US ISES 2022 Speaker

Moderator: Prof. Rao Tummala

  • Georgia Institute of Technology
  • Distinguished and Endowed Chair Professor & Director Emeritus
  • Biography

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor and Director Emeritus at Georgia Tech in USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech in 1993, he was an IBM Fellow and Director of Advanced Packaging Lab(APTL), pioneering such major technologies as the industry’s first plasma display in the 1970’s and the first and next two generations of 100-chip MCM package integration, now called chiplet MCMs, in 1980″s for servers, mainframes, and supercomputers. He is the father of System-on-Package(SOP) concept Vs. System-on-chip (SOC.) As an educator, Prof. Tummala was instrumental in setting up the largest and most comprehensive Academic Center funded by NSF as the 1st and only NSF Engineering Research Center in Electronic Systems Packaging at Georgia Tech. Such a Center, under his leadership, pioneered an integrated approach to research, education, and global industry collaborations. It involved about 30 academic and full-time research faculty,200 Ph.D. and MS students and 50-70 industry and academic collaborators from US, Europe, Japan, Korea, India and Taiwan.. It educated thousands of engineers in packaging in classrooms and labs.,and produced more than 1000 engineers with Ph.D., MS and BS degrees,. He has published about 800 technical papers and invented technologies that resulted in over 110 patents and inventions. He has been pioneering glass-based electronics as the most leading-edge packaging technology beyond Silicon interposers that is targeted to go into production In 2023.

He wrote the first modern handbook in packaging, Microelectronics Packaging Handbook( McGraw-Hill,1988); then 1st undergrad textbook, Fundamentals of Microsystem Packaging(2001); the 1st book introducing the concept of SOP, Introduction to System-on-Package( 2006) and the 2nd edition of Fundamentals of Device and Systems Packaging (2020).

He received more than 50 Industry, Academic and Professional Society awards, including.

  • 12 Invention and 4 Corporate Awards from IBM, IEEE Award David Sarnoff Award for Industry’s First MCM in 1991
  • ASM-International: Engineering Materials Achievement Award for LTCC in 1992
  • IEEE CPMT: Sustained Technical Achievement Award in 1992
  • European Electronic Materials Award from DVM in 1995
  • International Microelectronic & Packaging Society’s (IMAPS): Dan Hughes Award in 1997
  • American Ceramic Society’s John Jeppson Award in 1998
  • IMAPS’: John A. Wagnon’s Award in 1991
  • IMAPS: John A. Wagnon’s Award
  • Named by US News and World Report as one of the 50 Stars in US for US competitiveness in 1999
  • Total excellence in Manufacturing Award from ASE in 2000
  • Educator of the Year for Excellence in Teaching, Research, and Innovation in Electronics from the India-America Cultural Association in 2002
  • Techno-visionary Award from Semiconductor Industry Association of India in 2010.

In addition, he is a distinguished Alumni of Indian Institute of Science, Bangalore in 2000 , India,;University of. Illinois in 1988 and Distinguished Faculty of Georgia Tech in 2002.

He is a member of NAE in USA. And NAE in India and IEEE, IMAPS and Am Ceramic Society Fellow, and President of IEEE CPMT and IMAPS Societies. He has been a consultant and advisor to many of Fortune 500 semiconductor and systems companies

IEEE recently named him as the father of modern Packaging and created a technical field award in his name—IEEE Rao Tummala Electrronics Packaging Award.

  • Presentation

Panel Discussion Topic: TBC

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  • Company Profile

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Profile coming soon…

US ISES 2022 Speakers