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ISES Power Semiconductors & Automotive Electronics
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Sharing and learning the best practices on power semconductor.
Silicon Carbide Power Devices Enable Modern Power Applications
Presented by: Christopher Rexer, Senior Director of Technology Enablement for the Advanced Power Division – ON Semiconductor
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The Power Electronics Market: Main Trends and Dynamics in an Increasingly Electrified World
Presented by: Rafael Della Giustina, Custom Projects Business Developer, Power & Wireless Division – Yole
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Advances in Etch Processing for Fabrication of High Voltage Power Devices on 300mm Wafers
Presented by: Michelle Bourke, Senior Director of Strategic Marketing – Lam Research
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Semiconductor Packaging Industry Addresses Critical Challenges in the Power Automotive Market
Presented by: Shaun Bowers, Vice President, Mainstream Advanced Package Integration – Amkor Technology, Inc.
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New Wide Bandgap Power Semiconductors Speed Up Car Electrification
Presented by: Filippo Di Giovanni, Strategic Marketing, Innovation and Key Programs Manager – Power Transistor Macro Division – STMicroelectronics
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EV inverter technology: Faster Charging, Higher Efficiency, Longer Range: The Next Step in Electrification
Presented by: Stephen Lambert, Head of Electrification – McLaren Applied
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Presentations
Senior Director of Technology Enablement for the Advanced Power Division – ON Semiconductor
Christopher Rexer is the Senior Director of Technology Enablement for the Advanced Power Division of ON Semiconductor. His work focuses on power discrete device development including silicon power MOSFETs, IGBTs and rectifiers, SiC power MOSFETs and rectifiers as well as GaN power devices. Prior to joining ON Semiconductor he worked in technical and technical leadership positions for Cherry Semiconductor, Harris Semiconductor, Intersil and Fairchild Semiconductor. Mr. Rexer has over 35 Years of semiconductor experience with 30 years focused on power device technology and product development. His responsibilities have included leading worldwide development teams responsible for conceptualization, development and production release of leadership power technologies and products. Mr. Rexer received his BSEE and MBA degrees from Wilkes University. He has been awarded 19 U.S. patents and 26 published patent applications. He is an advisory board member of the PCIM Europe conference and a senior member of IEEE.
Recent advances of silicon carbide (SiC) power MOSFETs enable improved performance of a wide range of modern power applications. These SiC devices provide system advantages over silicon based power devices. These advantages include lower power losses, increased efficiency, and reduced thermal management needs. The timely device offerings of SiC MOSFETs by semiconductor suppliers is synergistic with an increased deployment of advanced power systems in the areas of automotive electric and hybrid electric vehicles, renewable energy, telecommunications and enterprise computing. A SiC ecosystem supports the technical adoption and production supply of these products.
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The Company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The Company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit www.onsemi.com
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Custom Projects Business Developer, Power & Wireless Division – Yole
Rafael Varela Della Giustina serves as custom projects business developer for the Power and Wireless Division at Yole Développement (Yole). He helps build relationships with leading customers and assists them through the development of strategic projects. His activities cover power electronics, batteries & energy management, compound semiconductors and emerging materials and RF electronics. Prior to Yole, Rafael served in many positions ranging from engineering to business development in the Semiconductors, Renewable energy and Oil&Gas industries, both in R&D and in Operations. He holds two M.Sc. in engineering from Ecole Centrale de Marseille, in France, and UFRGS, Brazil, where he specialized in Radio Frequency Integrated Circuit (RFIC) design. He also holds an MBA from IAE-Paris and Université Paris-Dauphine (France).
The global power electronics market accounts for $17.5B, with a 4.3% Compound Annual Growth Rate (CAGR) from 2019-2025, mainly pushed by automatization, efficiency regulation and clean energy goals. New applications are also being pushed, like charging DC for EV which is required to support the EV growth. Within the power market, we can differentiate three different major driving components: silicon MOSFETs, IGBT modules and Wide Band Gap (WBG) devices.
Today, the largest share of the power device market is for silicon MOSFET devices. We estimate that the demand for electrified vehicles will surpass 30 million units per year by 2025, also causing a steep increase in demand for IGBT modules. Many players have announced investments in 200 and 300mm fabs to cope with the huge demand on devices for automotive applications, at the same time as industrial applications are also growing. Nevertheless, WBG semiconductors are expected to evolve very rapidly to multi-billion-dollar businesses, driven by the adoption of SiC MOSFET in EV/HEVs, such as Tesla, BYD and many more to come.
This presentation will cover the highlights and dynamics of the power electronics market. We will analyse the main drivers of demand and technology trends for both silicon and WBG.
Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, corporate finance services, reverse engineering and costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Group of Companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Computing & Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics, Batteries & Energy Management, and Memory.
Yole, along with its partners System Plus Consulting, PISEO and Blumorpho, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. More information on www.yole.fr. Follow Yole on LinkedIn and Twitter.
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More information on www.yole.fr
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CONTACTS
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Senior Director of Strategic Marketing – Lam Research
Michelle M. Bourke received a B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University, Edinburgh, Scotland, U.K., in 1993. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 Michelle moved to the semiconductor capital equipment industry as an etch process engineer. In 1999 she moved into Product Marketing where she has continued to develop her career. Today Michelle is with Lam Research Corporation as Senior Director of Strategic Marketing in the Customer Support Business Group.
To support applications in consumer electronics, automotive, energy generation and data storage, the demand for power discretes and modules was expected to grow from $17.5B in 2019 to $22.5B in 2020 – a CAGR of 4.3%
To meet this demand, the power electronics industry will not only need to continually improve device design and performance, but also deploy new manufacturing processes that will allow these devices to be manufactured cost effectively in increasingly high volume. This will include the transition to fabrication of power electronics on 200mm and increasingly 300mm wafers. The capability to achieve highly uniform plasma and wet chemical etching on 200mm and 300mm wafers will be critical to achieving this.
