Hybrid Bonding: Innovation to Adoption

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Abul Nuruzzaman

VP, Technology and IP Licensing

Adeia

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A 360 View of Semiconductor Test from AI and Security Perspective

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Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

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Gayn Erickson

President & CEO

Aehr Test Systems

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Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

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Aziza Dada

Sector VP

Airspace

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Advanced Packaging: Enabling Moore’s Law’s Next Frontier

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Dr. Raja Swaminathan

CVP, Advanced Packaging

AMD

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Innovation to Enable More Compute From Each Transistor

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Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Chiplets and System Integration – Key Concepts and Implementation

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Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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System-level Packaging: Challenges and Solutions

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Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

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Valuation of Artificial Intelligence for Semiconductor Equipment

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Jon Hander

AVP Panel Products

ASMPT

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How Laser is Enabling The Power Semiconductor Roadmap

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Jeroen van Borkulo

Head of Business & Marketing

ASMPT

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The LIVE 3D Digital Twin for the GCC

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CJ Hsieh

COO

ASPEED

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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

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CJ Hsieh

COO

ASPEED

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Piezoelectric MEMS Platform for Sensing and RF Applications

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Dr. Yul Koh

Senior Scientist

A*Star IME

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Transforming Industries at the Atomic Scale: The Power of Atomic Scale Advanced Manufacturing and the Advanced Innovation Ecosystems

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Maksym Plakhotnyuk, Ph.D.

Founder & CEO

ATLANT 3D

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Next Generation Semiconductor Management

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Dr. Karl Breidenbach

Associate Director, Global Lead Semiconductor Procurement

Boston Consulting Group

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BelGaN – Moving to The Next Chapter

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Dr. Marnix Tack

CTO & VP Business Development

BelGan

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SiC – A Yin and Yang Perspective

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Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch Sensortec

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Silicon Photonics and its Challenges

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Arjun Kumar Kantimahanti

R&D Engineer

Broadcom

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