US ISES 2022 Speaker

Panelist: Rebeca Jimenez

  • Amkor Technology, Inc.
  • Corporate VP, Advanced SiP Business Unit
  • Biography

Rebeca Jimenez joined Amkor in 2014 and is currently Corporate Vice President, Advanced SiP Business Unit. Prior to assuming her current role, Ms. Jimenez served in various sales and strategic program management roles. She has more than 25 years of experience in the global semiconductor industry. Prior to joining Amkor, she spent 15 years with IDT (previously ICS) in both test engineering and operations roles as well as management positions. In addition, Ms Jimenez worked in various engineering and engineering management roles at Motorola. She holds a BS in Electrical Engineering from Arizona State University, as well as an MS in Electrical Engineering from National Technological University.

  • Presentation

Panelist for Panel Discussion: Topic TBC

Amkor Technology, Inc. logo
  • Company Profile

Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier with a flexible supply chain, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

Phone: 480-821-5000

Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.

Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.

US ISES 2022 Speakers