In this presentation, the highly challenging etch processes that are critical to the fabrication of key power devices will be reviewed. The presentation will also consider the technical challenges and enabling solutions in the fabrication of wide-band gap semiconductor devices based upon GaN technology.
As a trusted, collaborative partner to the world’s leading semiconductor companies, Lam Research is a fundamental enabler of the silicon roadmap. In fact, today, nearly every advanced chip is built with Lam technology.
Our innovative wafer fabrication equipment and services allow chipmakers to build smaller, faster, and better performing electronic devices. We combine superior systems engineering, technology leadership, a strong values-based culture, and unwavering commitment to customer success to accelerate innovation, enabling our customers to shape the future. For more information visit www.lamresearch.com
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Vice President, Mainstream Advanced Package Integration – Amkor Technology, Inc.
Shaun joined Amkor in 2000 and is currently responsible for package development in automotive, wirebond and power business segments. He previously held technical program management, sales and technical service roles as well. Prior to joining Amkor, Shaun worked for Johnson Matthey Electronics and Honeywell Electronic Materials. He holds a degree in mechanical engineering from Gonzaga University.
Throughout the history of the semiconductor industry, the market has evolved through technical advancements, disruptors and catalysts. Each of these disruptors and catalysts played a key role in establishing the breadth, maturity and rate of technical adoption within the power, mobile, industrial and automotive markets.
This presentation will compare the power semiconductor market to adjacent markets through the lens of disruptors and catalysts, identify possible challenges on the horizon and demonstrate how the semiconductor packaging industry will address these challenges in the power automotive market.
You may know us for high-quality semiconductor packaging and test services. But do you know what inspires us to do what we do? An unswerving commitment to customer service, engineering expertise, and high volume manufacturing excellence. Helping solve the complex technological challenges facing the industry is what continually motivates us. We want our customers to focus their resources on semiconductor design and wafer fabrication while trusting us to be their reliable packaging technology innovator and test partner.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, we’ve delivered innovative packaging solutions with the service and capacity global customers rely on. We’re proud of what we’ve done and can’t wait to show you what’s next.
我们以高质量的半导体封装和测试服务而闻名。是什么在激励我们不断进步？是对服务客户，工程专业技术，以及高产能卓越制造的坚定承诺。帮助克服行业所面对的复杂技术挑战始终是我们的动力。我们希望客户将资源集中投入到半导体设计和
晶圆加工，并将我们视为其可靠的封装技术创新者与测试合作伙伴。Amkor 的经营场地包括位于亚洲、欧洲和美国主要电子制造地区的工厂设施、产品开发中心和销售及支持办公室。作为OSAT 行业的创新先驱者，Amkor Technology 一直帮助定义和优化技术制造现状。自 1968 年起，我们持续提供创新的封装解决方案，以及全球客户都能信赖的服务和功能。我们以此为豪，并迫不及待地向您展示美好的未来前景。
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Strategic Marketing, Innovation and Key Programs Manager – Power Transistor Macro Division – STMicroelectronics
Filippo Di Giovanni has more than 30 years of experience in power transistors technology and applications. He has contributed to the introduction of super-junction MOSFETs, SiC MOSFETs and GaN HEMTs. He is also involved in the co-ordination of several important European-funded projects on smart power technologies.
The quest for increasingly efficient power conversion products in EVs is accelerating the development and deployment of wide bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN) technologies.
Offering excellent on-resistance under high voltages, higher switching capabilities, and the ability to operate under harsh conditions, SiC MOSFETs are today used in the EV’s main systems, including inverters, on-board chargers, DC-DC converters, and charging stations.
GaN is complementary to SiC and stretches from 100 to 900V. GaN transistors are already used in power conversion applications, and are considered as a good alternative to mainstream, silicon-based transistors in multiple domains. The power GaN is based on silicon substrates and can therefore be manufactured in existing CMOS fabs, thereby raising its competitiveness.
At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com.
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Head of Electrification – McLaren Applied
Dr Stephen Lambert received his Doctorate from the University of Warwick by looking at the applicability of hybrid and electric drivetrains in motorsport. Following this he worked at Lotus Engineering, developing hybrid and electric demonstrator vehicles for a number of OEMs. Through this role, he found himself working closely with battery manufacturers as a key partner for these projects. He has since worked in various roles around developing battery technology in areas such as Formula 1 and high performance road cars. He is now responsible for the electrification strategy for automotive customers with McLaren Applied technologies, where he is helping deliver advantage by empowering customers to introduce and protect new vehicle concepts and technologies and to drive differentiation in the market. He is also chairman of ASEIN, a dedicated UK initiative focused on the accelerated and advanced delivery of Electronic Systems (ES) into vehicles and infrastructure operated by the UK Trade Association – TechWorks.
Abstract coming soon…
Mounting pressure from governments and consumers for a sustainable future means that decarbonisation and electrification solutions are more in demand than ever before.
Spanning over a decade, McLaren Applied has a proven track record in engineering high-performance components that are accelerating the transition to electrification. In that time, we have excelled in providing specialist products with a power density that is second to none. But now, we are developing scalable electrification products for all mobility solutions.
Electrification will see high performance become the norm. For example, greater vehicle range relies on exceptional efficiency – the kind of efficiency that is achieved by the solutions we have developed in the innovation lab that is motorsport. We push the boundaries at the pinnacle and apply our technology for the mainstream, to provide you with highly optimised energy and power dense solutions which meet the highest functional safety standards.
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