Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

ISES Docs:

In today’s rapidly evolving technology landscape, the semiconductor industry is constantly pushing the boundaries of innovation to meet the demands of increasingly complex systems. With the popularity of Artificial Intelligence and high demand for new power management, the importance of thermal management cannot be overstated.

As semiconductor devices shrink in size and complexity increases, they generate higher power densities, resulting in elevated operating temperatures. This poses critical wafer testing challenges for manufacturers in terms of temperature accuracy and uniformity, as even minor thermal deviations can significantly impact the performance and reliability of these advanced chips.

This presentation will introduce ERS’s latest developments in wafer probing and advanced packaging; two critical areas that are geared towards maximizing yield and guaranteeing performance.

Laurent Giai-Miniet photo

Laurent Giai-Miniet

CEO

ERS Electronic GmbH

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