US ISES 2022 Speaker

Curtis Zwenger

  • Amkor Technology, Inc.
  • VP, Advanced SiP Product Development
  • Biography

Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package, MEMS/Sensor and Memory product development. Curtis is Past General Chair for the IMAPS Symposium on Microelectronics 2019 and serves on the IMAPS Executive Council as Director of Membership. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies.” Curtis has been issued 30 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

  • Presentation

IC Packaging Challenges and Opportunities in an Interconnected World – an OSAT’s Perspective

Today’s interconnected world has been enabled, to a large degree, by the significant advancements in semiconductor packaging. Smartphones, wearable devices and datacenter networking systems continue to challenge the packaging community as system designers look for faster, smaller and more integrated devices. And with the challenges come opportunities. Fortunately, advanced package development is not taking place in isolation. It benefits from advances occurring in other semiconductor technologies as well as advances in device design and simulation to improvements in wafer fabrication, product packaging and final test. The characteristics of a revolutionary integrated circuit (IC) package platform – innovative, reliable, extendable, cost effective and robust – are either created or supported by these technologies. From open collaboration at industry summits to strategic engagements with supply chain partners, IC packaging challenges and opportunities are being addressed. This is an outsourced semiconductor assembly and test (OSAT) supplier’s perspective.

Amkor logo
  • Company Profile

Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

Phone: 480-821-5000

Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.

Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.

US ISES 2022 Speakers