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Chiplets and System Integration – Key Concepts and Implementation

Jianmin Li photo

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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SiC – A Yin and Yang Perspective

Ralf Bornefeld photo

Ralf Bornefeld

SVP Power Semiconductors & Modules


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Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

Laurent Giai-Miniet photo

Laurent Giai-Miniet


ERS Electronic GmbH

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Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective

Dr. Rainer Kaesmaier photo

Dr. Rainer Kaesmaier

Managing Director, Global Product Group Semiconductors

Hitachi Energy Ltd.

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Fu Lu Shou – The Three Lucky Stars of Power

Mark Nils Münzer photo

Mark Nils Münzer

Distinguished Engineer Innovation & Emerging Technologies Automotive High Power

Infineon Technologies AG

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Heterogeneous Integration Enabled by Advanced Chiplet Packaging

Dr. Yang Cheng photo

Dr. Yang Cheng

Senior Director Design Service BU

JCET Group Co., Ltd.

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

Dr. Stefan Pieper

Global Application Manager

mks | Atotech

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How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges

Dr. Tong Wu photo

Dr. Tong Wu

Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications


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Advanced Packaging Materials and Evaluation Platform at Resonac

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Innovation in Power & Energy Management is Key to Support a Sustainable Future

Francesco Muggeri photo

Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, APeC/China


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Tailored Solutions for the Semiconductor Industry Powered by TRUMPF

Dariusz Czaja photo

Dariusz Czaja

Managing Director of TRUMPF Hüttinger Asia / General Manager of TRUMPF Hüttinger China

TRUMPF Huettinger Electronics (Taicang) Co., Ltd

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GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges

Jim Jian photo

Jim Jian

VP Sales APAC and NA

VisIC Technologies

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The Challenges in Getting a Reliable SiC Device

Dr. Hongchao Liu photo

Dr. Hongchao Liu 刘红超

Senior Vice President 高级副总裁

Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

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Memory and Processors for Chiplet Designs

Simone Bertolazzi, PhD. photo

Simone Bertolazzi, PhD.

Principal Technology & Market Analyst

Yole Intelligence

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Semiconductors and Sustainability – Why Going Green is Chip Driven

Julian Fieres photo

Julian Fieres

Vice President Transformation, Strategy, Sustainability & Digitalization

ZF Friedrichshafen AG

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