US ISES 2022 Speaker
Lee Chee Ping is Technical Director for Lam Research, focusing on the advanced packaging segment. He has been in the semiconductor industry for more than 17 years with more than 11 years in advanced packaging. He now oversees a worldwide process team, engaging customers working on the advanced packaging market and technology area.
Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.
Heterogeneous Integration: enabling deposition and etch innovations
When it comes to integrated circuits (ICs), single-technology chips have been the industry standard approach. Generations of node scaling have crammed more components onto a chip, with amazing functionality, following Moore’s Law. However, the escalating cost of front end manufacturing associated with leading edge silicon technology has driven renewed focus on alternative approaches.
Meet the next frontier: heterogenous integration (HI). HI brings multiple chips (or chiplets) together into a single package. It elevates conceptually similar multi-chip modules to the next level by leveraging advanced wafer manufacturing technologies. This presentation will introduce Lam Research, followed by an overview of innovative deposition and etch equipment solutions by Lam to enable next generation heterogeneous integration.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com.