US ISES Advisory Board
Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, in Silicon Valley. It is the world’s largest and highest-valued semiconductor chip manufacturer on the basis of revenue, and is the developer of the x86 series of microprocessors, the processors found in most personal computers. Intel ranked No. 46 in the 2018 Fortune 500 list of the largest United States corporations by total revenue. Intel is incorporated in Delaware.