US ISES 2022 Speaker
Panelist: Deepak Kulkani
Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds eight patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.
Panel Discussion Topic: TBC
For nearly 50 years, AMD has driven innovation in high-performance computing, graphics, and visualization technologies — the building blocks for gaming, immersive platforms, and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses, and cutting-edge scientific research facilities around the world rely on AMD technology to help improve how they live, work, and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. AMD is publicly traded under NASDAQ: AMD (NASDAQ: AMD). For more information visit: www.amd.com.