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Accelerating MEMS Product Validation and Commercialization with IME ScAlN MEMS Platform

Angeline Tee photo

Angeline Tee

Deputy Director Business Development

A*Star IME

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Hybrid Bonding: Innovation to Adoption

Abul Nuruzzaman photo

Abul Nuruzzaman

VP, Technology and IP Licensing

Adeia

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A 360 View of Semiconductor Test from AI and Security Perspective

Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

Gayn Erickson photo

Gayn Erickson

President & CEO

Aehr Test Systems

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AI Computing on Edge Devices

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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NPU as the core of AI application: Market & Trends

Axel Bialke photo

Axel Bialke

SVP Asia

aiMotive

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Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

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Aziza Dada

Sector VP

Airspace

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Disruptions in Semiconductor Supply Chain

Michael Mo photo

Michael Mo

Partner and Managing Director

AlixPartners

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Advanced Packaging: Enabling Moore’s Law’s Next Frontier

Dr. Raja Swaminathan photo

Dr. Raja Swaminathan

CVP, Advanced Packaging

AMD

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Innovation to Enable More Compute From Each Transistor

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology

Deepak Kulkarni photo

Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

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HPC, AI, Chiplets, heterogeneous integration

Mark Fuselier photo

Mark Fuselier

SVP Technology & Product Engineering

AMD

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Generative AI Driven Advanced Packaging and Materials Innovation

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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AMEC Company Update and Offshore Manufacturing Plan

Pat Walsh photo

Pat Walsh

Managing Director NA/EU

AMEC

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Chiplets and System Integration – Key Concepts and Implementation

Jianmin Li photo

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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System-level Packaging: Challenges and Solutions

Dr. JinYoung Khim photo

Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

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New Challenges for MEMS and Sensor Packaging

Adrian Arcedera photo

Adrian Arcedera

SVP Memory, MEMS and Sensor Business Unit

Amkor Technology, Inc.

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An OSAT Perspective of the Power Semiconductor Market

Katsumi Furuse photo

Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Amkor Technology, Inc.

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RISC-V Accelerating ML Innovation and Beyond

Samuel Chiang photo

Samuel Chiang

Deputy Technical Director

Andes Technology

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Valuation of Artificial Intelligence for Semiconductor Equipment

Jon Hander photo

Jon Hander

AVP Panel Products

ASMPT Limited

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How Laser is Enabling The Power Semiconductor Roadmap

Jeroen van Borkulo photo

Jeroen van Borkulo

Head of Business & Marketing

ASMPT Limited

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Enabling the AI Era

Choon Khoon Lim photo

Choon Khoon Lim

Senior Vice President; Co-CEO, Semiconductor Solutions Segment

ASMPT Limited

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Co-Packaged Optics and Solutions for High Volume manufacturing

Dr. Johann Weinhändler photo

Dr. Johann Weinhändler

Managing Director

ASMPT Limited

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The LIVE 3D Digital Twin for the GCC

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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REALITY Twin vs. Digital Twin: Revolutionizing Industrial Remote Management

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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Piezoelectric MEMS Platform for Sensing and RF Applications

Dr. Yul Koh photo

Dr. Yul Koh

Senior Scientist

A*Star IME

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Transforming Industries at the Atomic Scale: The Power of Atomic Scale Advanced Manufacturing and the Advanced Innovation Ecosystems

Maksym Plakhotnyuk, Ph.D. photo

Maksym Plakhotnyuk, Ph.D.

Founder & CEO

ATLANT 3D

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Atomic-Layer Advanced Manufacturing

Maksym Plakhotnyuk, Ph.D. photo

Maksym Plakhotnyuk, Ph.D.

Founder & CEO

ATLANT 3D

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Next Generation Semiconductor Management

Dr. Karl Breidenbach photo

Dr. Karl Breidenbach

Associate Director, Global Lead Semiconductor Procurement

Boston Consulting Group

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BelGaN – Moving to The Next Chapter

Dr. Marnix Tack photo

Dr. Marnix Tack

CTO & VP Business Development

BelGaN

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Assembly Technologies for the Front End

Chris Scanlan photo

Chris Scanlan

SVP Technology

Besi

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SiC – A Yin and Yang Perspective

Ralf Bornefeld photo

Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch

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Crossbreeding of MEMS, CMOS, CSOI, Optics and Assembly

Dr. Stefan Majoni photo

Dr. Stefan Majoni

Director Foundry MEMS

Bosch

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Silicon Photonics and its Challenges

Arjun Kumar Kantimahanti photo

Arjun Kumar Kantimahanti

R&D Engineer

Broadcom

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ICeGaN: the Call of the GaN Revolution

Giorgia Longobardi photo

Dr. Giorgia Longobardi

Founder and CEO

Cambridge GaN Devices

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