US ISES 2022 Speaker
Panelist: Dr. Sandy Vos
Sandy Vos received her PhD from University of Minnesota in Materials Science and Engineering and has 20 years of industry experience in MEMS, microsystem, materials, component, composite and semiconductor technology and product development. She joined NXP in 2018 and is currently Director of R&D focused on inertial sensing, including automotive safety-critical devices. Her work requires the incorporation of functional safety and advancements in the state-of-the-art quality of MEMS physical sensors, within the significant challenges of an aggressive automotive-focused market as it extends into the vision of autonomous vehicles. Dr. Vos was Director of MEMS Engineering and Sr Manager of Product Development at Knowles Corporation in their Consumer Electronics division. At Knowles she was also a technical and design lead for consumer and hearing health microphone development programs in acoustic MEMS sensors. She has worked in the fields of surface mount fuse and suppressor design and manufacturability at Littelfuse, Inc and plastic composite design and manufacturability at Azbel, Hanwha.
Panel Discussion Topic: TBC
NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in high-performance mixed-signal electronics, NXP is driving innovation in the areas of connected cars, cyber security, portables & wearables, and the Internet of Things. NXP has operations in more than 30 countries, and posted revenue of $9.41 billion in 2018. Find out more about NXP at www.nxp.com/about