even in the bad weather conditions. Depth sensing will provide 3D space information to the machine vision system. All the aggregate image sensor technologies will make our daily life safer, securer, and healthier.
Profile coming soon…
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Business Technology Manager, Patterning R&D, Global Semiconductor R&D – Merck
Guanyang Lin, Ph.D., started his career in electronic material R&D in 2001 and joined AZ Electronic Materials (AZEM), now Merck Electronics in 2003. Dr. Lin has experience in developing a wide range of patterning materials and novel patterning processes including photoresists, antireflective coatings, hard masks, clean processing solutions, directed self-assembly materials, and processes. Lin is currently the business technology manager (BTM) responsible for overall patterning technology development of Global Semiconductor R&D at Merck Electronics.
In this short webinar, KrF photoresists designed for high-resolution patterning for CIS photodiode manufacturing will be introduced. Novel block-co-polymer self-assembly and its potential applications to enhance CMOS image sensor performances will be presented.
Merck KGaA, Darmstadt, Germany, a leading science and technology company, operates across healthcare, life science and electronics. From advancing gene editing technologies and discovering unique ways to treat the most challenging diseases to enabling the intelligence of devices – the company is everywhere. In 2020, Merck KGaA, Darmstadt, Germany, generated sales of € 17.5 billion in 66 countries.
Most recent, Merck KGaA changed the name of its Performance Materials business sector to Electronics. The new name is the visible result of the strategic realignment conducted over the past several years and a further milestone of the “Bright Future” transformation program.
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Director of Technology for Optical Sensors Department – STMicroelectronics
Helene Wehbe-Alause has a PhD in Physics of semiconductors, on III-V quantum wells heterostructures for optical filtering, in collaboration with Schlumberger.
Helene joined STMicroelectronics in 2000 after a few years with Thales avionics developing sensors for space and aeronautical applications. She started working with 0.35µm and 120nm digital CMOS production technologies before taking the lead in 2.2µm pixel development for Image Sensor R&D in 2006.
Since 2011, she has been managing the ST Process integration team for CIS: developing the BSI, 3D stacking brick, 90nm and 40nm SPAD technologies, and bringing CDTI-based rolling and global shutters to production. In 2017, she integrated the TCAD simulation team to boost development of new pixels from concept to full qualification stages. In 2021, she was appointed Director of Technology for Optical Sensors Department to support the ST Imaging Division in developing various technologies and innovative pixel architectures, through to quality and readiness for industrialization.
Since their revolutionary introduction in smartphones cameras, optical sensors have seen exponential growth in groundbreaking user detection, face recognition, payment, Augmented Reality and Virtual Reality applications. They help us make decisions and are pouring into new domains like vehicles thanks to Advanced Driver Assistance systems, lidars, etc. Among these new features, distance measurement has added a third dimension and 3D vision has become widespread. To render all these new uses possible, optical sensors have evolved and diversified with Time-of-Flight, direct or indirect, Single photon avalanche detection, rolling and global shutter technologies, and more.
We will be presenting the different pixel architectures in this webinar, along with their innovative technological features.
At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com.
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Sr Director, MEMS and Sensor Products – Amkor Technology, Inc.
Weilung joined Amkor in 2015 and is currently responsible for MEMS and Sensor products business and optical sensor package development. Prior to joining Amkor, he worked for Siliconware Precision Industries Co., Ltd. (SPIL) as a technical program manager supporting key US customers and in R&D developing wirebond and flip chip products. Weilung holds a master’s degree in Information Management from the National Yunlin University of Science and Technology, Taiwan.
Advanced Driver Assistance Systems (ADAS) are designed to help the driving process and enhance car/road safety. Automotive optical sensors enable ADAS and the autonomous driving transition from SAE J3016 Level 2 towards Level 4/5, according to SAE International (formerly the Society of Automotive Engineers).
Current optical sensor chip designs require custom package solutions which have assembly packaging and test challenges. In addition, stringent reliability requirements increase the development time to select materials, run process evaluation, optimize process parameters and complete reliability verification for automotive applications.
New automotive optical package innovations extend Amkor’s broad package portfolio capabilities and expertise to benefit automotive customers. The solution to current automotive image sensor application challenges involves creating a package platform that utilizes an assembly open toolbox, adopts a new generation of wafer fabrication requirement, achieves faster development cycle time and manages cost efficiency.
This presentation will discuss a standard package platform to design alternative package solutions, overcome technical challenges and satisfy the automotive requirements for optical sensors.
© 2021, Amkor Technology, Inc. All rights reserved.
You may know us for high-quality semiconductor packaging and test services. But do you know what inspires us to do what we do? An unswerving commitment to customer service, engineering expertise, and high volume manufacturing excellence. Helping solve the complex technological challenges facing the industry is what continually motivates us. We want our customers to focus their resources on semiconductor design and wafer fabrication while trusting us to be their reliable packaging technology innovator and test partner.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, we’ve delivered innovative packaging solutions with the service and capacity global customers rely on. We’re proud of what we’ve done and can’t wait to show you what’s next.
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