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System-level Packaging: Challenges and Solutions

Dr. JinYoung Khim photo

Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

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Piezoelectric MEMS Platform for Sensing and RF Applications

Dr. Yul Koh photo

Dr. Yul Koh

Senior Scientist

A*Star IME

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Silicon Photonics and its Challenges

Arjun Kumar Kantimahanti photo

Arjun Kumar Kantimahanti

R&D Engineer

Broadcom

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Zero Emission Becomes Real in Next-Generation Mobility

CS Chua photo

CS Chua

President & Managing Director

Infineon Technologies AG

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Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

Teng Chow Ooi photo

Teng Chow Ooi

Sr Director Program Office

Intel Corporation

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Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging

Herbert Oetzlinger photo

Herbert Oetzlinger

VP Business Development

Lam Research Corporation

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Future Opportunities: Semiconductors Packaging

Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

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MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia

Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

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More than Moore Emerging Technologies for the Sensing Needs in EV

Dr. Eloi Marigo Ferrer photo

Dr. Eloi Marigo Ferrer

Member of Technical Staff

SilTerra Malaysia Sdn. Bhd

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Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth

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YT Chin

Senior Director, Flash Backend Engineering

Western Digital

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Global Vehicle Electrification Trends and BEV Opportunities in the Developing World

Dr. Yik Yee Tan photo

Dr. Yik Yee Tan

Sr. Market and Technology Analyst

Yole Intelligence

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