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Webinar Agenda
Update on Semiconductor Markets – The Future is Bright
Presented by: Tom Stokes (Senior Managing Director), Kunal Chakrabarti (VP, Technology Mergers and Acquisitions) – Evercore
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Solving the Substrate Crisis
Presented by: E. Jan Vardaman, President and Founder, TechSearch International, Inc.
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Presentations
The semiconductor industry has stayed remarkably strong throughout 2020 and the outlook for 2021 looks bright. In this presentation, Tom Stokes and Kunal Chakrabarti will discuss the factors driving the remarkable growth in the semis industry, Evercore’s outlook for the industry, activity of key participants (devices and capital equipment), return of big M&A in 2020, strong state of capital markets, and what to expect in 2021.
Presenters:
Senior Managing Director – Evercore
Tom Stokes is a Senior Managing Director of the firm’s corporate advisory business. Mr. Stokes is focused on advising clients across the technology sector.
Prior to joining Evercore, Mr. Stokes was a Managing Director in the Investment Banking Division at Goldman, Sachs & Co., where he served as global head of Electronics and Industrial Technology Investment Banking. With over 20 years of relevant experience and over 13 years at Goldman Sachs, Mr. Stokes has extensive experience advising companies across the technology industry. In particular, he has advised on a number of the most notable recent transactions across the semiconductor, electronics and industrial tech subsectors. Clients represented by Mr. Stokes include Advanced Energy, Aeroflex, Anaren, AZ Electronic Materials, Belden, Brooks, CDW, Cobham, Corning, Dover, Edwards, Entegris, Fortive, Freescale, IBM, Lam Research, Lexmark, Macom, Molex, Keysight, Koch Industries, TE Connectivity, Samsung, Sensata, Solectron, Tokyo Electron, Universal Display, Viasystems and Vishay, among others.
Mr. Stokes received his BA, MA and MEng degrees (First Class) in Engineering from Cambridge University and received his MBA degree from Kellogg School of Management.
VP, Technology Mergers and Acquisitions – Evercore
Mr. Chakrabarti is a Managing Directorin the firm’s corporate advisory business focusing on the Technology sector.
Mr. Chakrabarti has advised leading technology firms and financial sponsors on M&A and capital markets transactions including AvePoint on combination with Apex Technology and subsequent public listing, Conservice on sale of TA Associates’ equity stake to Advent International, Conservice on its sale of majority stake to TA Associates, Enersys on the $750M acquisition of Alpha Technologies Group of Companies, Akamai on its defense and cooperation agreement with Elliott Management, Cobham on its $455M divestiture of AvComm and Wireless businesses to Viavi, Samsung on the $9B acquisition of Harman, Qualcomm on the $49B announced (and subsequently cancelled) acquisition of NXP Semiconductors, Sonus on a merger of equals with Genband, Siris Capital’s $943M acquisition of PGi, Cbeyond on its $323M sale to Birch, and financing of TPG led group’s acquisition of Cirquedu Soleil.
Prior to Evercore, Mr. Chakrabarti was an Associate Director at UBS in their Technology, Media and Telecommunications Group in New York. He holds a MBA from Cornell University’s SC Johnson Graduate School of Management and a BA in Economics from University of Delhi, India.
Evercore is a premier global independent investment banking advisory firm dedicated to helping clients achieve superior results through trusted independent and innovative advice on matters of strategic significance to boards of directors, management teams and shareholders, including mergers and acquisitions, strategic shareholder advisory, restructurings, and capital structure. Evercore also assists clients in raising public and private capital and delivers equity research and equity sales and agency trading execution, in addition to providing wealth and investment management services to high net worth and institutional investors. Founded in 1995, the Firm is headquartered in New York and maintains offices and affiliate offices in major financial centers in the Americas, Europe, the Middle East and Asia.
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Demand for IC package substrates specifically FC-BGAs, continues to grow. Work-from-home, video conferencing, and remote learning are driving datacenter growth and laptop and tablet demand. At the same time the industry is experiencing acute shortages substrates because capacity expansion has not kept up with demand, especially with the increased body size and layer counts. A new plant requires more than a year to complete, plus the substrate line must be qualified. What can the industry do in the interim to meet demand? What changes are required in the industry to fix our broken model? This presentation addresses the challenges and discusses potential solutions.
Presenter:
President and Founder – TechSearch International, Inc.
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI, SMTA, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly, as well as developments in advanced technologies and semiconductor packaging materials. TechSearch International provides technical and economic analysis of markets for packages including silicon interposers (2.5D), flip chip, fan-in wafer level packages (WLP) and fan-out WLP. Our recent analysis is focused on understanding the drivers for heterogeneous integration. TechSearch International analysts have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.
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