US ISES 2022 Speaker
Dr. Dae-Woo Kim
- Ph. D. Material Science & Engineering, 2001
- Research Faculty Associate, 2004
- TD Engineering Manager, ATTD, Intel Corporation, 2017
- Corporate VP, Head of Package TD Team, TSP (Test & System Package), Samsung Electronics, 2017 ~ present
3D package solution, the new boundary of Si and package technology
Moor’s law is still working thru advanced package technology to overcome fab technology limitation. Chipets and heterogeneous integration would be major interesting area for advanced package application. 3D package will be major package in a future and one of key game changers in 3D technology would be gapless hybrid Cu bonding, defining the new boundary between Fab and package process. In order to overcome extremely high interconnect density and heat dissipation issue in memory as well as logic device, package needs to use fab-like process. Samsung advanced package technology including 2.5D and 3D package will be shared and discussed in this forum.
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.